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TMS320C6678ACYPA

Texas Instruments

TMS320C6678ACYPA by Texas Instruments

TMS320C6678ACYPA by Texas Instruments is a 32-bit DSP with 24-bit address bus, 312.5 MHz clock frequency, and 8192 RAM words. Ideal for industrial applications requiring high-speed processing, it features low power mode, boundary scan support, and 80 DMA channels for efficient data transfer.

Median Price

$368.010

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

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Texas Instruments

USA . 52 parts In-Stock

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$269.139

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$243.617

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$232.016

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$232.016

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DigiKey

USA . 115 parts In-Stock

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$447.780

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Mouser Electronics

USA . 50 parts In-Stock

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$447.780

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$447.780

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Chip1Stop

Japan . 176 parts In-Stock

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$288.240

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Distributors (In-Stock)

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Digiode

USA . 1,292 parts In-Stock

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$255.682

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Bristol Electronics

USA . 2 parts In-Stock

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$287.097

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Maritex

Poland . 28 parts In-Stock

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$320.105

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$320.105

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Nova Conductors

Japan . 10 parts In-Stock

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$334.474

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$334.474

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Chip Stock

USA . 8,750 parts In-Stock

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Vyrian

USA . 6,591 parts In-Stock

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Cyclops Electronics Ltd

UK . 393 parts In-Stock

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Sensible Micro Corp

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Velocity Electronics

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ACDS - Activité Composants Distribution Service

France . 2 parts In-Stock

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Dan-Mar Components

USA . 2 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 457 parts In-Stock

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$8.183

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$8.183

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$54.529

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$51.803

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$51.803

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$54.529

$51.803

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Parana Technologies

USA . 604 parts In-Stock

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$55.247

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DigiPath Technology Company

USA . 1,975 parts In-Stock

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$60.834

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$55.967

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$60.834

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IDEA Electronic Components Group

UK . 1,698 parts In-Stock

1+ parts

$62.075

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$58.971

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$55.868

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1,698

$62.075

$58.971

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ChromeModa Solutions

Germany . 952 parts In-Stock

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$62.075

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$50.902

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$62.075

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Corohmni

South Africa . 1,230 parts In-Stock

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$85.346

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Ampacity Inc.

Singapore . 105 parts In-Stock

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$228.770

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Semicontronic

India . 105 parts In-Stock

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$228.770

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$223.051

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$221.907

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Corphita

USA . 3,205 parts In-Stock

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Continental Prestige Electronics

USA . 202 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$334.474

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QUARKTWIN TECHNOLOGY LTD

USA . 21,704 parts In-Stock

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Lixinc

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A-Z Elektronik GmbH

Germany . 6,261 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,698 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Perfect Parts

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GreenTree Electronics

Israel . 696 parts In-Stock

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S.R.D Solutions

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Argo Parts USA

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Overview

Experience unparalleled performance and efficiency with the TMS320C6678ACYPA by Texas Instruments, a leading manufacturer in digital signal processors. This versatile processor is perfect for applications in telecommunications, industrial control, and automotive systems. With integrated cache, low power mode, and a wide range of power supplies, this product offers unmatched value and benefits to customers seeking cutting-edge technology. Trust Texas Instruments for superior quality and innovation in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the DSP durable and resistant to external factors, ensuring a long lifespan.

Integrated Cache: YES

Having an integrated cache enhances the processing speed and efficiency of the DSP, enabling quicker data access and processing.

Maximum Supply Voltage: 1.05 V

Operating at a maximum supply voltage of 1.05V helps in reducing power consumption and heat generation, making the DSP energy-efficient.

Address Bus Width: 24

With a wide address bus width of 24, the DSP can handle a large amount of memory addresses, enabling it to process complex tasks efficiently.

Bit Size: 32

A 32-bit architecture allows the DSP to handle large and complex data sets, making it suitable for demanding applications that require high computational power.

Maximum Clock Frequency: 312.5 MHz

Operating at a high clock frequency of 312.5 MHz enables the DSP to perform tasks quickly and efficiently, making it ideal for real-time signal processing applications.

Temperature Grade: INDUSTRIAL

Being designed for industrial temperature ranges, the DSP can operate reliably in harsh environments, making it suitable for industrial automation and control systems.

Technology: CMOS

Utilizing CMOS technology provides the DSP with low power consumption and high noise immunity, contributing to its efficiency and reliability in operation.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6678ACYPA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

312.5 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B841

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

80

No. of Terminals:

841

No. of Timers:

16

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA841,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1,1.5,1.8

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.39 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6678ACYPA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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