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TMS320C6678ACYPA25

Texas Instruments

TMS320C6678ACYPA25 by Texas Instruments

TMS320C6678ACYPA25 by Texas Instruments is a 32-bit DSP with integrated cache, 24-bit address bus width, and 16-bit external data bus width. It is used in industrial applications for digital signal processing tasks due to its low power mode, multiple internal bus architecture, and high number of DMA channels.

Median Price

$322.967

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Texas Instruments

USA . 171 parts In-Stock

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$322.967

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Digiode

USA . 4,274 parts In-Stock

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$306.819

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Nova Conductors

Japan . 870 parts In-Stock

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$356.380

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Chip Stock

USA . 8,750 parts In-Stock

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Vyrian

USA . 2,064 parts In-Stock

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Component Sense

UK . 146 parts In-Stock

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Cyclops Electronics Ltd

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Distributors (Availability)

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AZTECH Wire

Italy . 225 parts In-Stock

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$5.872

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$5.872

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Corohmni

South Africa . 130 parts In-Stock

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$23.538

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Parana Technologies

USA . 2,343 parts In-Stock

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$52.890

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$52.890

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$54.112

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$51.406

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$51.406

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$54.112

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DigiPath Technology Company

USA . 1,044 parts In-Stock

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$58.238

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$53.579

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IDEA Electronic Components Group

UK . 1,440 parts In-Stock

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$59.427

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$56.456

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$53.484

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$59.427

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ChromeModa Solutions

Germany . 1,093 parts In-Stock

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$59.427

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$48.730

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Semicontronic

India . 143 parts In-Stock

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$274.520

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$267.657

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$266.284

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Corphita

USA . 1,419 parts In-Stock

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$290.670

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Continental Prestige Electronics

USA . 6,521 parts In-Stock

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$333.212

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Netroflash

USA . 1,000 parts In-Stock

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$356.380

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Ampacity Inc.

Singapore . 143 parts In-Stock

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$597.490

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QUARKTWIN TECHNOLOGY LTD

USA . 13,522 parts In-Stock

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Lixinc

USA . 11,590 parts In-Stock

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Metaverse IC Inc.

Canada . 5,880 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Authorized Procurement Solutions

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Argo Parts USA

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Modulus Dynamics

Lithuania . 870 parts In-Stock

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Perfect Parts

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Robosynatics

Brazil . 300 parts In-Stock

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Lucentia Tech

USA . 300 parts In-Stock

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Kepictronics

USA . 255 parts In-Stock

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iodParts Technologies Inc.

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GreenTree Electronics

Israel . 71 parts In-Stock

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Overview

Experience unparalleled performance and efficiency with the TMS320C6678ACYPA25 by Texas Instruments, a leading manufacturer in digital signal processors. This versatile DSP is ideal for applications requiring high-speed data processing, such as telecommunications, industrial automation, and medical imaging. With integrated cache memory and multiple peripheral IC types, this product offers unmatched value and benefits to customers looking to optimize their systems. Trust Texas Instruments to deliver cutting-edge technology that meets your most demanding requirements.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components as it provides good insulation and protection for the sensitive internal components of the DSP.

Integrated Cache: YES

Having an integrated cache helps improve the overall performance and efficiency of the DSP by reducing the need to access external memory for frequently used data.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly onto circuit boards, saving space and simplifying the production process.

Bit Size: 32

A larger bit size allows for more complex calculations and processing capabilities, making this DSP suitable for handling advanced digital signal processing tasks.

Technology: CMOS

CMOS technology is known for its low power consumption, making this DSP energy efficient and suitable for applications where power efficiency is crucial.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6678ACYPA25 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B841

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

80

No. of Terminals:

841

No. of Timers:

16

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA841,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1,1.5,1.8

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.39 mm

Sub-Category:

Digital Signal Processors

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6678ACYPA25 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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