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DSPIC33EP256MU814T-E/PL

Microchip Technology

DSPIC33EP256MU814T-E/PL by Microchip Technology

DSPIC33EP256MU814T-E/PL by Microchip Technology is a 16-bit digital signal processor with 28672 RAM words, operating at up to 60 MHz. Ideal for automotive applications, it features 9 timers, 15 DMA channels, and low power mode support. With a package style of flatpack and fine pitch, this CMOS technology device offers high performance in a compact form factor.

Median Price

$9.830

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$9.830

100+ parts

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50

$9.830

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Vyrian

USA . 1,134 parts In-Stock

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1,134

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 737 parts In-Stock

1+ parts

$7.202

100+ parts

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737

$7.202

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Continental Prestige Electronics

USA . 2,810 parts In-Stock

1+ parts

$9.830

100+ parts

-

1k+ parts

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$9.633

2,810

$9.830

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$9.633

Netroflash

USA . 500 parts In-Stock

1+ parts

$9.830

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500

$9.830

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Ampacity Inc.

Singapore . 1,537 parts In-Stock

1+ parts

$17.000

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1,537

$17.000

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Marpe Global Electronics

Taiwan . 6,777 parts In-Stock

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6,777

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Argo Parts USA

USA . 1,281 parts In-Stock

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1,281

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XL Components Corporation

Australia . 751 parts In-Stock

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751

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QualityLine Systems

Poland . 53 parts In-Stock

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53

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Overview

Unlock the power of cutting-edge technology with the DSPIC33EP256MU814T-E/PL by Microchip Technology. As a leader in the industry, Microchip delivers unparalleled quality and reliability in their digital signal processors. Ideal for a wide range of applications, this DSP offers customers unmatched value with its high performance and efficiency. Whether you're in automotive, industrial, or consumer electronics, this product is designed to exceed your expectations. Experience the benefits of advanced features and innovative design with the DSPIC33EP256MU814T-E/PL today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes this DSP lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient PCB assembly, saving time and reducing production costs.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this DSP can handle various power inputs, providing flexibility in system design.

On Chip Data RAM Width: 8

The wide on-chip data RAM width allows for fast data processing and efficient multitasking capabilities.

Package Shape: SQUARE

The square package shape makes this DSP easy to mount and integrate into space-constrained designs.

Bit Size: 16

The 16-bit size ensures high processing accuracy and precision, making this DSP suitable for demanding applications.

Power Supplies (V): 3.3

The 3.3V power supply ensures compatibility with common power sources, making integration into existing systems seamless.

No. of Terminals: 144

The high number of terminals allows for connectivity to multiple external components, enhancing the DSP's versatility.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, fine pitch package style saves space on the PCB and enhances heat dissipation for improved performance.

Minimum Supply Voltage: 3 V

The low minimum supply voltage allows for efficient power consumption, making this DSP suitable for low-power applications.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP256MU814T-E/PL attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Low Power Mode:

YES

No. of DMA Channels:

15

No. of External Interrupts:

5

No. of Serial I/Os:

0

No. of Terminals:

144

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

28672

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

320 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Trade Compliance

DSPIC33EP256MU814T-E/PL Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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