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PIC24EP256GU810-E/PF

Microchip Technology

PIC24EP256GU810-E/PF by Microchip Technology

PIC24EP256GU810-E/PF by Microchip Technology is a 16-bit DSP with 28672 RAM words, operating at up to 60 MHz. Ideal for automotive applications, it features 9 timers, 15 DMA channels, and low power mode support. With a max supply voltage of 3.6V and temperature range from -40°C to 125°C, it offers versatile performance in a compact square package.

Median Price

$11.900

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 3,500 parts In-Stock

1+ parts

$11.900

100+ parts

$9.880

1k+ parts

$9.110

10k+ parts

$8.650

3,500

$11.900

$9.880

$9.110

$8.650

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$11.362

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$11.362

-

-

-

NAC Semi

USA . 2,790 parts In-Stock

1+ parts

$12.340

100+ parts

$11.190

1k+ parts

$10.230

10k+ parts

-

2,790

$12.340

$11.190

$10.230

-

Vyrian

USA . 7,926 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,926

-

-

-

-

QIE Inc.

USA . 33 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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33

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 455 parts In-Stock

1+ parts

$9.050

100+ parts

-

1k+ parts

-

10k+ parts

-

455

$9.050

-

-

-

Semicontronic

India . 3,450 parts In-Stock

1+ parts

$10.120

100+ parts

$9.867

1k+ parts

$9.816

10k+ parts

-

3,450

$10.120

$9.867

$9.816

-

Ampacity Inc.

Singapore . 3,369 parts In-Stock

1+ parts

$10.120

100+ parts

-

1k+ parts

-

10k+ parts

-

3,369

$10.120

-

-

-

Aranea Global

USA . 500 parts In-Stock

1+ parts

$11.135

100+ parts

-

1k+ parts

$10.689

10k+ parts

-

500

$11.135

-

$10.689

-

Continental Prestige Electronics

USA . 647 parts In-Stock

1+ parts

$11.362

100+ parts

-

1k+ parts

-

10k+ parts

$11.135

647

$11.362

-

-

$11.135

Aztec Data Supply Inc.

USA . 117 parts In-Stock

1+ parts

$57.920

100+ parts

-

1k+ parts

-

10k+ parts

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117

$57.920

-

-

-

Corohmni

South Africa . 137 parts In-Stock

1+ parts

$58.514

100+ parts

-

1k+ parts

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10k+ parts

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137

$58.514

-

-

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Lixinc

USA . 17,196 parts In-Stock

1+ parts

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100+ parts

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17,196

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QUARKTWIN TECHNOLOGY LTD

USA . 11,325 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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11,325

-

-

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QualityLine Systems

Poland . 8,037 parts In-Stock

1+ parts

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100+ parts

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8,037

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-

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XL Components Corporation

Australia . 7,174 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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7,174

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Marpe Global Electronics

Taiwan . 2,410 parts In-Stock

1+ parts

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2,410

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Argo Parts USA

USA . 2,271 parts In-Stock

1+ parts

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100+ parts

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2,271

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,000

-

-

-

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Robosynatics

Brazil . 450 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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450

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-

-

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Lucentia Tech

USA . 450 parts In-Stock

1+ parts

-

100+ parts

$21.284

1k+ parts

$21.284

10k+ parts

$21.284

450

-

$21.284

$21.284

$21.284

Overview

Experience the power of cutting-edge technology with the PIC24EP256GU810-E/PF by Microchip Technology. This Digital Signal Processor offers unparalleled performance and reliability, making it perfect for a wide range of applications. With its innovative design and high-quality materials, this product ensures seamless operation and maximum efficiency. Trust in Microchip Technology to deliver top-of-the-line products that exceed expectations. Upgrade your projects with the PIC24EP256GU810-E/PF and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications without adding unnecessary weight.

Surface Mount: YES

Surface mount technology allows for efficient and compact PCB design, saving space and making it easier to integrate into electronic devices.

Maximum Supply Voltage: 3.6 V

The ability to handle a maximum supply voltage of 3.6V provides flexibility and reliability in different power supply scenarios.

On Chip Data RAM Width: 8

Having a wide on-chip data RAM width of 8 bits enables fast data processing and efficient memory management.

Package Shape: SQUARE

The square package shape offers uniformity in design and facilitates easy mounting on PCBs.

