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DSPIC30F5011-30I/PTG

Microchip Technology

DSPIC30F5011-30I/PTG by Microchip Technology

DSPIC30F5011-30I/PTG by Microchip is a 16-bit DSP with 2048 RAM words, operating at -40 to 85°C. It has a quad-terminal position and uses CMOS technology. Ideal for industrial applications requiring fixed-point format processing in a compact square flatpack package.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Vyrian

USA . 656 parts In-Stock

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Nova Conductors

Japan . 200 parts In-Stock

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Pegasus Components GmbH

Germany . 55 parts In-Stock

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Ampacity Inc.

Singapore . 1,480 parts In-Stock

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$7.000

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$7.000

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Semicontronic

India . 343 parts In-Stock

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$8.000

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$7.800

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$7.760

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343

$8.000

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$7.760

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AZTECH Wire

Italy . 659 parts In-Stock

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$13.071

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659

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Corohmni

South Africa . 2,962 parts In-Stock

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$49.839

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$49.839

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Aztec Data Supply Inc.

USA . 422 parts In-Stock

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$56.960

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Continental Prestige Electronics

USA . 4,669 parts In-Stock

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RGB Technical Solutions

Ukraine . 4,199 parts In-Stock

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Argo Parts USA

USA . 1,176 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Enhance your digital signal processing projects with the DSPIC30F5011-30I/PTG by Microchip Technology. As a trusted manufacturer in the industry, Microchip Technology delivers top-quality products in the Digital Signal Processors category. This versatile processor offers superior performance and reliability, making it perfect for a wide range of applications. With its advanced technology and industrial-grade temperature rating, the DSPIC30F5011-30I/PTG provides exceptional value, benefits, and advantages to customers seeking high-quality solutions for their projects. Upgrade your DSP applications with this powerful and efficient processor today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for portable applications.

Surface Mount: YES

Surface mount technology allows for easy and compact integration onto circuit boards, saving space and enhancing overall design efficiency.

Bit Size: 16

With a 16-bit size, this DSP can handle complex algorithms and processing tasks with precision and efficiency.

Power Supplies (V): 3/5

The dual voltage supply options provide flexibility in powering the DSP based on the application requirements.

No. of Terminals: 64

With 64 terminals, there are plenty of connectivity options available for interfacing with other components in the system.

Package Style (Meter): FLATPACK

The flatpack design offers a low profile and efficient use of space, ideal for applications with space constraints.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in cold environments without any issues.

Terminal Finish: Matte Tin (Sn)

The matte tin finish provides good solderability and corrosion resistance for long-term reliability.

Terminal Position: QUAD

The quad terminal position allows for easy installation and secure connection to the PCB.

RAM Words: 2048

The large RAM capacity of 2048 words enables the DSP to store and process a significant amount of data efficiently.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in a wide range of industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high-speed processing capabilities for optimal performance.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and reliable electrical connections during operation.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5 mm allows for high-density mounting and connection to the PCB, saving space and enabling compact designs.

Format: FIXED POINT

The fixed-point format simplifies mathematical operations and improves efficiency in DSP algorithms and processing tasks.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC30F5011-30I/PTG attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Bit Size:

16

Format:

FIXED POINT

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Words:

2048

Sub-Category:

Digital Signal Processors

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

DSPIC30F5011-30I/PTG Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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