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TMS320F2811PBKS

Texas Instruments

TMS320F2811PBKS by Texas Instruments

TMS320F2811PBKS by Texas Instruments is a 32-bit DSP with 150 MHz clock frequency, 18432 RAM words, and 8 timers. Ideal for automotive applications due to AEC-Q100 screening level and low power mode. Features include 3 external interrupts, ADC channels, and PWM channels for versatile signal processing tasks.

Median Price

$42.560

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 753 parts In-Stock

1+ parts

$25.520

100+ parts

$22.685

1k+ parts

$16.680

10k+ parts

-

753

$25.520

$22.685

$16.680

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Mouser Electronics

USA . 235 parts In-Stock

1+ parts

$42.560

100+ parts

$30.960

1k+ parts

-

10k+ parts

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235

$42.560

$30.960

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DigiKey

USA . 1,078 parts In-Stock

1+ parts

$42.740

100+ parts

$30.965

1k+ parts

$29.732

10k+ parts

-

1,078

$42.740

$30.965

$29.732

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,292 parts In-Stock

1+ parts

$24.244

100+ parts

-

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-

10k+ parts

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1,292

$24.244

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-

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$30.420

100+ parts

-

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100

$30.420

-

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Chip Stock

USA . 7,400 parts In-Stock

1+ parts

-

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7,400

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Sensible Micro Corp

USA . 1,242 parts In-Stock

1+ parts

-

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1,242

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Cyclops Electronics Ltd

UK . 1,242 parts In-Stock

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1,242

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Vyrian

USA . 1,024 parts In-Stock

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1,024

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ComSIT Distribution GmbH

Germany . 932 parts In-Stock

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932

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PC Components Company LLC

USA . 8 parts In-Stock

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8

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Bristol Electronics

USA . 8 parts In-Stock

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8

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Distributors (Availability)

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Ampacity Inc.

Singapore . 893 parts In-Stock

1+ parts

$21.690

100+ parts

-

1k+ parts

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893

$21.690

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Semicontronic

India . 751 parts In-Stock

1+ parts

$21.690

100+ parts

$21.148

1k+ parts

$21.039

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751

$21.690

$21.148

$21.039

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Corphita

USA . 365 parts In-Stock

1+ parts

$22.968

100+ parts

-

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365

$22.968

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Continental Prestige Electronics

USA . 2,170 parts In-Stock

1+ parts

$28.512

100+ parts

-

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$27.942

2,170

$28.512

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-

$27.942

Corohmni

South Africa . 895 parts In-Stock

1+ parts

$29.023

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895

$29.023

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$29.812

100+ parts

-

1k+ parts

$28.619

10k+ parts

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100

$29.812

-

$28.619

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$29.894

100+ parts

$28.399

1k+ parts

$28.399

10k+ parts

-

1,000

$29.894

$28.399

$28.399

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Parana Technologies

USA . 784 parts In-Stock

1+ parts

$63.984

100+ parts

$5,941.874

1k+ parts

$57.585

10k+ parts

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784

$63.984

$5,941.874

$57.585

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DigiPath Technology Company

USA . 480 parts In-Stock

1+ parts

$70.454

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480

$70.454

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ChromeModa Solutions

Germany . 3,276 parts In-Stock

1+ parts

$71.892

100+ parts

$58.951

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3,276

$71.892

$58.951

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IDEA Electronic Components Group

UK . 2,049 parts In-Stock

1+ parts

$71.892

100+ parts

$68.297

1k+ parts

$64.703

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2,049

$71.892

$68.297

$64.703

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Microchip USA

USA . 5,490 parts In-Stock

1+ parts

$77.740

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5,490

$77.740

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QUARKTWIN TECHNOLOGY LTD

USA . 21,110 parts In-Stock

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Lixinc

USA . 17,901 parts In-Stock

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GreenTree Electronics

Israel . 5,720 parts In-Stock

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5,720

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Argo Parts USA

USA . 799 parts In-Stock

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799

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Perfect Parts

USA . 188 parts In-Stock

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188

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Overview

Unlock the power of advanced signal processing with the TMS320F2811PBKS by Texas Instruments. Designed for efficiency and reliability, this Digital Signal Processor (DSP) offers exceptional performance across a wide range of applications. With a focus on quality and innovation, Texas Instruments ensures that their products deliver unmatched value and benefits to customers. Whether you're working in automotive, industrial control, or telecommunications, the TMS320F2811PBKS provides the cutting-edge technology you need to stay ahead of the curve. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

Durable material for the package body ensures product longevity and reliability.

