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PIC24EP512GU810T-I/PF

Microchip Technology

PIC24EP512GU810T-I/PF by Microchip Technology

PIC24EP512GU810T-I/PF by Microchip Technology is a 16-bit DSP with 60 MHz clock frequency, 53248 RAM words, and 320 mA max supply current. Ideal for industrial applications requiring high-speed processing, it features 9 timers, 15 DMA channels, and FLASH ROM programmability.

Median Price

$12.150

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 944 parts In-Stock

1+ parts

$12.150

100+ parts

$10.090

1k+ parts

-

10k+ parts

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944

$12.150

$10.090

-

-

DigiKey

USA . 925 parts In-Stock

1+ parts

$12.150

100+ parts

$10.090

1k+ parts

$10.090

10k+ parts

-

925

$12.150

$10.090

$10.090

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$11.602

100+ parts

-

1k+ parts

-

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700

$11.602

-

-

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Velocity Electronics

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

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7,000

-

-

-

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Chip Stock

USA . 6,700 parts In-Stock

1+ parts

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6,700

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Vyrian

USA . 2,901 parts In-Stock

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2,901

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,139 parts In-Stock

1+ parts

$8.420

100+ parts

-

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3,139

$8.420

-

-

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Semicontronic

India . 2,902 parts In-Stock

1+ parts

$8.420

100+ parts

$8.210

1k+ parts

$8.167

10k+ parts

-

2,902

$8.420

$8.210

$8.167

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Continental Prestige Electronics

USA . 6,623 parts In-Stock

1+ parts

$11.084

100+ parts

-

1k+ parts

-

10k+ parts

$10.862

6,623

$11.084

-

-

$10.862

Netroflash

USA . 100 parts In-Stock

1+ parts

$11.602

100+ parts

$11.370

1k+ parts

-

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100

$11.602

$11.370

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-

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$12.171

100+ parts

$11.198

1k+ parts

$10.493

10k+ parts

-

100

$12.171

$11.198

$10.493

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Aztec Data Supply Inc.

USA . 217 parts In-Stock

1+ parts

$36.720

100+ parts

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217

$36.720

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Corohmni

South Africa . 397 parts In-Stock

1+ parts

$46.214

100+ parts

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397

$46.214

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Lixinc

USA . 12,557 parts In-Stock

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12,557

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Formix International (Excess)

India . 7,937 parts In-Stock

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7,937

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LOOK Integrated Logistics

Peru . 7,519 parts In-Stock

1+ parts

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7,519

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LMD Electronica

Estonia . 6,516 parts In-Stock

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6,516

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NIA Electronics

USA . 5,198 parts In-Stock

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5,198

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Ledger Components

France . 5,198 parts In-Stock

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5,198

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Montano Global Distributors

Canada . 4,180 parts In-Stock

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4,180

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Infinite Electronics LLP (Excess)

. 3,979 parts In-Stock

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3,979

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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RC Electronics

USA . 1,884 parts In-Stock

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1,884

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Argo Parts USA

USA . 1,272 parts In-Stock

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1,272

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Robosynatics

Brazil . 350 parts In-Stock

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350

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Lucentia Tech

USA . 350 parts In-Stock

1+ parts

-

100+ parts

$0.214

1k+ parts

$0.214

10k+ parts

$0.214

350

-

$0.214

$0.214

$0.214

Overview

Experience unparalleled performance and reliability with the PIC24EP512GU810T-I/PF by Microchip Technology. As a leader in the industry, Microchip delivers cutting-edge Digital Signal Processors that offer superior quality and precision. Ideal for a wide range of applications, this DSP provides unmatched value and benefits to customers seeking efficient and powerful solutions. Trust Microchip Technology to elevate your projects to the next level with the PIC24EP512GU810T-I/PF.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components for its durability and heat resistance, making this DSP reliable in various operating conditions.

Surface Mount: YES

Surface mount technology allows for easy and compact integration onto circuit boards, saving space and reducing overall system size.

Maximum Supply Voltage: 3.6 V

Having a higher maximum supply voltage allows for flexibility in power supply design and compatibility with a wider range of systems.

On Chip Data RAM Width: 8

With a wider data RAM width, this DSP can handle and process more data simultaneously, improving overall performance and speed.

Package Shape: SQUARE

The square package shape is compact and space-efficient, allowing for easy integration into tight spaces in electronic systems.

