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MC56F8346VFVER2

NXP Semiconductors

MC56F8346VFVER2 by NXP Semiconductors

MC56F8346VFVER2 by NXP Semiconductors is a 16-bit DSP with max clock freq of 120MHz. Ideal for industrial applications, it features ROM size of 64KB, RAM of 8KB, and operates at temp range -40 to +105°C. With low power mode and barrel shifter, it's suitable for high-speed processing tasks.

Median Price

$30.335

Lifecycle Status

EOL

Suppliers In-Stock

8

In-Stock Inventory

1k+

MC56F8346VFVER2 by NXP Semiconductors
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Flip Electronics (Authorized)

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Nova Conductors

Japan . 150 parts In-Stock

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Chip Stock

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Anansix

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One Stop Electronics

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AZTECH Wire

Italy . 193 parts In-Stock

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Vigor

Singapore . 7,011 parts In-Stock

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Ampacity Inc.

Singapore . 71 parts In-Stock

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Continental Prestige Electronics

USA . 4,784 parts In-Stock

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Netroflash

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Corohmni

South Africa . 5,034 parts In-Stock

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Microchip USA

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Argo Parts USA

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Overview

Unlock the full potential of your digital signal processing projects with the MC56F8346VFVER2 by NXP Semiconductors. This high-quality DSP offers unparalleled performance and reliability, thanks to its cutting-edge technology and superior manufacturing standards. Ideal for a wide range of applications, this DSP provides customers with unmatched value, benefits, and advantages. Experience seamless operation and enhanced efficiency with the MC56F8346VFVER2 - the perfect solution for all your DSP needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable housing for the DSP, making it suitable for a variety of applications.

Maximum Supply Voltage: 2.75 V

Allows for a stable and reliable power supply to the DSP, ensuring optimal performance.

Address Bus Width: 16

Provides a wide address bus width for efficient data handling and processing capabilities.

Bit Size: 16

Offers a 16-bit architecture for processing data with precision and accuracy.

No. of Terminals: 144

Features a high number of terminals for versatile connectivity options and integration with other components.

CPU Family: 56800E

Part of the 56800E CPU family known for its advanced features and performance capabilities.

ROM Words: 65536

Provides a large ROM capacity for storing program instructions and data efficiently.

RAM Bytes: 8192

Offers a substantial RAM capacity for temporary data storage and fast access to information.

Technology: CMOS

Utilizes CMOS technology for low power consumption and efficient operation.

Speed: 60 rpm

Operates at a high speed of 60 rpm for processing data quickly and efficiently.

Technical Specifications

Digital Signal Processors (DSPs) MC56F8346VFVER2 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from NXP Semiconductors

Specs

Address Bus Width:

16

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

CPU Family:

56800E

Maximum Clock Frequency:

120 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

144

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Trade Compliance

MC56F8346VFVER2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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