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DSPIC30F5011-20I/PTG

Microchip Technology

DSPIC30F5011-20I/PTG by Microchip Technology

DSPIC30F5011-20I/PTG by Microchip Technology is a 16-bit digital signal processor (DSP) with 2048 RAM words. It operates at temperatures ranging from -40 to 85 °C and has a package style of flatpack. This DSP is commonly used in industrial applications requiring fixed point processing.

Median Price

$10.150

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 16 parts In-Stock

1+ parts

$10.150

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16

$10.150

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Vyrian

USA . 1,598 parts In-Stock

1+ parts

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1,598

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AGACORP

USA . 114 parts In-Stock

1+ parts

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114

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 781 parts In-Stock

1+ parts

$6.000

100+ parts

-

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781

$6.000

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Andel Nordic

Denmark . 4,178 parts In-Stock

1+ parts

$7.977

100+ parts

-

1k+ parts

$7.658

10k+ parts

$7.658

4,178

$7.977

-

$7.658

$7.658

Corohmni

South Africa . 11 parts In-Stock

1+ parts

$9.770

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11

$9.770

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AZTECH Wire

Italy . 780 parts In-Stock

1+ parts

$10.037

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780

$10.037

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Continental Prestige Electronics

USA . 2,535 parts In-Stock

1+ parts

$10.150

100+ parts

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10k+ parts

$9.947

2,535

$10.150

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$9.947

Semicontronic

India . 1,292 parts In-Stock

1+ parts

$12.000

100+ parts

$11.700

1k+ parts

$11.640

10k+ parts

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1,292

$12.000

$11.700

$11.640

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Aztec Data Supply Inc.

USA . 3,394 parts In-Stock

1+ parts

$64.110

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3,394

$64.110

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RGB Technical Solutions

Ukraine . 4,588 parts In-Stock

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4,588

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Argo Parts USA

USA . 3,779 parts In-Stock

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3,779

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$9.947

1k+ parts

$9.642

10k+ parts

$9.439

1,000

-

$9.947

$9.642

$9.439

Overview

Discover the power of the DSPIC30F5011-20I/PTG by Microchip Technology, a leading manufacturer in the field of Digital Signal Processors (DSPs). Designed with precision and expertise, this product offers unrivaled quality and reliability. With its advanced technology and versatile applications, it is the perfect choice for a wide range of industries. Experience the seamless performance and efficiency that this product brings, allowing you to streamline your operations and achieve unparalleled results. Don't miss out on the opportunity to enhance your projects with the DSPIC30F5011-20I/PTG and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection to the DSP, making it suitable for various industrial applications.

Surface Mount: YES

The ability to surface mount the DSP makes it easier to integrate into electronic devices, saving space and enabling efficient PCB designs.

Package Shape: SQUARE

The square package shape allows for easier handling and mounting of the DSP, ensuring compatibility with standard electronic components.

Bit Size: 16

With a bit size of 16, this DSP is capable of processing complex digital signals with high precision and accuracy, making it ideal for demanding signal processing tasks.

Power Supplies (V): 3/5

The dual power supply options of 3V and 5V make this DSP compatible with different voltage requirements, enhancing its versatility and usability.

No. of Terminals: 64

The 64 terminals provide a sufficient number of connections for interfacing with other electronic components and peripherals, enabling seamless integration into various systems.

Package Style (Meter): FLATPACK

The flatpack package style offers a compact and space-efficient design, allowing for easy installation and integration of the DSP in tight spaces.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures the DSP's reliability and performance even in challenging thermal conditions, further enhancing its suitability for industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C enables the DSP to operate reliably in extreme cold environments, making it suitable for a wide range of applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring reliable and long-lasting connections for the DSP.

Terminal Position: QUAD

The quad terminal position allows for easy mounting and soldering of the DSP onto PCBs, facilitating efficient production processes and reducing assembly time.

RAM Words: 2048

With a large RAM capacity of 2048 words, this DSP can efficiently store and process substantial amounts of data, enabling complex signal processing tasks and reducing the need for external memory.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time of 40 seconds at peak reflow temperature ensures proper soldering of the DSP during manufacturing, resulting in reliable connections and optimal performance.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C enables effective soldering of the DSP onto PCBs, ensuring robust and reliable electrical connections.

Temperature Grade: INDUSTRIAL

The temperature grade of "INDUSTRIAL" indicates that this DSP is designed to operate reliably in demanding industrial environments, making it suitable for applications with varying temperature conditions.

Technology: CMOS

The CMOS technology used in this DSP provides low power consumption, high-speed processing, and compatibility with a wide range of electronic systems, making it an efficient and versatile choice.

Terminal Form: GULL WING

The gull wing terminal form facilitates reliable and secure connections during soldering, ensuring optimal electrical performance and ease of integration.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, this DSP allows for high-density PCB layouts and precise connections, enabling compact and efficient electronic designs.

Format: FIXED POINT

The fixed-point format offers efficient and accurate representation of digital signals, making this DSP suitable for applications requiring precise numerical calculations and processing.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 implies that this DSP has moderate tolerance to moisture exposure, ensuring its reliability during storage, shipping, and assembly in various environments.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC30F5011-20I/PTG attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Bit Size:

16

Format:

FIXED POINT

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Words:

2048

Sub-Category:

Digital Signal Processors

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

DSPIC30F5011-20I/PTG Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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