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MC56F8367MPYE

NXP Semiconductors

MC56F8367MPYE by NXP Semiconductors

MC56F8367MPYE by NXP Semiconductors is a 16-bit DSP with 120 MHz clock frequency, 24-bit address bus width, and 36864 bytes of RAM. Ideal for automotive applications due to its low power mode, FLASH ROM programmability, and barrel shifter feature.

Median Price

$90.649

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 7 parts In-Stock

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$90.558

100+ parts

$67.235

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$90.558

$67.235

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Mouser Electronics

USA . 56 parts In-Stock

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$90.740

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$67.370

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$67.370

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EBV Elektronik

Germany . 200 parts In-Stock

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200

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Verical

USA . 160 parts In-Stock

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$96.403

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160

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$96.403

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Rochester

USA . 4 parts In-Stock

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$54.540

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$48.800

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$45.930

4

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$54.540

$48.800

$45.930

Distributors (In-Stock)

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Digiode

USA . 4,940 parts In-Stock

1+ parts

$48.640

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$48.640

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Nova Conductors

Japan . 150 parts In-Stock

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$60.350

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$60.350

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Vyrian

USA . 7,249 parts In-Stock

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7,249

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Anansix

USA . 2,408 parts In-Stock

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TME

Poland . 160 parts In-Stock

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$58.680

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$58.680

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Chip Stock

USA . 140 parts In-Stock

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AZTECH Wire

Italy . 651 parts In-Stock

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$5.556

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$5.556

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Vigor

Singapore . 2,373 parts In-Stock

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$38.710

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$38.710

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Ampacity Inc.

Singapore . 120 parts In-Stock

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$42.340

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$42.340

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Semicontronic

India . 143 parts In-Stock

1+ parts

$42.770

100+ parts

$41.701

1k+ parts

$41.487

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143

$42.770

$41.701

$41.487

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Corphita

USA . 2,477 parts In-Stock

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$46.080

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Aztec Data Supply Inc.

USA . 450 parts In-Stock

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$59.150

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$59.150

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$59.706

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$59.706

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$59.706

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$59.706

$59.706

$59.706

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Continental Prestige Electronics

USA . 5,317 parts In-Stock

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$60.350

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$59.143

5,317

$60.350

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$59.143

Modulus Dynamics

Lithuania . 4,204 parts In-Stock

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$60.353

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$60.353

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$60.353

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$60.353

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Corohmni

South Africa . 402 parts In-Stock

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$60.353

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$60.353

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Microchip USA

USA . 1,107 parts In-Stock

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$122.924

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UNI Independent Distributors

Spain . 7,328 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$59.143

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$57.332

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$56.125

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$59.143

$57.332

$56.125

Robosynatics

Brazil . 1,288 parts In-Stock

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Lucentia Tech

USA . 1,288 parts In-Stock

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$59.146

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$57.939

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$57.939

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$57.939

$57.939

Argo Parts USA

USA . 1,153 parts In-Stock

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Kepictronics

USA . 38 parts In-Stock

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Overview

Discover the MC56F8367MPYE from NXP Semiconductors, a powerful Digital Signal Processor designed to elevate your projects to new heights. With cutting-edge technology and reliable manufacturing, NXP Semiconductors ensures top-of-the-line quality in every product. Ideal for a wide range of applications, this DSP offers unparalleled value, efficiency, and performance. Whether you're working on automotive systems, audio processing, or industrial control, the MC56F8367MPYE delivers exceptional results that will exceed your expectations. Elevate your designs with NXP Semiconductors today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product easy to handle and affordable.

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB layout, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 2.75 V

The low maximum supply voltage helps in reducing power consumption and heat generation, improving overall efficiency.

Address Bus Width: 24

A wider address bus allows for a larger memory address space, enabling processing of complex algorithms and data sets.

Package Shape: SQUARE

The square package shape facilitates easier handling and mounting on the PCB, ensuring a secure fit.

Bit Size: 16

A 16-bit processor can handle data in larger chunks, leading to faster processing and improved performance.

Power Supplies (V): 2.5,3.3

Having multiple power supply options allows flexibility in design and compatibility with different voltage standards.

No. of Terminals: 160

More terminals provide ample connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The combination of flatpack, low profile, and fine pitch package styles ensures space-saving and compatibility with modern PCB designs.

Minimum Supply Voltage: 2.25 V

A low minimum supply voltage allows for operation in low-power scenarios, extending battery life in portable devices.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability in harsh environments without affecting performance.

CPU Family: 56800E

Part of the efficient and reliable 56800E CPU family, offering advanced features and performance for signal processing applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range enables the processor to function in extreme cold conditions without any issues.

Terminal Finish: TIN

Tin terminal finish provides good solderability and conductivity, ensuring reliable connections for proper functioning.

Terminal Position: QUAD

Quad terminal position allows for better thermal dissipation and mechanical stability during operation.

ROM Words: 524288

Large ROM capacity enables storage of complex algorithms and data, essential for signal processing applications.

Maximum Seated Height: 1.6 mm

Low seated height facilitates compact designs and enables the processor to be used in slim electronic devices.

Width: 24 mm

The standard width makes the processor compatible with common PCB sizes, simplifying integration into various electronic systems.

Boundary Scan: YES

Boundary scan capability helps with testing and debugging during production, ensuring quality and reliability in the final product.

External Data Bus Width: 16

A wider external data bus allows for faster data transfer between the processor and external memory or peripherals, enhancing overall system performance.

Maximum Clock Frequency: 120 MHz

High clock frequency enables rapid execution of instructions, making the processor suitable for real-time signal processing applications.

Maximum Time At Peak Reflow Temperature (s): 40

The specified time at peak reflow temperature ensures proper soldering and reliability during the manufacturing process.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering for robust connections and overall product reliability.

Internal Bus Architecture: MULTIPLE

Having multiple internal buses allows for efficient data transfer within the processor, enhancing performance and speed.

Length: 24 mm

The standard length facilitates compatibility with common PCB layouts, simplifying integration into various electronic systems.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring reliability and performance in harsh operating conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Supports various peripheral IC types, offering versatile connectivity options for interfacing with different digital devices.

RAM Bytes: 36864

Ample RAM capacity allows for efficient data storage and manipulation, essential for signal processing tasks.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various electronic systems.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and ease of soldering during assembly.

Nominal Supply Voltage: 2.5 V

The specified nominal supply voltage ensures stable and reliable operation of the processor within the recommended voltage range.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications to the stored programs, enhancing flexibility and adaptability.

Terminal Pitch: 0.5 mm

The fine terminal pitch enables high-density mounting, saving space on the PCB and allowing for compact designs.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and improves processing efficiency for signal processing tasks.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling and storage procedures to prevent damage.

Speed: 60 rpm

The specified speed parameter is likely not relevant to a DSP; it may be useful in other applications where rotation speed is important.

Low Power Mode: YES

Low power mode option allows for energy-efficient operation, prolonging battery life and reducing power consumption.

Barrel Shifter: YES

The presence of a barrel shifter enhances data manipulation capabilities and speed of arithmetic operations in the processor.

Technical Specifications

Digital Signal Processors (DSPs) MC56F8367MPYE attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from NXP Semiconductors

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

CPU Family:

56800E

Maximum Clock Frequency:

120 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G160

JESD-609 Code:

e3

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

160

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP160,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

36864

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

24 mm

Peripheral IC Type:

Trade Compliance

MC56F8367MPYE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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