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PIC24EP256GU814-I/PH

Microchip Technology

PIC24EP256GU814-I/PH by Microchip Technology

PIC24EP256GU814-I/PH by Microchip: 16-bit DSP with 60MHz clock, 28672 RAM words, and 3.3V supply. Ideal for industrial applications requiring high-speed processing and low power consumption. Features include 9 timers, 15 DMA channels, and FLASH ROM programmability.

Median Price

$11.360

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 350 parts In-Stock

1+ parts

$11.360

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$9.450

1k+ parts

$8.680

10k+ parts

$8.260

350

$11.360

$9.450

$8.680

$8.260

Mouser Electronics

USA . 292 parts In-Stock

1+ parts

$11.360

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$9.450

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-

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292

$11.360

$9.450

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DigiKey

USA . 81 parts In-Stock

1+ parts

$11.360

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$9.450

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-

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81

$11.360

$9.450

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Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$11.260

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100

$11.260

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NAC Semi

USA . 180 parts In-Stock

1+ parts

$11.810

100+ parts

$10.710

1k+ parts

$9.790

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-

180

$11.810

$10.710

$9.790

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Vyrian

USA . 8,658 parts In-Stock

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8,658

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Sensible Micro Corp

USA . 49 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 374 parts In-Stock

1+ parts

$9.450

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374

$9.450

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Semicontronic

India . 176 parts In-Stock

1+ parts

$9.450

100+ parts

$9.214

1k+ parts

$9.166

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176

$9.450

$9.214

$9.166

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$11.035

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$10.593

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100

$11.035

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Continental Prestige Electronics

USA . 1,578 parts In-Stock

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$11.260

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$11.035

1,578

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$11.035

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$11.484

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$11.484

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$11.484

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100

$11.484

$11.484

$11.484

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Aztec Data Supply Inc.

USA . 176 parts In-Stock

1+ parts

$35.680

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176

$35.680

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Corohmni

South Africa . 110 parts In-Stock

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$73.660

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$73.660

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Authorized Procurement Solutions

USA . 21,000 parts In-Stock

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Lixinc

USA . 13,262 parts In-Stock

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Argo Parts USA

USA . 3,053 parts In-Stock

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West Coast Incorporated

USA . 2,101 parts In-Stock

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Robosynatics

Brazil . 200 parts In-Stock

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Lucentia Tech

USA . 200 parts In-Stock

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$0.128

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$0.128

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$0.128

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$0.128

$0.128

$0.128

Overview

Discover the power of the PIC24EP256GU814-I/PH by Microchip Technology, a cutting-edge Digital Signal Processor that delivers unrivaled performance and reliability. With a focus on quality and innovation, Microchip Technology ensures that this DSP meets the highest standards in the industry. Ideal for applications requiring precision and speed, this versatile device offers customers enhanced value and efficiency. Whether you're in the automotive, industrial, or consumer electronics sector, the PIC24EP256GU814-I/PH is the perfect solution for your digital processing needs. Elevate your projects with this top-of-the-line DSP from Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the DSP, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, making the DSP more convenient to integrate into electronic devices.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows the DSP to operate efficiently with various power sources, providing flexibility in design.

On Chip Data RAM Width: 8

Having a wide data RAM width of 8 allows for faster data processing and storage, improving the overall performance of the DSP.

Package Shape: SQUARE

The square package shape makes the DSP easy to handle and install, fitting neatly into circuit board layouts.

Bit Size: 16

With a bit size of 16, the DSP can handle complex calculations and data operations with high precision and accuracy.

Power Supplies (V): 3.3

Having a stable power supply of 3.3 V ensures consistent and reliable performance of the DSP in various operating conditions.

No. of Terminals: 144

Having a high number of terminals allows for efficient connectivity and communication with other components in electronic systems.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The flatpack style with a thin profile and fine pitch design enhances the overall compactness and efficiency of the DSP in space-constrained applications.

Minimum Supply Voltage: 3 V

The low minimum supply voltage of 3 V ensures that the DSP can operate even in low-power situations, maximizing energy efficiency.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows the DSP to withstand harsh environmental conditions without compromising performance.

