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DSPIC33EP256MC502-I/SS

Microchip Technology

DSPIC33EP256MC502-I/SS by Microchip Technology

DSPIC33EP256MC502-I/SS by Microchip Technology is a 16-bit DSP with 3.3V supply, 60MHz clock speed, and 32768 RAM bytes. Ideal for industrial applications, it features CAN, I2C, SPI connectivity and low power mode for efficient operation at -40 to 85°C temperatures.

Median Price

$4.480

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 465 parts In-Stock

1+ parts

$4.480

100+ parts

$3.730

1k+ parts

$3.430

10k+ parts

$3.260

465

$4.480

$3.730

$3.430

$3.260

Mouser Electronics

USA . 205 parts In-Stock

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$4.480

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$4.480

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DigiKey

USA . 87 parts In-Stock

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$4.480

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$3.730

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$3.730

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Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

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$4.050

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100

$4.050

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NAC Semi

USA . 517 parts In-Stock

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$4.660

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$4.230

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$3.870

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517

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$3.870

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Vyrian

USA . 10,080 parts In-Stock

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Semtec, LLC

USA . 567 parts In-Stock

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SIE Connect GmbH - GreenChips

Germany . 423 parts In-Stock

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Greenchips

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Distributors (Availability)

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Ampacity Inc.

Singapore . 213 parts In-Stock

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$3.810

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Semicontronic

India . 50 parts In-Stock

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$3.810

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$3.715

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$3.696

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50

$3.810

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$3.696

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Corohmni

South Africa . 656 parts In-Stock

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$3.965

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Aranea Global

USA . 100 parts In-Stock

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$3.969

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$3.810

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Continental Prestige Electronics

USA . 4,108 parts In-Stock

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$4.050

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$3.969

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Argo Parts USA

USA . 1,141 parts In-Stock

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AZTECH Wire

Italy . 255 parts In-Stock

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$9.684

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Aztec Data Supply Inc.

USA . 143 parts In-Stock

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$80.230

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Fulton Briggs Corp.

USA . 7,754 parts In-Stock

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Lixinc

USA . 3,525 parts In-Stock

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Overview

Elevate your digital signal processing capabilities with the DSPIC33EP256MC502-I/SS by Microchip Technology. Designed with precision and reliability in mind, this product offers unparalleled performance in a variety of applications. With advanced features such as multiple peripherals, low power mode, and high-speed connectivity options, this digital signal processor is a game-changer for industrial-grade projects. Experience seamless operation and efficiency with this innovative technology that promises to deliver exceptional value and benefits to customers seeking top-tier performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and helps protect the internal components of the DSP.

Maximum Supply Voltage: 3.6 V

Allows for a higher supply voltage, providing flexibility in power input options.

No. of Terminals: 28

Provides ample connectivity options for external peripherals and interfaces.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP efficient.

Connectivity: CAN, I2C(2), IRDA, LIN, SPI(2), UART(2)

Support for various communication protocols allows for versatile connectivity with other devices.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP256MC502-I/SS attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

10.2 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of I/O Lines:

21

No. of Terminals:

28

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

32768

RAM Words:

32768

ROM Words:

87381

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

2 mm

Speed:

70 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5.3 mm

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), IRDA, LIN, SPI(2), UART(2)

Peripherals:

BOD, COMPARATOR(3), DMA(4), POR, PWM(4), RTCC, TIMER(5), WDT

Analog To Digital Convertors:

6-Ch 12-Bit

Trade Compliance

DSPIC33EP256MC502-I/SS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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