Surface Mount - YES

Surface mount capability allows for easy and compact integration onto circuit boards.

Maximum Supply Voltage - 2 V

Operates efficiently with a maximum supply voltage of 2V.

On Chip Data RAM Width - 16

16-bit width for on-chip data RAM provides efficient processing capabilities.

Screening Level - AEC-Q100

AEC-Q100 screening level ensures automotive industry compliance and reliability.

Package Shape - SQUARE

Square package shape allows for easy placement and mounting on circuit boards.

Bit Size - 32

32-bit architecture provides high performance and processing capabilities.

Power Supplies (V) - 1.8,3.3

Supports multiple power supplies for flexible voltage requirements.

No. of Terminals - 128

Large number of terminals for versatile connectivity options.

Package Style (Meter) - FLATPACK, LOW PROFILE, FINE PITCH

Multiple package styles for varied installation and mounting needs.

Minimum Supply Voltage - 1.81 V

Operates efficiently with a low minimum supply voltage of 1.81V.

Maximum Operating Temperature - 125 °C

Can withstand high operating temperatures, suitable for automotive applications.

CPU Family - C28X

C28X CPU family provides advanced processing capabilities for a wide range of applications.

No. of External Interrupts - 3

Support for 3 external interrupts allows for efficient handling of external events.

Minimum Operating Temperature - -40 °C

Can operate in extremely low temperatures, suitable for harsh environments.

Terminal Finish - NICKEL PALLADIUM GOLD

High-quality terminal finish for reliable connectivity and long-term performance.

ADC Channels - YES

Integrated ADC channels for analog signal processing capabilities.

Terminal Position - QUAD

Quad terminal position for secure and stable connection on circuit boards.

Maximum Seated Height - 1.6 mm

Low profile design with maximum seated height of 1.6mm for compact installations.

RAM Words - 18432

Large RAM capacity of 18432 words for efficient data processing and storage.

Width - 14 mm

Compact width of 14mm for space-saving integration in electronic devices.

Boundary Scan - YES

Supports boundary scan technology for efficient testing and debugging.

Maximum Clock Frequency - 150 MHz

High clock frequency of 150MHz for fast processing and response times.

Maximum Time At Peak Reflow Temperature (s) - 30

30-second maximum time at peak reflow temperature for reliable soldering.

Peak Reflow Temperature °C - 260

Can withstand high peak reflow temperature of 260°C for manufacturing processes.

Internal Bus Architecture - MULTIPLE

Multiple internal bus architecture for efficient data transfer and communication.

Length - 14 mm

Compact length of 14mm for space-efficient design and integration.

Temperature Grade - AUTOMOTIVE

Automotive-grade temperature rating for reliable performance in automotive applications.

Peripheral IC Type - DIGITAL SIGNAL PROCESSOR, OTHER

Specialized peripheral IC type for digital signal processing tasks and other functions.

No. of Timers - 8

Support for 8 timers for time-sensitive tasks and event scheduling.

RAM Bytes - 36864

Large RAM capacity of 36864 bytes for efficient data processing and storage.

Technology - CMOS

CMOS technology for low power consumption and high-speed performance.

Terminal Form - GULL WING

Gull wing terminal form for secure and reliable connection on circuit boards.

Maximum Supply Current - 230 mA

Low supply current of 230mA for energy-efficient operation.

Nominal Supply Voltage - 1.9 V

Nominal supply voltage of 1.9V for stable and optimal performance.

PWM Channels - YES

Support for PWM channels for precise control of analog signals.

ROM Programmability - OTPROM

Programmable ROM using OTPROM technology for secure and permanent data storage.

Terminal Pitch - 0.4 mm

Fine terminal pitch of 0.4mm for compact and high-density circuit board designs.

Format - FIXED POINT

Fixed-point format for efficient and accurate numerical computations.

Moisture Sensitivity Level (MSL) - 2

Moisture sensitivity level of 2 for robust performance in varying environmental conditions.

Low Power Mode - YES

Low power mode feature for energy-saving operation and extended battery life.

On Chip Program ROM Width - 16

16-bit width for on-chip program ROM for efficient program storage and execution.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F2811PBKS attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 SUPPLY AT 135MHZ

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

150 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G128

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of External Interrupts:

3

No. of Terminals:

128

No. of Timers:

8

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.64SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

36864

RAM Words:

18432

ROM Programmability:

OTPROM

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

230 mA

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.81 V

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TMS320F2811PBKS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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