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TMS320F2812GHHAR

Texas Instruments

TMS320F2812GHHAR by Texas Instruments

TMS320F2812GHHAR by Texas Instruments is a 32-bit DSP with 150 MHz clock frequency, 18432 RAM words, and 16-bit data bus width. Ideal for industrial applications requiring high-speed signal processing, it features low power mode, multiple internal bus architecture, and 8 timers for versatile functionality.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,268 parts In-Stock

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Digiode

USA . 3,309 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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One Stop Electronics

USA . 1,019 parts In-Stock

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$8.000

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1,019

$8.000

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Ampacity Inc.

Singapore . 1,644 parts In-Stock

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$15.000

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$15.000

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Semicontronic

India . 261 parts In-Stock

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$16.000

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$15.600

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$15.520

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261

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$15.520

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AZTECH Wire

Italy . 337 parts In-Stock

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$17.246

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337

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Aztec Data Supply Inc.

USA . 3,259 parts In-Stock

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$34.880

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Parana Technologies

USA . 1,475 parts In-Stock

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$50.542

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IDEA Electronic Components Group

UK . 433 parts In-Stock

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$56.789

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$53.950

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$51.110

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433

$56.789

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$51.110

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ChromeModa Solutions

Germany . 301 parts In-Stock

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$56.789

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$46.567

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301

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Corohmni

South Africa . 505 parts In-Stock

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$85.973

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505

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Continental Prestige Electronics

USA . 6,079 parts In-Stock

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Microchip USA

USA . 4,948 parts In-Stock

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Argo Parts USA

USA . 2,166 parts In-Stock

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DigiPath Technology Company

USA . 1,434 parts In-Stock

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Corphita

USA . 755 parts In-Stock

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Bastille Electronics

Australia . 15 parts In-Stock

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Overview

Discover the power and precision of the Texas Instruments TMS320F2812GHHAR Digital Signal Processor. With a legacy of quality and innovation, Texas Instruments has crafted a product that exceeds expectations in a variety of applications. This DSP offers customers unparalleled value with its high performance capabilities, efficient power usage, and advanced features. Whether you're designing automotive systems, industrial controls, or digital power conversion, the TMS320F2812GHHAR delivers the reliability and performance you need to bring your projects to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, making the product easy to handle and resistant to damage.

Maximum Supply Voltage: 2 V

Allows for a wide range of compatible power sources, increasing flexibility in usage.

Bit Size: 32

High-bit size allows for complex calculations and processing capabilities, suitable for advanced digital signal processing tasks.

Maximum Clock Frequency: 150 MHz

High clock frequency ensures quick and efficient processing of incoming signals, reducing latency.

Technology: CMOS

CMOS technology provides low power consumption, making the product energy-efficient and cost-effective.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F2812GHHAR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1.8 SUPPLY AT 135MHZ

Address Bus Width:

19

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

150 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B179

JESD-609 Code:

e0

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

3

No. of Terminals:

179

No. of Timers:

8

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA179,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

36864

RAM Words:

18432

ROM Programmability:

OTPROM

Screening Level:

AEC-Q100

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

230 mA

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.81 V

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320F2812GHHAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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