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TMS320C6678ACYP

Texas Instruments

TMS320C6678ACYP by Texas Instruments

TMS320C6678ACYP by Texas Instruments is a 32-bit DSP with integrated cache, 16 external data bus width, and 80 DMA channels. Ideal for digital signal processing applications requiring low power mode and floating-point format. Package style is grid array with fine pitch, suitable for surface mount assembly.

Median Price

$260.875

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 15,248 parts In-Stock

1+ parts

$215.311

100+ parts

$194.894

1k+ parts

$185.613

10k+ parts

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15,248

$215.311

$194.894

$185.613

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Rochester

USA . 1 parts In-Stock

1+ parts

$255.330

100+ parts

$240.010

1k+ parts

$224.690

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-

1

$255.330

$240.010

$224.690

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DigiKey

USA . 1 parts In-Stock

1+ parts

$319.160

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-

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1

$319.160

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Mouser Electronics

USA . 2 parts In-Stock

1+ parts

$363.580

100+ parts

$295.740

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2

$363.580

$295.740

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Verical

USA . 3 parts In-Stock

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-

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$260.875

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$244.225

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$260.875

$244.225

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Distributors (In-Stock)

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Digiode

USA . 4,212 parts In-Stock

1+ parts

$204.545

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4,212

$204.545

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Nova Conductors

Japan . 31 parts In-Stock

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$236.990

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31

$236.990

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Vyrian

USA . 8,946 parts In-Stock

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DigiKey Marketplace

USA . 4 parts In-Stock

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4

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Distributors (Availability)

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Advanced Electronics

New Zealand . 700 parts In-Stock

1+ parts

$30.333

100+ parts

$27.603

1k+ parts

$24.873

10k+ parts

-

700

$30.333

$27.603

$24.873

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Parana Technologies

USA . 1,599 parts In-Stock

1+ parts

$60.391

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-

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1,599

$60.391

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ChromeModa Solutions

Germany . 6,293 parts In-Stock

1+ parts

$67.855

100+ parts

$55.641

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6,293

$67.855

$55.641

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IDEA Electronic Components Group

UK . 1,515 parts In-Stock

1+ parts

$67.855

100+ parts

$64.462

1k+ parts

$61.070

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1,515

$67.855

$64.462

$61.070

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Corohmni

South Africa . 433 parts In-Stock

1+ parts

$85.848

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433

$85.848

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Semicontronic

India . 2,885 parts In-Stock

1+ parts

$183.010

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$178.435

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$177.520

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2,885

$183.010

$178.435

$177.520

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Ampacity Inc.

Singapore . 2,793 parts In-Stock

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$183.010

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2,793

$183.010

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Corphita

USA . 3,335 parts In-Stock

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$193.780

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3,335

$193.780

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Continental Prestige Electronics

USA . 4,893 parts In-Stock

1+ parts

$210.780

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$206.565

4,893

$210.780

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$206.565

A-Z Elektronik GmbH

Germany . 6,308 parts In-Stock

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Lixinc

USA . 5,749 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Argo Parts USA

USA . 2,645 parts In-Stock

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Kepictronics

USA . 1,000 parts In-Stock

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GreenTree Electronics

Israel . 800 parts In-Stock

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Perfect Parts

USA . 345 parts In-Stock

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DigiPath Technology Company

USA . 271 parts In-Stock

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$61.178

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271

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$61.178

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Overview

Experience unparalleled performance and efficiency with the TMS320C6678ACYP by Texas Instruments, a cutting-edge digital signal processor that delivers superior processing power for a wide range of applications. With Texas Instruments' renowned reputation for quality and innovation, this DSP offers customers unmatched value and benefits. Whether you're in need of high-speed data processing, advanced signal processing, or complex algorithm computations, the TMS320C6678ACYP is the ideal solution to meet your needs. Upgrade your system today and stay ahead of the competition with this state-of-the-art DSP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Integrated Cache: YES

Having an integrated cache improves processing speed and efficiency.

Surface Mount: YES

Surface mount technology allows for efficient and compact circuit board design.

Address Bus Width: 24

A wider address bus allows for better memory addressing capabilities.

Bit Size: 32

32-bit processing offers higher precision and performance compared to lower bit sizes.

Power Supplies (V): 1,1.5,1.8

Supporting multiple power supply options allows for flexibility in different applications.

No. of Terminals: 841

Having a high number of terminals enables connectivity with various other components in a system.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style allows for high-density mounting and space efficiency.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand demanding environmental conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures ensures versatility in different operating environments.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper terminal finish provides excellent conductivity and corrosion resistance.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and convenient mounting on a circuit board.

Maximum Seated Height: 3.39 mm

A low seated height contributes to a compact and slim design of the product.

RAM Words: 8192

A large RAM capacity enables efficient data storage and processing.

Width: 24 mm

The compact width makes the product suitable for space-constrained applications.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the product during the manufacturing process.

External Data Bus Width: 16

A wider external data bus allows for faster data transfer between the processor and external components.

Maximum Time At Peak Reflow Temperature (s): 30

Support for a peak reflow temperature duration of 30 seconds ensures proper soldering during assembly.

Peak Reflow Temperature °C: 245

The high peak reflow temperature ensures reliable solder joints during the assembly process.

Internal Bus Architecture: MULTIPLE

A multiple internal bus architecture improves data transfer speeds and efficiency within the processor.

Length: 24 mm

The compact length of the product enables space-saving and versatile installation options.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Support for various peripheral IC types enhances the product's compatibility with different systems and devices.

No. of Timers: 16

Having multiple timers allows for efficient time-based operations and scheduling within the processor.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the product's overall performance.

Terminal Form: BALL

Ball terminal form provides secure solder joints and reliable connectivity.

No. of DMA Channels: 80

A high number of DMA channels enables efficient data transfer between memory and other peripherals.

Terminal Pitch: 0.8 mm

A small terminal pitch allows for high-density mounting and space-efficient design.

Format: FLOATING POINT

Support for floating-point format enhances the processor's ability to handle complex mathematical operations.

Moisture Sensitivity Level (MSL): 4

Having MSL 4 ensures that the product can withstand moderate levels of moisture exposure during handling and storage.

Low Power Mode: YES

The support for low power mode helps in reducing power consumption and extending battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6678ACYP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B841

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

80

No. of Terminals:

841

No. of Timers:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA841,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1,1.5,1.8

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.39 mm

Sub-Category:

Digital Signal Processors

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6678ACYP Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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