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DSPIC33EP512GM710-E/PTVAO

Microchip Technology

DSPIC33EP512GM710-E/PTVAO by Microchip Technology

DSPIC33EP512GM710-E/PTVAO by Microchip Technology is a 16-bit digital signal processor (DSP) with a max clock frequency of 60 MHz. It is designed for automotive applications and has a temperature range of -40 to 125°C. With its compact size and high performance, it is suitable for various control and signal processing tasks in automotive systems.

Median Price

$10.910

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 19 parts In-Stock

1+ parts

$10.910

100+ parts

$9.050

1k+ parts

$8.330

10k+ parts

$7.920

19

$10.910

$9.050

$8.330

$7.920

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,172 parts In-Stock

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-

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4,172

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Nova Conductors

Japan . 700 parts In-Stock

1+ parts

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700

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SIE Connect GmbH - GreenChips

Germany . 108 parts In-Stock

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108

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Greenchips

USA . 108 parts In-Stock

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108

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 63 parts In-Stock

1+ parts

$9.270

100+ parts

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63

$9.270

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AZTECH Wire

Italy . 441 parts In-Stock

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$11.960

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441

$11.960

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Semicontronic

India . 145 parts In-Stock

1+ parts

$20.180

100+ parts

$19.676

1k+ parts

$19.575

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-

145

$20.180

$19.676

$19.575

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Aztec Data Supply Inc.

USA . 4,134 parts In-Stock

1+ parts

$36.360

100+ parts

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4,134

$36.360

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Corohmni

South Africa . 610 parts In-Stock

1+ parts

$70.746

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610

$70.746

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Infinite Electronics LLP (Excess)

. 75,446 parts In-Stock

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75,446

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Continental Prestige Electronics

USA . 6,774 parts In-Stock

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6,774

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Component Connect

USA . 4,284 parts In-Stock

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4,284

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RGB Technical Solutions

Ukraine . 3,720 parts In-Stock

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3,720

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Argo Parts USA

USA . 3,501 parts In-Stock

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3,501

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Overview

Experience the power of Microchip Technology with the DSPIC33EP512GM710-E/PTVAO. As a leading manufacturer in the industry, Microchip Technology brings you cutting-edge Digital Signal Processors (DSPs) that are designed to deliver exceptional performance and reliability. This product offers an array of benefits, including its high-quality manufacturing materials, surface mount capability, and automotive-grade temperature grade. With a maximum clock frequency of 60 MHz and ROM programmability, this DSP is perfect for a range of applications, from automotive systems to industrial automation. Trust Microchip Technology to provide you with the value, advantages, and superiority you need for your next project. Discover the endless possibilities with the DSPIC33EP512GM710-E/PTVAO.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components due to its low cost and good electrical insulation properties.

Surface Mount: YES

Surface mount technology allows for a more compact design and easier automated assembly process.

Maximum Supply Voltage: 3.6 V

Supports a wide range of applications without risking damage due to voltage spikes.

Screening Level: AEC-Q100; TS 16949

High automotive industry standards ensure reliability and quality for automotive applications.

Minimum Supply Voltage: 3 V

Operates effectively at low power supply voltages, saving energy and reducing heat dissipation.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, suitable for automotive and industrial environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-powered devices.

Nominal Supply Voltage: 3.3 V

Standard voltage level that is widely supported by power supply components, making integration easier.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming of the device, enabling firmware updates and customization.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP512GM710-E/PTVAO attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Additional Features:

60 MIPS, ADC ALSO SUPPORTS 10-BIT RESOLUTION, AEC-Q100 PLANNED

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

12 mm

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.55SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

12 mm

Trade Compliance

DSPIC33EP512GM710-E/PTVAO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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