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TMS320VC5509AGHH

Texas Instruments

TMS320VC5509AGHH by Texas Instruments

TMS320VC5509AGHH by Texas Instruments is a DSP with 128K RAM, 50 MHz clock frequency, and 16-bit data bus width. Ideal for industrial applications requiring low power consumption and fixed-point format processing.

Median Price

$15.160

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3 parts In-Stock

1+ parts

$15.160

100+ parts

$14.250

1k+ parts

$12.880

10k+ parts

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3

$15.160

$14.250

$12.880

-

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Digiode

USA . 1,406 parts In-Stock

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$14.402

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$14.402

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Vyrian

USA . 7,891 parts In-Stock

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7,891

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Nova Conductors

Japan . 50 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 11 parts In-Stock

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North Shore Components

USA . 10 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 8 parts In-Stock

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Elcom Components

USA . 1 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 3 parts In-Stock

1+ parts

$12.890

100+ parts

-

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3

$12.890

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Semicontronic

India . 3 parts In-Stock

1+ parts

$12.890

100+ parts

$12.568

1k+ parts

$12.503

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3

$12.890

$12.568

$12.503

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Corphita

USA . 445 parts In-Stock

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$13.644

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445

$13.644

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AZTECH Wire

Italy . 565 parts In-Stock

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$16.575

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$16.575

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$20.842

100+ parts

$19.800

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$19.800

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3,000

$20.842

$19.800

$19.800

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Corohmni

South Africa . 865 parts In-Stock

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$39.299

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$39.299

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Parana Technologies

USA . 1,963 parts In-Stock

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$64.015

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$64.015

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ChromeModa Solutions

Germany . 6,170 parts In-Stock

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$71.927

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$58.980

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$71.927

$58.980

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IDEA Electronic Components Group

UK . 818 parts In-Stock

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$71.927

100+ parts

$68.331

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$64.734

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818

$71.927

$68.331

$64.734

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Lixinc

USA . 14,588 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 14,187 parts In-Stock

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GreenTree Electronics

Israel . 12,320 parts In-Stock

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Metaverse IC Inc.

Canada . 8,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,894 parts In-Stock

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Authorized Procurement Solutions

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Argo Parts USA

USA . 3,542 parts In-Stock

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DigiPath Technology Company

USA . 1,779 parts In-Stock

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$64.849

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Perfect Parts

USA . 1,336 parts In-Stock

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Continental Prestige Electronics

USA . 988 parts In-Stock

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Microchip USA

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Bastille Electronics

Australia . 10 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 10 parts In-Stock

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Overview

Unlock the power of digital signal processing with the TMS320VC5509AGHH by Texas Instruments. Known for their high-quality products, Texas Instruments delivers cutting-edge technology in the form of this DSP, perfect for a wide range of applications. Whether you're working on audio processing, telecommunications, or industrial automation, this DSP offers unmatched performance and reliability. With low power consumption and advanced features, the TMS320VC5509AGHH provides exceptional value and benefits to customers looking to elevate their projects to the next level. Choose Texas Instruments for top-of-the-line DSP solutions that deliver results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the internal components of the DSP.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the DSP onto circuit boards.

Maximum Supply Voltage: 1.65 V

Low maximum supply voltage helps in reducing power consumption and improving overall energy efficiency.

On Chip Data RAM Width: 16

Having a wide on-chip data RAM width allows for faster data processing and storage capabilities.

Address Bus Width: 21

A wider address bus width enables the DSP to access larger memory spaces and handle more complex algorithms.

Package Shape: SQUARE

Square package shape offers more efficient use of space on circuit boards and enables easier integration into various systems.

Power Supplies: 1.6,3.3 V

Support for multiple power supply options provides flexibility in designing and optimizing power consumption for different applications.

No. of Terminals: 179

Having a higher number of terminals allows for more connections and interfaces, enabling versatility in system integration.

Minimum Supply Voltage: 1.55 V

Low minimum supply voltage ensures stable operation even in low-power scenarios and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range allows for reliable performance in industrial and harsh environments.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures the DSP can operate in extreme cold conditions without compromising performance.

Terminal Finish: TIN LEAD

Tin lead terminal finish offers good solderability and reliability during assembly and rework processes.

Terminal Position: BOTTOM

Bottom terminal position makes it easier to mount the DSP onto circuit boards and reduces signal interference.

Maximum Seated Height: 1.4 mm

Low seated height allows for a compact design and facilitates efficient airflow and heat dissipation.

RAM Words: 128K

Having a large RAM capacity enables the DSP to process and store a significant amount of data for complex algorithms.

Width: 12 mm

Compact width size makes the DSP suitable for space-constrained applications and allows for easy integration into various systems.

Boundary Scan: YES

Boundary scan feature enables easy testing and debugging of the DSP during manufacturing and maintenance processes.

External Data Bus Width: 16

Wide external data bus width allows for fast data transfer between external components and the DSP for real-time processing.

Maximum Clock Frequency: 50 MHz

High clock frequency enables fast processing speeds and real-time data handling for time-sensitive applications.

Maximum Time At Peak Reflow Temperature (s): 20

Short reflow time at peak temperature ensures reliable solder joints and prevents damage to the DSP during assembly.

Peak Reflow Temperature °C: 220

High peak reflow temperature enables efficient soldering processes and ensures good solder joint quality.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture allows for efficient data flow and parallel processing capabilities, improving overall performance.

Length: 12 mm

Compact length size makes the DSP suitable for compact designs and space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions commonly found in industrial settings.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type allows for a wide range of applications and integration with various external components.

No. of Timers: 2

Having multiple timers enables precise timing control and synchronization in time-critical applications.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of applications.

Terminal Form: BALL

Ball terminal form offers good electrical performance, reliable solder joints, and convenient assembly onto circuit boards.

Nominal Supply Voltage: 1.6 V

Stable nominal supply voltage ensures consistent performance and power efficiency in various operating conditions.

ROM Programmability: FLASH

Flash ROM programmability allows for flexible firmware updates and customization of algorithms without the need for external memory.

Terminal Pitch: 0.8 mm

Narrow terminal pitch enables high-density mounting and efficient use of space on circuit boards.

Format: FIXED POINT

Fixed-point format allows for efficient arithmetic operations and improved processing speed in DSP applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, suitable for standard manufacturing and handling procedures.

Low Power Mode: YES

Low power mode option allows for energy-efficient operation and extends battery life in portable and battery-powered devices.

On Chip Program ROM Width: 16

Having a wide on-chip program ROM width allows for storing program instructions and firmware updates within the DSP.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5509AGHH attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1.2V AND 1.35V SUPPLY

Address Bus Width:

21

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B179

JESD-609 Code:

e0

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

179

No. of Timers:

2

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA179,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.6,3.3

Qualification:

Not Qualified

RAM Words:

128K

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.55 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5509AGHH Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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