Bit Size: 16

A 16-bit architecture allows for higher computational precision and accuracy in signal processing applications.

Power Supplies (V): 3.3

Operating at a standard voltage of 3.3V ensures compatibility with common power sources and reduces the need for additional voltage regulation circuitry.

No. of Terminals: 100

Having a higher number of terminals provides more connectivity options and flexibility in interfacing with other components and peripherals.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

This package style offers a compact form factor with a thin profile and fine pitch, enabling high-density mounting and efficient use of board space.

Minimum Supply Voltage: 3 V

The low minimum supply voltage allows for operation in low-power scenarios and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this DSP can reliably operate in high-temperature environments without performance degradation.

No. of External Interrupts: 5

Having multiple external interrupt inputs allows for timely response to external events and efficient handling of real-time tasks.

Minimum Operating Temperature: -40 °C

The wide temperature range of operation enables this DSP to function in harsh environments with extreme temperature fluctuations.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and resistance to corrosion, ensuring reliable electrical connections and long-term performance.

Terminal Position: QUAD

Quad terminal positioning allows for secure and stable mounting on the circuit board, reducing the risk of mechanical stress and damage.

Maximum Seated Height: 1.2 mm

The low seated height of this DSP package minimizes vertical space requirements and allows for compact system design.

RAM Words: 53248

With a large RAM capacity, this DSP can store and process a significant amount of data, enabling complex signal processing tasks and algorithms.

Width: 14 mm

A compact width dimension allows for easy integration into space-constrained designs and helps in achieving a sleek and efficient system layout.

Boundary Scan: YES

Boundary scan capability facilitates testing and debugging during manufacturing, ensuring high quality and reliability of the final product.

Maximum Clock Frequency: 60 MHz

Operating at a high clock frequency of 60 MHz enables fast data processing and real-time signal handling, suitable for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 40

The specified reflow time at peak temperature ensures proper solder reflow and component attachment during manufacturing assembly processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance of 260°C makes this DSP compatible with lead-free soldering processes for environmental compliance.

Length: 14 mm

A compact length dimension contributes to the overall small footprint of this DSP, ideal for space-constrained applications and systems.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, this DSP can withstand harsh operating conditions in industrial environments with high reliability.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

With integrated digital signal processing and controller functions, this DSP offers versatile capabilities for a wide range of applications and system control.

No. of Timers: 9

Having multiple timers allows for precise timing and scheduling of tasks, essential for efficient real-time operation and control in various applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this DSP energy-efficient and reliable in noisy electrical environments.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and ease of soldering, ensuring secure electrical connections and robust assembly.

Maximum Supply Current: 320 mA

Operating at a moderate supply current of 320 mA, this DSP consumes low power while delivering high performance, suitable for battery-powered devices.

Nominal Supply Voltage: 3.3 V

Having a standard nominal supply voltage of 3.3V simplifies power management and compatibility with common power sources in electronic systems.

No. of DMA Channels: 15

With a high number of DMA channels, this DSP can efficiently transfer data between peripherals and memory, enhancing overall system performance.

ROM Programmability: FLASH

Flash ROM allows for reprogrammable memory, enabling firmware updates and customization of code, essential for versatile and adaptable applications.

Terminal Pitch: 0.5 mm

A fine terminal pitch of 0.5 mm enables high-density mounting and compact layout on the circuit board, ideal for miniaturized electronic devices.

Format: FLOATING POINT

Supporting floating-point format allows for precise mathematical calculations and signal processing algorithms, crucial for high accuracy applications.

Moisture Sensitivity Level (MSL): 3

Having an MSL of 3 indicates moderate sensitivity to moisture during storage and handling, requiring proper precautions to prevent damage.

Low Power Mode: YES

The low power mode feature enables power-saving operations when the DSP is idle or under light load, extending battery life in portable devices.

On Chip Program ROM Width: 8

With an on-chip ROM of 8-bit width, this DSP can store and execute code efficiently, supporting fast and reliable program execution.

Technical Specifications

Digital Signal Processors (DSPs) PIC24EP512GU810T-I/PF attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

15

No. of External Interrupts:

5

No. of Serial I/Os:

0

No. of Terminals:

100

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

53248

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Sub-Category:

Microcontrollers

Maximum Supply Current:

320 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Trade Compliance

PIC24EP512GU810T-I/PF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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