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TMS320C6414TBCLZ7

Texas Instruments

TMS320C6414TBCLZ7 by Texas Instruments

TMS320C6414TBCLZ7 by Texas Instruments is a 32-bit DSP with integrated cache, 64-bit external data bus width, and 75 MHz max clock frequency. Ideal for digital signal processing applications requiring high-speed data processing and low power consumption. Suitable for use in telecommunications, audio processing, and industrial automation systems.

Median Price

$181.030

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2 parts In-Stock

1+ parts

$138.670

100+ parts

$130.350

1k+ parts

$122.030

10k+ parts

-

2

$138.670

$130.350

$122.030

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DigiKey

USA . 70 parts In-Stock

1+ parts

$223.390

100+ parts

-

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70

$223.390

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Distributors (In-Stock)

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$112.430

100+ parts

-

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500

$112.430

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Digiode

USA . 1,103 parts In-Stock

1+ parts

$118.760

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1,103

$118.760

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Vyrian

USA . 6,653 parts In-Stock

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6,653

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Chip Stock

USA . 925 parts In-Stock

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925

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TME

Poland . 300 parts In-Stock

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$137.510

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300

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$137.510

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Bristol Electronics

USA . 75 parts In-Stock

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75

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Distributors (Availability)

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AZTECH Wire

Italy . 276 parts In-Stock

1+ parts

$13.130

100+ parts

-

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276

$13.130

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Parana Technologies

USA . 494 parts In-Stock

1+ parts

$72.518

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494

$72.518

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Corohmni

South Africa . 323 parts In-Stock

1+ parts

$76.404

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323

$76.404

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ChromeModa Solutions

Germany . 3,815 parts In-Stock

1+ parts

$81.481

100+ parts

$66.814

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-

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3,815

$81.481

$66.814

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IDEA Electronic Components Group

UK . 1,729 parts In-Stock

1+ parts

$81.481

100+ parts

$77.407

1k+ parts

$73.333

10k+ parts

-

1,729

$81.481

$77.407

$73.333

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Ampacity Inc.

Singapore . 6 parts In-Stock

1+ parts

$106.260

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6

$106.260

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Semicontronic

India . 6 parts In-Stock

1+ parts

$106.260

100+ parts

$103.604

1k+ parts

$103.072

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6

$106.260

$103.604

$103.072

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Bastille Electronics

Australia . 10 parts In-Stock

1+ parts

$112.400

100+ parts

$106.780

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-

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$100.036

10

$112.400

$106.780

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$100.036

Continental Prestige Electronics

USA . 1,696 parts In-Stock

1+ parts

$112.430

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-

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$110.181

1,696

$112.430

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$110.181

Corphita

USA . 340 parts In-Stock

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$112.509

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340

$112.509

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Lixinc

USA . 9,971 parts In-Stock

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Argo Parts USA

USA . 1,854 parts In-Stock

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DigiPath Technology Company

USA . 1,321 parts In-Stock

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$73.463

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1,321

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$73.463

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Robosynatics

Brazil . 900 parts In-Stock

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900

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Lucentia Tech

USA . 900 parts In-Stock

1+ parts

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$0.078

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$0.078

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$0.078

900

-

$0.078

$0.078

$0.078

Perfect Parts

USA . 560 parts In-Stock

1+ parts

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560

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Overview

Experience unparalleled performance and efficiency with the TMS320C6414TBCLZ7 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Digital Signal Processors (DSPs) that are perfect for a wide range of applications. With integrated cache, advanced features, and reliable packaging, this DSP offers exceptional value to customers looking to optimize their systems. Trust in Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the TMS320C6414TBCLZ7 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable and affordable.

Integrated Cache: YES

The integrated cache improves processing speed and efficiency, enhancing overall performance.

Maximum Supply Voltage: 1.24 V

The high maximum supply voltage allows for flexibility in power requirements.

Address Bus Width: 20

The wide address bus width enables efficient memory access and data handling.

Package Shape: SQUARE

The square package shape allows for compact and efficient PCB design.

Bit Size: 32

The 32-bit size enhances data processing capabilities and accuracy.

Power Supplies (V): 1.2,3.3

The availability of multiple power supply options enhances compatibility with different systems.

No. of Terminals: 532

The large number of terminals provides extensive connectivity options for peripherals and external devices.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style allows for high-density mounting and space-saving on the PCB.

Minimum Supply Voltage: 1.16 V

The low minimum supply voltage helps in reducing power consumption and improving energy efficiency.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature ensures reliable performance in various environmental conditions.

No. of External Interrupts: 4

The multiple external interrupts allow for efficient handling of external events and real-time processing.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the product can function in a wide range of temperature conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides good electrical conductivity and reliability for long-term use.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy and secure connection to the PCB.

Maximum Seated Height: 3.25 mm

The low maximum seated height allows for compact and slim device designs.

RAM Words: 4096

The ample RAM capacity enables efficient data storage and manipulation for complex processing tasks.

Width: 23 mm

The moderate width provides a good balance between compact size and ease of integration into various systems.

Boundary Scan: YES

The boundary scan feature allows for easy testing and debugging of the product during development and production.

External Data Bus Width: 64

The wide external data bus width enables fast and efficient data transfer between memory and peripherals.

Maximum Clock Frequency: 75 MHz

The high maximum clock frequency allows for fast and real-time data processing.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature helps in preventing damage to the product during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable soldering and durability of the product.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enhances data transfer speed and efficiency within the processor.

Length: 23 mm

The moderate length provides a good balance between compact size and adequate spacing for components on the PCB.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The product's peripheral IC type ensures compatibility with various digital signal processing applications.

No. of Timers: 3

The multiple timers allow for precise timing control and synchronization in different operations.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity for efficient signal processing.

Terminal Form: BALL

The ball terminal form provides secure and reliable connections for stable performance.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage ensures stable and consistent power delivery for optimal performance.

No. of DMA Channels: 64

The large number of DMA channels allows for efficient data transfer and multitasking capabilities.

ROM Programmability: FLASH

The flash ROM programmability offers flexibility in updating and customizing the product's firmware.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high-density mounting and space-saving on the PCB.

Format: FIXED POINT

The fixed-point format is suitable for various signal processing applications requiring precision and accuracy.

Moisture Sensitivity Level (MSL): 4

The moisture sensitivity level ensures proper handling and storage to prevent moisture-related damage.

Low Power Mode: YES

The low power mode option helps in conserving energy and extending the product's battery life.

On Chip Program ROM Width: 8

The on-chip program ROM width offers sufficient space for storing program instructions and data.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6414TBCLZ7 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

532

No. of Timers:

3

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

3.25 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.24 V

Minimum Supply Voltage:

1.16 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6414TBCLZ7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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