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DSP56321VL200

NXP Semiconductors

DSP56321VL200 by NXP Semiconductors

NXP Semiconductors' DSP56321VL200 is a 200 MHz DSP with 24-bit external data bus width and 18-bit address bus width. Ideal for digital signal processing applications, it features low power mode, barrel shifter, and boundary scan capability.

Median Price

$131.480

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

DSP56321VL200 by NXP Semiconductors
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DigiKey

USA . 201 parts In-Stock

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Flip Electronics (Authorized)

USA . 201 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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$131.480

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Digiode

USA . 3,663 parts In-Stock

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Anansix

USA . 2,448 parts In-Stock

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Flip Electronics

USA . 709 parts In-Stock

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Vyrian

USA . 96 parts In-Stock

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Manotoh

Italy . 5 parts In-Stock

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Inventory MP

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Bristol Electronics

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Distributors (Availability)

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AZTECH Wire

Italy . 737 parts In-Stock

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$17.040

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$17.040

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Semicontronic

India . 49 parts In-Stock

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$23.000

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$22.425

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$22.310

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Ampacity Inc.

Singapore . 201 parts In-Stock

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$28.000

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One Stop Electronics

USA . 45 parts In-Stock

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$32.000

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Advanced Electronics

New Zealand . 650 parts In-Stock

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$36.463

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$33.181

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$29.900

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Corohmni

South Africa . 60 parts In-Stock

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$42.219

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Microchip USA

USA . 161 parts In-Stock

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$95.309

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Continental Prestige Electronics

USA . 6,682 parts In-Stock

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$131.480

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$128.850

6,682

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$128.850

A-Z Elektronik GmbH

Germany . 4,688 parts In-Stock

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Corphita

USA . 3,538 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,125 parts In-Stock

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Perfect Parts

USA . 2,399 parts In-Stock

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UNI Independent Distributors

Spain . 2,040 parts In-Stock

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Argo Parts USA

USA . 1,689 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$128.850

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$124.906

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$122.276

500

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$128.850

$124.906

$122.276

Overview

Unlock unparalleled performance and efficiency with the NXP Semiconductors DSP56321VL200 Digital Signal Processor. Manufactured by a trusted industry leader, this cutting-edge DSP offers unmatched speed and reliability for a wide range of applications. From audio processing to telecommunications, this product delivers exceptional value and benefits to customers seeking top-tier quality in their electronic devices. Experience the advantage of superior technology with the DSP56321VL200 by NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the DSP, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy integration onto PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 1.7 V

Operates efficiently with low power consumption, making it suitable for portable devices.

Address Bus Width: 18

Provides a wide range of memory addressing capabilities, allowing for complex signal processing tasks.

Package Shape: SQUARE

Optimal shape for efficient PCB layout and space utilization.

No. of Terminals: 196

Offers a high level of connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE

Enables a compact form factor for applications where space is limited.

Minimum Supply Voltage: 1.5 V

Allows for operation at low power levels, reducing energy consumption.

Terminal Finish: TIN SILVER COPPER

Ensures reliable electrical connections and corrosion resistance for long-term performance.

Terminal Position: BOTTOM

Facilitates easy access and soldering during assembly processes.

Maximum Seated Height: 1.6 mm

Low profile design for compact and slim device designs.

Width: 15 mm

Compact dimensions for space-constrained applications.

Boundary Scan: YES

Allows for efficient testing and debugging of the DSP during production and maintenance.

External Data Bus Width: 24

Provides high-speed data transfer capabilities for handling complex signal processing tasks.

Maximum Clock Frequency: 200 MHz

Enables fast processing speeds for real-time signal processing applications.

Maximum Time At Peak Reflow Temperature (s): 40

Ensures reliable soldering connections during the assembly process for long-lasting performance.

Peak Reflow Temperature °C: 260

Withstands high-temperature reflow soldering processes for robust assembly.

Internal Bus Architecture: MULTIPLE

Enhances parallel processing capabilities for handling multiple data streams efficiently.

Length: 15 mm

Compact dimensions for space-restricted applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile IC type for a wide range of signal processing applications.

Technology: CMOS

Energy-efficient technology for low power consumption and high performance.

Terminal Form: BALL

Facilitates easy soldering and strong electrical connections during assembly.

Nominal Supply Voltage: 1.6 V

Optimal voltage level for efficient and reliable operation.

Terminal Pitch: 1 mm

Fine pitch for compact layout and high-density integration on PCBs.

Format: FIXED POINT

Suitable for applications requiring precise numerical calculations and processing.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate levels of moisture exposure for extended product life.

Low Power Mode: YES

Provides power-saving options for energy-efficient operation in battery-powered devices.

Barrel Shifter: YES

Enhances computational efficiency for arithmetic and logical operations in signal processing tasks.

Technical Specifications

Digital Signal Processors (DSPs) DSP56321VL200 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from NXP Semiconductors

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

18

Barrel Shifter:

YES

Boundary Scan:

YES

Maximum Clock Frequency:

200 MHz

External Data Bus Width:

24

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

196

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.7 V

Minimum Supply Voltage:

1.5 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

15 mm

Peripheral IC Type:

Trade Compliance

DSP56321VL200 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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