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DSPIC33EV256GM106-E/MR

Microchip Technology

DSPIC33EV256GM106-E/MR by Microchip Technology

DSPIC33EV256GM106-E/MR by Microchip Technology is a 16-bit DSP with 262144 ROM words and 16384 RAM words. It features 36-Ch 12-Bit ADC channels, 7 timers, and CAN, I2C, SPI connectivity. Ideal for automotive applications due to AEC-Q100 screening and -40 to 125 °C operating temperature range.

Median Price

$6.320

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 1,160 parts In-Stock

1+ parts

$6.320

100+ parts

$5.250

1k+ parts

$4.840

10k+ parts

$4.600

1,160

$6.320

$5.250

$4.840

$4.600

EBV Elektronik

Germany . 40 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

40

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 20 parts In-Stock

1+ parts

$5.660

100+ parts

-

1k+ parts

-

10k+ parts

-

20

$5.660

-

-

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Vyrian

USA . 3,943 parts In-Stock

1+ parts

-

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-

1k+ parts

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3,943

-

-

-

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NAC Semi

USA . 40 parts In-Stock

1+ parts

-

100+ parts

$29.510

1k+ parts

-

10k+ parts

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40

-

$29.510

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 320 parts In-Stock

1+ parts

$5.370

100+ parts

$5.236

1k+ parts

$5.209

10k+ parts

-

320

$5.370

$5.236

$5.209

-

Ampacity Inc.

Singapore . 259 parts In-Stock

1+ parts

$5.370

100+ parts

-

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259

$5.370

-

-

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$5.547

100+ parts

-

1k+ parts

$5.325

10k+ parts

-

1,000

$5.547

-

$5.325

-

Continental Prestige Electronics

USA . 6,654 parts In-Stock

1+ parts

$5.660

100+ parts

-

1k+ parts

-

10k+ parts

$5.547

6,654

$5.660

-

-

$5.547

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$6.566

100+ parts

$6.040

1k+ parts

$5.660

10k+ parts

-

1,000

$6.566

$6.040

$5.660

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AZTECH Wire

Italy . 294 parts In-Stock

1+ parts

$9.733

100+ parts

-

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10k+ parts

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294

$9.733

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-

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Aztec Data Supply Inc.

USA . 3,169 parts In-Stock

1+ parts

$19.920

100+ parts

-

1k+ parts

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3,169

$19.920

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Corohmni

South Africa . 117 parts In-Stock

1+ parts

$76.774

100+ parts

-

1k+ parts

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117

$76.774

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RGB Technical Solutions

Ukraine . 6,019 parts In-Stock

1+ parts

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100+ parts

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6,019

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Argo Parts USA

USA . 10 parts In-Stock

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10

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Overview

Unlock the power of advanced digital signal processing with the DSPIC33EV256GM106-E/MR by Microchip Technology. This cutting-edge product offers unparalleled quality and reliability, backed by Microchip's reputation as a trusted manufacturer. Ideal for a wide range of applications in the digital signal processor category, this product delivers exceptional value and benefits to customers. Experience seamless connectivity, low power mode, and a variety of peripherals designed to enhance your projects. Upgrade to the DSPIC33EV256GM106-E/MR and revolutionize your digital signal processing capabilities today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product well-suited for various applications without adding unnecessary weight or cost.

Maximum Supply Voltage: 5.5 V

Allows for a wide range of voltage inputs, increasing versatility and compatibility with different power sources.

Bit Size: 16

With a 16-bit architecture, this DSP can handle complex algorithms and processing tasks efficiently, making it suitable for demanding applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures that the product can perform reliably even in harsh environmental conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Combining DSP and controller functionalities in one chip enhances the product's versatility and ability to handle a wide range of processing tasks.

Connectivity: CAN, I2C, IRDA, LIN, SENT(2), SMBUS, SPI(2), UART(2)

The multiple connectivity options enable seamless integration with various systems and devices, making it a flexible solution for diverse applications.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EV256GM106-E/MR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

NO

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of I/O Lines:

53

No. of Terminals:

64

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1 mm

Speed:

40 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

350 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Data EEPROM Size:

0

Connectivity:

CAN, I2C, IRDA, LIN, SENT(2), SMBUS, SPI(2), UART(2)

Peripherals:

BOR, COMPARATOR(5), DMA(4), POR, PWM(6), TIMER(7), WDT

Analog To Digital Convertors:

36-Ch 12-Bit

Trade Compliance

DSPIC33EV256GM106-E/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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