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TMS320C6672ACYP25

Texas Instruments

TMS320C6672ACYP25 by Texas Instruments

TMS320C6672ACYP25 by Texas Instruments is a 32-bit DSP with integrated cache, 64-bit external data bus width, and 144 DMA channels. Ideal for digital signal processing applications requiring high-speed data processing and low power consumption. Operates b/w 0-85°C temperature range with a package style of grid array, fine pitch.

Median Price

$170.747

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 88 parts In-Stock

1+ parts

$152.250

100+ parts

$149.220

1k+ parts

$146.180

10k+ parts

-

88

$152.250

$149.220

$146.180

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Texas Instruments

USA . 465 parts In-Stock

1+ parts

$189.244

100+ parts

$171.298

1k+ parts

$163.141

10k+ parts

-

465

$189.244

$171.298

$163.141

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 44 parts In-Stock

1+ parts

$169.406

100+ parts

-

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44

$169.406

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Digiode

USA . 1,203 parts In-Stock

1+ parts

$179.782

100+ parts

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1,203

$179.782

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Vyrian

USA . 7,269 parts In-Stock

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-

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7,269

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 438 parts In-Stock

1+ parts

$15.488

100+ parts

-

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438

$15.488

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Parana Technologies

USA . 1,496 parts In-Stock

1+ parts

$28.799

100+ parts

-

1k+ parts

$51.954

10k+ parts

-

1,496

$28.799

-

$51.954

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DigiPath Technology Company

USA . 339 parts In-Stock

1+ parts

$31.711

100+ parts

-

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339

$31.711

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-

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IDEA Electronic Components Group

UK . 2,193 parts In-Stock

1+ parts

$32.358

100+ parts

$30.740

1k+ parts

$29.122

10k+ parts

-

2,193

$32.358

$30.740

$29.122

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ChromeModa Solutions

Germany . 2,070 parts In-Stock

1+ parts

$32.358

100+ parts

$26.534

1k+ parts

-

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2,070

$32.358

$26.534

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Corohmni

South Africa . 44 parts In-Stock

1+ parts

$45.996

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44

$45.996

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Ampacity Inc.

Singapore . 184 parts In-Stock

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$160.860

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184

$160.860

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Continental Prestige Electronics

USA . 1,783 parts In-Stock

1+ parts

$169.406

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$166.018

1,783

$169.406

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-

$166.018

Corphita

USA . 4,357 parts In-Stock

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$170.320

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4,357

$170.320

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Microchip USA

USA . 2,433 parts In-Stock

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$274.077

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2,433

$274.077

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Argo Parts USA

USA . 4,107 parts In-Stock

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4,107

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

$166.018

1k+ parts

$160.936

10k+ parts

$157.547

1,000

-

$166.018

$160.936

$157.547

Perfect Parts

USA . 39 parts In-Stock

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39

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Overview

Experience the power of cutting-edge technology with the TMS320C6672ACYP25 by Texas Instruments, a top-of-the-line Digital Signal Processor designed for high-performance applications. With integrated cache and low power mode, this processor offers unparalleled efficiency and speed. Whether you're working on advanced audio processing or complex control systems, this product delivers exceptional value and reliability. Trust Texas Instruments to provide quality products that exceed expectations, giving you the edge you need to succeed in today's competitive market. Upgrade to the TMS320C6672ACYP25 and unlock a world of possibilities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the DSP, making it suitable for a variety of environments.

Integrated Cache: YES

The integrated cache helps improve processing speed and efficiency, enhancing the overall performance of the DSP.

Maximum Supply Voltage: 1.155 V

The high maximum supply voltage allows for flexibility in power requirements and can handle varying input voltages effectively.

On Chip Data RAM Width: 8

The wide on-chip data RAM width allows for efficient data processing and storage, enhancing the DSP's capabilities.

Package Shape: SQUARE

The compact square shape of the package helps save space and allows for easier integration into different devices or systems.

Bit Size: 32

The 32-bit architecture offers high computational power and precision for complex signal processing tasks.

Power Supplies (V): 1,1.5,1.8

The availability of multiple power supply options caters to different power requirements and allows for versatile usage.

No. of Terminals: 841

The large number of terminals provides ample connectivity options for interfacing with other components or peripherals.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style enables high-density mounting and reliable connections for efficient signal transmission.

Minimum Supply Voltage: 1.045 V

The low minimum supply voltage helps conserve power and ensures the DSP operates efficiently even at lower power levels.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6672ACYP25 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B841

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

144

No. of Terminals:

841

No. of Timers:

10

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA841,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1,1.5,1.8

Qualification:

Not Qualified

RAM Words:

16384

ROM Programmability:

MROM

Maximum Seated Height:

3.39 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.155 V

Minimum Supply Voltage:

1.045 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6672ACYP25 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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