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DSPIC30F2010-30I/SPG

Microchip Technology

DSPIC30F2010-30I/SPG by Microchip Technology

DSPIC30F2010-30I/SPG by Microchip is a 16-bit DSP with 40 MHz clock speed, 512 RAM words, and 1K data EEPROM size. Ideal for industrial applications, it features 6-Ch 10-Bit ADC channels, PWM(8), and connectivity options like I2C, SPI, UART. With low power mode and barrel shifter capabilities, it offers efficient processing in a compact form factor.

Median Price

$5.102

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$5.102

100+ parts

-

1k+ parts

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100

$5.102

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Vyrian

USA . 818 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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818

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

iodParts Technologies Inc.

India . 287 parts In-Stock

1+ parts

$2.590

100+ parts

$2.180

1k+ parts

-

10k+ parts

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287

$2.590

$2.180

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$5.000

100+ parts

-

1k+ parts

$4.800

10k+ parts

-

100

$5.000

-

$4.800

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Continental Prestige Electronics

USA . 3,373 parts In-Stock

1+ parts

$5.102

100+ parts

-

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$5.000

3,373

$5.102

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-

$5.000

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$5.204

100+ parts

$5.204

1k+ parts

$5.204

10k+ parts

-

500

$5.204

$5.204

$5.204

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AZTECH Wire

Italy . 192 parts In-Stock

1+ parts

$17.840

100+ parts

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192

$17.840

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Ampacity Inc.

Singapore . 463 parts In-Stock

1+ parts

$28.000

100+ parts

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463

$28.000

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Aztec Data Supply Inc.

USA . 1,115 parts In-Stock

1+ parts

$29.020

100+ parts

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1,115

$29.020

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Semicontronic

India . 749 parts In-Stock

1+ parts

$32.000

100+ parts

$31.200

1k+ parts

$31.040

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749

$32.000

$31.200

$31.040

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Corohmni

South Africa . 1,203 parts In-Stock

1+ parts

$52.247

100+ parts

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1,203

$52.247

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Argo Parts USA

USA . 3,888 parts In-Stock

1+ parts

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3,888

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West Coast Incorporated

USA . 3,722 parts In-Stock

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3,722

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Overview

Unleash the power of digital signal processing with the DSPIC30F2010-30I/SPG by Microchip Technology. Designed with cutting-edge technology and superior quality, this DSP offers unmatched performance for a wide range of applications. From industrial automation to consumer electronics, this product delivers exceptional value and benefits to customers looking for high-speed processing, low power consumption, and seamless connectivity. Elevate your projects to the next level with the DSPIC30F2010-30I/SPG and experience the difference that Microchip Technology brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package body, ensuring protection for the internal components.

Maximum Supply Voltage: 5.5 V

Allows for a wide range of supply voltage, making the product versatile for various applications.

On Chip Data RAM Width: 8

Provides sufficient on-chip data RAM width for efficient processing and data handling.

Screening Level: TS 16949

Compliance with TS 16949 screening level ensures high quality and reliability in performance.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of space and easy integration into different systems.

Bit Size: 16

With a bit size of 16, the product can handle complex computations and processing tasks effectively.

Power Supplies (V): 3/5

Supports multiple power supply options (3V/5V), offering flexibility in power management.

No. of Terminals: 28

Sufficient number of terminals for connectivity and interfacing with other components or peripherals.

Package Style (Meter): IN-LINE

In-line package style allows for easy installation and integration in a system.

Minimum Supply Voltage: 2.5 V

Low minimum supply voltage requirement for efficient power consumption.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, suitable for industrial applications.

No. of External Interrupts: 3

Multiple external interrupts for handling real-time events and prioritizing tasks.

Minimum Operating Temperature: -40 °C

Can operate in low-temperature environments, increasing the product's usability in various conditions.

Terminal Finish: MATTE TIN

Matte tin finish for terminals provides corrosion resistance and good solderability.

ADC Channels: YES

Presence of ADC channels enables analog signal processing and conversion.

Terminal Position: DUAL

Dual terminal position for enhanced stability and secure connections.

ROM Words: 4096

Large ROM capacity for storing program instructions and data.

Maximum Seated Height: 5.08 mm

Compact and low-profile design with a maximum seated height of 5.08mm for space-constrained applications.

RAM Words: 512

Adequate RAM capacity for data storage and processing tasks.

Width: 7.62 mm

Slim and compact width of 7.62mm for easy fitting in various systems.

Data EEPROM Size: 1K

1K data EEPROM size for storing non-volatile data and parameters.

Peripherals: BOD, POR, PWM(8), QEI, TIMER(3), WDT

Diverse set of peripherals including brown-out detection, power-on reset, PWM channels, quadrature encoder interface, timers, and watchdog timer for enhanced functionality.

Maximum Clock Frequency: 40 MHz

High maximum clock frequency of 40MHz for fast and efficient processing of instructions.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture for efficient data transfer and processing.

Length: 34.671 mm

Optimal length of 34.671mm for fitting in different system layouts.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature grade for reliable performance in harsh operating conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Designed as a digital signal processor with other peripheral functionalities for versatile applications.

No. of Timers: 3

Multiple timers for scheduling tasks, events, and control operations.

RAM Bytes: 512

512 RAM bytes for temporary data storage and processing operations.

Technology: CMOS

CMOS technology for low power consumption and efficient operation.

Terminal Form: THROUGH-HOLE

Through-hole terminal form for secure mounting and reliable connections.

Analog To Digital Convertors: 6-Ch 10-Bit

Six-channel 10-bit ADC for accurate analog to digital conversion.

Maximum Supply Current: 300 mA

Supports a maximum supply current of 300mA for efficient power usage.

Nominal Supply Voltage: 3 V

Nominal supply voltage of 3V for stable and consistent operation.

PWM Channels: YES

Presence of Pulse Width Modulation channels for controlling signal amplitude and duty cycle.

Connectivity: I2C, SPI, UART

Multiple connectivity options including I2C, SPI, and UART for interfacing with various devices and components.

ROM Programmability: FLASH

Flash memory for programmability, allowing for easy updates and modifications of firmware.

Terminal Pitch: 2.54 mm

Standard terminal pitch of 2.54mm for compatibility with commonly used connectors and PCB layouts.

Format: FLOATING POINT

Floating-point format support for handling decimal numbers with precision.

Speed: 30 rpm

Operates at a speed of 30 revolutions per minute, suitable for motor control applications.

Low Power Mode: YES

Includes a low power mode for energy-efficient operation and extended battery life.

Barrel Shifter: YES

Barrel shifter functionality for efficient shifting of data operands.

On Chip Program ROM Width: 24

Generous on-chip program ROM width of 24 for storing program instructions.

No. of I/O Lines: 20

Adequate number of I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC30F2010-30I/SPG attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

NO

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e3

Length:

34.671 mm

Low Power Mode:

YES

No. of External Interrupts:

3

No. of I/O Lines:

20

No. of Terminals:

28

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

512

RAM Words:

512

ROM Words:

4096

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

5.08 mm

Speed:

30 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

300 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

I2C, SPI, UART

Peripherals:

BOD, POR, PWM(8), QEI, TIMER(3), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

DSPIC30F2010-30I/SPG Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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