Bit Size: 16

With a 16-bit bit size, this DSP can handle complex calculations and processing tasks effectively.

Power Supplies (V): 3.3

Operating at a voltage of 3.3V makes it compatible with standard power supply systems and reduces the need for additional voltage regulation.

No. of Terminals: 100

Having a high number of terminals allows for versatile connectivity options and easy interfacing with other components.

Package Style: FLATPACK, THIN PROFILE, FINE PITCH

The flatpack, thin profile, and fine pitch package style offers space-saving benefits and enhances thermal performance for improved reliability.

Minimum Supply Voltage: 3 V

The ability to function at a minimum supply voltage of 3V ensures operational stability even in low-power scenarios.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, the DSP can withstand harsh environmental conditions and extended use.

No. of External Interrupts: 5

Having 5 external interrupts allows for efficient handling of external events and enhances the responsiveness of the system.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in cold environments.

Terminal Finish: MATTE TIN

The matte tin finish provides excellent solderability and corrosion resistance, ensuring long-term reliability in various operating conditions.

Terminal Position: QUAD

The quad terminal position enables secure and stable connections, reducing the risk of signal loss or disruptions.

Maximum Seated Height: 1.2 mm

With a low maximum seated height of 1.2mm, the DSP can be easily integrated into compact designs and slim devices.

RAM Words: 28672

Having a large number of RAM words allows for extensive data storage and efficient memory operations for complex algorithms.

Width: 14 mm

The compact width of 14mm makes the DSP suitable for space-constrained applications and enables efficient PCB layout.

Boundary Scan: YES

Boundary scan support enables easy testing and diagnostics, simplifying manufacturing and maintenance processes.

Maximum Clock Frequency: 60 MHz

Operating at a maximum clock frequency of 60 MHz allows for fast data processing and swift response times in real-time applications.

Maximum Time At Peak Reflow Temperature (s): 40

The short maximum time at peak reflow temperature of 40 seconds reduces the risk of thermal damage during soldering processes.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature of 260°C, the DSP can withstand the heat of soldering without degradation.

Length: 14 mm

The compact length of 14mm complements the width and height dimensions, offering a balanced form factor for easy integration.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this DSP meets the stringent quality and reliability standards required for automotive electronics.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Combining the functions of a digital signal processor and a controller, this peripheral IC offers versatile processing capabilities for diverse applications.

No. of Timers: 9

Having 9 timers enables accurate timing control and synchronization of operations, essential for tasks that require precise timing.

Technology: CMOS

Utilizing CMOS technology provides low power consumption, high speed, and increased noise immunity, enhancing the overall performance of the DSP.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy assembly and rework processes, ensuring efficient production and maintenance of electronic systems.

Maximum Supply Current: 320 mA

With a maximum supply current of 320mA, the DSP operates within a safe range of current consumption, minimizing power loss and overheating.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V ensures consistent and stable performance under standard operating conditions.

No. of DMA Channels: 15

Having 15 DMA channels allows for efficient data transfer and processing, reducing the workload on the main processor and improving overall system performance.

ROM Programmability: FLASH

Utilizing FLASH ROM enables easy reprogramming of the memory, allowing for flexible firmware updates and customization without the need for external programmers.

Terminal Pitch: 0.5 mm

With a fine terminal pitch of 0.5mm, the DSP offers precise connectivity and enables high-density mounting on PCBs for compact designs.

Format: FLOATING POINT

Supporting floating-point format improves the accuracy and precision of mathematical calculations, making the DSP suitable for applications requiring complex computations.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that the DSP is suitable for reflow soldering processes and can withstand moderate humidity levels without damage.

Low Power Mode: YES

The low power mode feature helps conserve energy and prolong battery life, making the DSP ideal for portable and battery-powered devices.

On Chip Program ROM Width: 8

With an on-chip program ROM width of 8 bits, the DSP can efficiently store and access program instructions, enhancing overall processing speed and efficiency.

Technical Specifications

Digital Signal Processors (DSPs) PIC24EP256GU810-E/PF attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

15

No. of External Interrupts:

5

No. of Serial I/Os:

0

No. of Terminals:

100

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

28672

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Sub-Category:

Microcontrollers

Maximum Supply Current:

320 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Trade Compliance

PIC24EP256GU810-E/PF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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