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TUSB1310AZAYR

Texas Instruments

TUSB1310AZAYR by Texas Instruments

TUSB1310AZAYR by Texas Instruments is a digital signal processor (DSP) with a max clock frequency of 40 MHz. It has a low power mode and is suitable for industrial applications. The package style is grid array, low profile, fine pitch with a terminal pitch of 0.8 mm.

Median Price

$10.824

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,816 parts In-Stock

1+ parts

$9.700

100+ parts

$9.510

1k+ parts

$9.310

10k+ parts

-

2,816

$9.700

$9.510

$9.310

-

DigiKey

USA . 2,093 parts In-Stock

1+ parts

$23.460

100+ parts

$16.646

1k+ parts

$15.077

10k+ parts

-

2,093

$23.460

$16.646

$15.077

-

Avnet

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$11.647

10k+ parts

$10.452

2,000

-

-

$11.647

$10.452

Chip1Stop

Japan . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$10.000

10k+ parts

-

1,000

-

-

$10.000

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 88 parts In-Stock

1+ parts

$12.474

100+ parts

-

1k+ parts

-

10k+ parts

-

88

$12.474

-

-

-

Digiode

USA . 1,670 parts In-Stock

1+ parts

$19.190

100+ parts

-

1k+ parts

-

10k+ parts

-

1,670

$19.190

-

-

-

Vyrian

USA . 1,984 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,984

-

-

-

-

TME

Poland . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$15.797

10k+ parts

-

1,000

-

-

$15.797

-

Chip Stock

USA . 855 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

855

-

-

-

-

IBS Electronics

USA . 11 parts In-Stock

1+ parts

-

100+ parts

$16.756

1k+ parts

-

10k+ parts

-

11

-

$16.756

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,847 parts In-Stock

1+ parts

$8.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,847

$8.500

-

-

-

Continental Prestige Electronics

USA . 3,996 parts In-Stock

1+ parts

$12.474

100+ parts

-

1k+ parts

-

10k+ parts

$12.225

3,996

$12.474

-

-

$12.225

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$12.474

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

$12.474

-

-

-

Corohmni

South Africa . 302 parts In-Stock

1+ parts

$13.306

100+ parts

-

1k+ parts

-

10k+ parts

-

302

$13.306

-

-

-

Corphita

USA . 2,354 parts In-Stock

1+ parts

$18.180

100+ parts

-

1k+ parts

-

10k+ parts

-

2,354

$18.180

-

-

-

Parana Technologies

USA . 1,504 parts In-Stock

1+ parts

$30.119

100+ parts

-

1k+ parts

$67.298

10k+ parts

-

1,504

$30.119

-

$67.298

-

Microchip USA

USA . 2,771 parts In-Stock

1+ parts

$31.900

100+ parts

$31.440

1k+ parts

$31.210

10k+ parts

$30.990

2,771

$31.900

$31.440

$31.210

$30.990

DigiPath Technology Company

USA . 373 parts In-Stock

1+ parts

$33.165

100+ parts

$30.512

1k+ parts

-

10k+ parts

-

373

$33.165

$30.512

-

-

ChromeModa Solutions

Germany . 4,308 parts In-Stock

1+ parts

$33.842

100+ parts

$27.750

1k+ parts

-

10k+ parts

-

4,308

$33.842

$27.750

-

-

IDEA Electronic Components Group

UK . 2,206 parts In-Stock

1+ parts

$33.842

100+ parts

$32.150

1k+ parts

$30.458

10k+ parts

-

2,206

$33.842

$32.150

$30.458

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Lixinc

USA . 7,980 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,980

-

-

-

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Argo Parts USA

USA . 276 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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276

-

-

-

-

Overview

Experience the power of the TUSB1310AZAYR by Texas Instruments, a top-of-the-line Digital Signal Processor (DSP) that revolutionizes performance and efficiency. With its cutting-edge technology and superior build quality, this DSP is designed to exceed your expectations. Whether you're in the automotive, industrial, or consumer electronics industry, the TUSB1310AZAYR offers unrivaled precision, speed, and reliability. Its compact size and low power mode make it ideal for any application. Discover the value and advantages this exceptional product brings to your business and unlock a world of possibilities with Texas Instruments.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY. This material provides durability and protection for the product, making it suitable for various applications.

