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DSPIC30F4012-20I/ML

Microchip Technology

DSPIC30F4012-20I/ML by Microchip Technology

DSPIC30F4012-20I/ML by Microchip is a 16-bit DSP with max clock freq of 40 MHz, operating temp range -40 to 85 °C. It's used as a digital signal processor and controller in industrial applications due to its FLASH ROM programmability and CMOS technology. Package style is chip carrier with very thin profile, suitable for surface mount assembly.

Median Price

$6.745

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$6.745

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650

$6.745

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Vyrian

USA . 6,031 parts In-Stock

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6,031

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 728 parts In-Stock

1+ parts

$6.410

100+ parts

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$6.282

728

$6.410

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$6.282

Corohmni

South Africa . 73 parts In-Stock

1+ parts

$6.410

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73

$6.410

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Netroflash

USA . 500 parts In-Stock

1+ parts

$6.745

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$6.610

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500

$6.745

$6.610

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AZTECH Wire

Italy . 809 parts In-Stock

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$12.927

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809

$12.927

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Semicontronic

India . 839 parts In-Stock

1+ parts

$33.000

100+ parts

$32.175

1k+ parts

$32.010

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839

$33.000

$32.175

$32.010

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Aztec Data Supply Inc.

USA . 2,391 parts In-Stock

1+ parts

$44.760

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2,391

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Lixinc

USA . 9,016 parts In-Stock

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West Coast Incorporated

USA . 3,609 parts In-Stock

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Argo Parts USA

USA . 3,328 parts In-Stock

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Overview

Unlock the power of digital signal processing with the DSPIC30F4012-20I/ML by Microchip Technology. This cutting-edge DSP offers unmatched quality and reliability, backed by the reputable manufacturer. Ideal for a variety of applications in industries like automotive, industrial control, and telecommunications, this DSP delivers exceptional value with its 16-bit architecture, high clock frequency, and flash ROM programmability. Experience superior performance, efficiency, and precision with the DSPIC30F4012-20I/ML - your ultimate solution for all your digital signal processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides durability and protection for the internal components of the DSP, ensuring reliable performance in various operating conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration of the DSP into circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 5.5 V

Ability to handle a maximum supply voltage of 5.5 V makes this DSP versatile and compatible with different power supply configurations.

Package Shape: SQUARE

Square package shape provides a compact form factor, making it suitable for applications where space is limited.

Bit Size: 16

16-bit processing capability allows for efficient handling of complex digital signal processing tasks with high precision.

Power Supplies (V): 3/5

Support for both 3 V and 5 V power supplies enhances flexibility in system design and compatibility with various voltage requirements.

No. of Terminals: 44

44 terminals provide ample connectivity options for interfacing with external components and peripherals, enabling versatile system integration.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Various package styles offer thermal management options and compatibility with different circuit board layouts, catering to specific application needs.

Minimum Supply Voltage: 4.5 V

Reliable operation at a minimum supply voltage of 4.5 V ensures consistent performance even under low power conditions.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C allows for reliable operation in demanding industrial environments with high temperature requirements.

Minimum Operating Temperature: -40 °C

Wide operating temperature range down to -40°C ensures performance in extreme temperature conditions without risking functionality.

Terminal Finish: Matte Tin (Sn)

Matte tin terminal finish offers good solderability and long-term reliability, facilitating smooth and durable connections during assembly.

Terminal Position: QUAD

Quad terminal position provides stable and secure electrical connections, minimizing the risk of signal interference and ensuring reliable data transmission.

Maximum Seated Height: 1 mm

Low maximum seated height of 1 mm allows for slim and compact device designs, ideal for space-constrained applications.

Width: 8 mm

Moderate width dimension of 8 mm strikes a balance between compactness and ease of handling during assembly and installation processes.

Maximum Clock Frequency: 40 MHz

High maximum clock frequency of 40 MHz enables fast processing speeds for digital signal processing operations, improving overall system performance.

Maximum Time At Peak Reflow Temperature (s): 40

Ability to withstand peak reflow temperatures for up to 40 seconds enhances durability and reliability during soldering and rework processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance of 260°C ensures robust soldering connections and thermal stability in manufacturing environments.

Length: 8 mm

Compact length dimension of 8 mm complements the square package shape, contributing to a space-efficient overall design for the DSP.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating confirms reliable operation in harsh industrial environments with temperature fluctuations and challenging conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Combination of digital signal processor and controller functionality enhances versatility and performance capabilities for a wide range of signal processing applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with various system configurations, making the DSP energy-efficient and versatile.

Terminal Form: NO LEAD

Lead-free terminal form aligns with environmental regulations and industry standards, ensuring eco-friendly and compliant manufacturing practices.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage of 5 V supports consistent and reliable operation, providing a standard power source for the DSP in most applications.

ROM Programmability: FLASH

Flash ROM programmability allows for flexible software updates and customizable configurations, facilitating adaptive and scalable operation for different use cases.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65 mm enables high-density mounting and close spacing between terminals, promoting compact system designs and efficient PCB layouts.

Format: FIXED POINT

Fixed-point format simplifies signal processing algorithms and calculations, offering a balance between precision and computational efficiency for signal processing tasks.

On Chip Program ROM Width: 24

Wide on-chip program ROM width of 24 bits allows for storing and executing complex algorithms and instructions, enhancing processing capabilities and functionality.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC30F4012-20I/ML attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 2.5V MINIMUM SUPPLY AT 7.5 MHZ

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

S-PQCC-N44

JESD-609 Code:

e3

Length:

8 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

44

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC44,.31SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

8 mm

Trade Compliance

DSPIC30F4012-20I/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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