No. of External Interrupts: 5

Having multiple external interrupts enables the DSP to respond quickly to external events, improving overall responsiveness in real-time applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures that the DSP can function reliably even in extremely cold environments.

Terminal Finish: MATTE TIN

The matte tin finish on the terminals provides corrosion resistance and reliable connectivity for the DSP in various operating conditions.

Terminal Position: QUAD

The quad terminal position allows for easy alignment and installation of the DSP on circuit boards, simplifying the manufacturing process.

Maximum Seated Height: 1.2 mm

The low maximum seated height of 1.2 mm ensures that the DSP can be integrated into compact electronic devices without taking up too much space.

RAM Words: 28672

Having a large number of RAM words enables the DSP to store and process a significant amount of data, supporting complex computational tasks.

Width: 16 mm

The compact width of 16 mm makes the DSP suitable for use in small electronic devices where space is limited.

Boundary Scan: YES

The boundary scan feature allows for easy testing and debugging of the DSP during the manufacturing process, ensuring quality control and reliability.

Maximum Clock Frequency: 60 MHz

The high maximum clock frequency of 60 MHz enables the DSP to perform fast data processing and calculations, improving overall efficiency.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature of 40 seconds ensures that the DSP can withstand the soldering process during assembly without any damage.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows the DSP to endure the reflow soldering process in manufacturing, ensuring solid connections.

Length: 16 mm

The short length of 16 mm contributes to the overall compactness and space-saving design of the DSP in electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the DSP can operate reliably in harsh industrial environments, making it suitable for rugged applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Being a digital signal processor and controller, the DSP can efficiently handle signals and data processing tasks, making it versatile for various applications.

No. of Timers: 9

Having multiple timers allows the DSP to manage timing and scheduling operations effectively, improving overall performance in time-sensitive applications.

Technology: CMOS

The CMOS technology used in the DSP ensures low power consumption and high-speed performance, making it an energy-efficient choice for electronic devices.

Terminal Form: GULL WING

The gull wing terminal form offers secure and reliable connections for the DSP on circuit boards, minimizing the risk of signal loss or disconnection.

Maximum Supply Current: 320 mA

The maximum supply current of 320 mA indicates the power efficiency of the DSP, ensuring optimal performance without excessive power consumption.

Nominal Supply Voltage: 3.3 V

Having a nominal supply voltage of 3.3 V ensures stable and consistent power delivery to the DSP, supporting reliable operation in electronic systems.

No. of DMA Channels: 15

Having multiple DMA channels allows the DSP to handle data transfer tasks efficiently, reducing the workload on the main processor and improving overall system performance.

ROM Programmability: FLASH

The flash ROM programmability feature allows for easy and versatile programming of the DSP, enabling quick updates and customization of functions as needed.

Terminal Pitch: 0.4 mm

The small terminal pitch of 0.4 mm enables high-density mounting of the DSP on circuit boards, saving space and optimizing the layout of electronic devices.

Format: FLOATING POINT

Being a floating-point format DSP allows for accurate and efficient processing of real-number data in mathematical calculations, enhancing performance in scientific and engineering applications.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that the DSP can withstand moderate exposure to moisture during manufacturing and assembly processes, ensuring reliability in varied environmental conditions.

Low Power Mode: YES

The low power mode feature allows the DSP to operate with reduced power consumption when optimal performance is not required, maximizing energy efficiency in electronic devices.

On Chip Program ROM Width: 8

With an on-chip program ROM width of 8, the DSP can store code and instructions efficiently, enabling quick access to program data and enhancing overall processing speed.

Technical Specifications

Digital Signal Processors (DSPs) PIC24EP256GU814-I/PH attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

15

No. of External Interrupts:

5

No. of Serial I/Os:

0

No. of Terminals:

144

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP144,.7SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

28672

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Sub-Category:

Microcontrollers

Maximum Supply Current:

320 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

16 mm

Trade Compliance

PIC24EP256GU814-I/PH Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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