Surface Mount:

YES. This feature allows for easy and efficient installation of the DSP, saving time and reducing production costs.

Maximum Supply Voltage:

3.63 V. With a higher supply voltage, this DSP can handle demanding tasks and maintain consistent performance.

Package Shape:

SQUARE. The square shape makes the DSP compact and space-saving, facilitating integration into different electronic devices.

No. of Terminals:

175. The large number of terminals enables connectivity with other components, enhancing the DSP's versatility.

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH. This package style ensures high connectivity density and low profile, making it suitable for compact designs with tight spacing constraints.

Minimum Supply Voltage:

2.97 V. The lower minimum supply voltage allows for energy-efficient operation and extends battery life in portable devices.

Maximum Operating Temperature:

85 °C. The high maximum operating temperature ensures reliable performance even in demanding environments with elevated temperatures.

Minimum Operating Temperature:

40 °C. The low minimum operating temperature makes this DSP suitable for use in extreme cold conditions.

Terminal Finish:

TIN SILVER COPPER. This finish provides excellent conductivity and corrosion resistance, ensuring optimal signal transmission and product longevity.

Terminal Position:

BOTTOM. The bottom terminal position simplifies PCB layout and assembly, streamlining production processes.

Maximum Seated Height:

1.4 mm. The low seated height allows for compact device designs and easier integration into space-constrained applications.

Width:

12 mm. The compact width facilitates the placement of multiple DSPs or other components on a single PCB, optimizing space utilization.

Boundary Scan:

YES. The boundary scan capability enables enhanced testing and debugging capabilities, ensuring higher reliability and easier fault detection.

Maximum Clock Frequency:

40 MHz. With a high clock frequency, this DSP can handle real-time processing tasks and complex algorithms efficiently.

Maximum Time At Peak Reflow Temperature (s):

30. The extended time at peak reflow temperature allows for reliable solder joint formation during the manufacturing process.

Peak Reflow Temperature °C:

260. The high peak reflow temperature ensures proper solder melting and secure connections, contributing to overall product reliability.

Internal Bus Architecture:

MULTIPLE. The multiple internal bus architecture supports efficient data transfer between DSP components, enhancing overall performance.

Length:

12 mm. The compact length enables the DSP to fit in small spaces and contributes to the flexibility of different product designs.

Temperature Grade:

INDUSTRIAL. The industrial temperature grade allows for reliable operation in various industrial environments with wide temperature fluctuations.

Peripheral IC Type:

DIGITAL SIGNAL PROCESSOR, OTHER. This DSP is specifically designed for digital signal processing applications, offering specialized features and capabilities.

Technology:

CMOS. The CMOS technology provides low power consumption, high-speed operation, and compatibility with various digital circuits.

Terminal Form:

BALL. The ball terminal form provides reliable solder connections and facilitates high-density packaging, making it suitable for advanced manufacturing processes.

Nominal Supply Voltage:

3.3 V. The nominal supply voltage ensures compatibility with standard electronic systems and simplifies power supply design.

Terminal Pitch:

0.8 mm. The small terminal pitch allows for higher pin density, enabling more connectivity options and increasing design flexibility.

Format:

FIXED POINT. The fixed-point format is suitable for a wide range of digital signal processing tasks, offering high precision and accuracy in calculations.

Moisture Sensitivity Level (MSL):

3. The MSL 3 rating indicates reliable moisture resistance during storage and handling, ensuring product quality and longevity.

Low Power Mode:

YES. The low power mode feature enables energy-efficient operation, prolonging battery life and reducing overall power consumption.

Technical Specifications

Digital Signal Processors (DSPs) TUSB1310AZAYR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1.8 V AND 1.1 V NOMINAL SUPPLY

Address Bus Width:

0

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B175

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

175

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TUSB1310AZAYR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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