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DSPIC33CK128MP202-H/2N

Microchip Technology

DSPIC33CK128MP202-H/2N by Microchip Technology

DSPIC33CK128MP202-H/2N by Microchip Technology is a 16-bit digital signal processor with 64 MHz clock frequency, 3.6 V supply voltage, and AEC-Q100 screening for automotive applications. It features 16384 RAM words, FLASH ROM programmability, and low power mode for efficient processing in compact designs. With 4 DMA channels and 4 serial I/Os, it offers versatile control capabilities in a small form factor chip carrier package.

Median Price

$3.420

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 68 parts In-Stock

1+ parts

$3.420

100+ parts

-

1k+ parts

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68

$3.420

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Vyrian

USA . 603 parts In-Stock

1+ parts

-

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-

1k+ parts

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603

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 4,806 parts In-Stock

1+ parts

$3.420

100+ parts

-

1k+ parts

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4,806

$3.420

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$3.420

100+ parts

-

1k+ parts

$3.249

10k+ parts

$3.181

2,000

$3.420

-

$3.249

$3.181

Continental Prestige Electronics

USA . 1,113 parts In-Stock

1+ parts

$3.420

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-

1k+ parts

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10k+ parts

$3.352

1,113

$3.420

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-

$3.352

Ampacity Inc.

Singapore . 242 parts In-Stock

1+ parts

$17.000

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242

$17.000

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AZTECH Wire

Italy . 194 parts In-Stock

1+ parts

$19.851

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194

$19.851

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Aztec Data Supply Inc.

USA . 2,075 parts In-Stock

1+ parts

$40.710

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2,075

$40.710

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Corohmni

South Africa . 49 parts In-Stock

1+ parts

$65.520

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49

$65.520

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Fulton Briggs Corp.

USA . 5,093 parts In-Stock

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5,093

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Overview

Experience unparalleled performance and reliability with the Microchip Technology DSPIC33CK128MP202-H/2N Digital Signal Processor. Known for their top-notch quality, Microchip Technology has once again delivered a cutting-edge product that exceeds industry standards. Ideal for automotive applications, this DSP offers customers unparalleled value with its high-speed processing capabilities, low power mode, and versatile peripheral IC type. Trust in Microchip Technology to provide you with the tools you need to succeed in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the DSP, making it suitable for various applications.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options, ensuring reliable operation.

Bit Size: 16

The 16-bit architecture allows for efficient processing of data, making the DSP suitable for complex signal processing tasks.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature ensures that the DSP can function reliably even in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

This combination allows the DSP to not only process signals efficiently but also control external devices, expanding its versatility.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33CK128MP202-H/2N attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

64 MHz

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-N28

Length:

6 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Serial I/Os:

4

No. of Terminals:

28

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.24SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Words:

16384

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

.55 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Trade Compliance

DSPIC33CK128MP202-H/2N Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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