Loading...

DSP56311VL150R2

NXP Semiconductors

DSP56311VL150R2 by NXP Semiconductors

NXP Semiconductors' DSP56311VL150R2 is a 150 MHz DSP with 18-bit address bus and 24-bit external data bus. Ideal for digital signal processing applications, it features low power mode, barrel shifter, and CMOS technology for efficient performance in a compact square package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

DSP56311VL150R2 by NXP Semiconductors
Compare Share

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 344 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

344

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,006 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,006

-

-

-

-

Flip Electronics

USA . 344 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

344

-

-

-

-

Anansix

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

250

-

-

-

-

Digiode

USA . 235 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

235

-

-

-

-

Nova Conductors

Japan . 29 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

29

-

-

-

-

Speed Components Ltd

Israel . 2 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 543 parts In-Stock

1+ parts

$8.370

100+ parts

-

1k+ parts

-

10k+ parts

-

543

$8.370

-

-

-

Semicontronic

India . 135 parts In-Stock

1+ parts

$15.000

100+ parts

$14.625

1k+ parts

$14.550

10k+ parts

-

135

$15.000

$14.625

$14.550

-

Ampacity Inc.

Singapore . 114 parts In-Stock

1+ parts

$15.000

100+ parts

-

1k+ parts

-

10k+ parts

-

114

$15.000

-

-

-

One Stop Electronics

USA . 133 parts In-Stock

1+ parts

$30.000

100+ parts

-

1k+ parts

-

10k+ parts

-

133

$30.000

-

-

-

Corohmni

South Africa . 312 parts In-Stock

1+ parts

$31.989

100+ parts

-

1k+ parts

-

10k+ parts

-

312

$31.989

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 19,488 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19,488

-

-

-

-

Continental Prestige Electronics

USA . 6,149 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,149

-

-

-

-

Microchip USA

USA . 5,278 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,278

-

-

-

-

Corphita

USA . 3,390 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,390

-

-

-

-

Argo Parts USA

USA . 1,791 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,791

-

-

-

-

UNI Independent Distributors

Spain . 230 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

230

-

-

-

-

Bastille Electronics

Australia . 40 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

40

-

-

-

-

Overview

Unlock the power of digital signal processing with the DSP56311VL150R2 by NXP Semiconductors. This top-of-the-line DSP offers unparalleled performance and reliability, thanks to the expertise of its manufacturer. Ideal for a wide range of applications, this DSP delivers exceptional value to customers seeking cutting-edge technology. Experience the benefits of high-speed processing, low power consumption, and versatile features that set this product apart from the competition. Upgrade your project with the DSP56311VL150R2 and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and resistant to damage during handling and transport.

Surface Mount: YES

Surface mount technology allows for efficient and compact assembly of the product on PCBs, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 1.9 V

Higher maximum supply voltage allows for increased flexibility in power supply design and compatibility with a wider range of systems.

Address Bus Width: 18

Wider address bus width enables the processor to access a larger memory space, improving overall performance and capabilities of the product.

Package Shape: SQUARE

Square package shape provides efficient use of space on the PCB and allows for easier integration into the overall system design.

No. of Terminals: 196

Higher number of terminals allows for more connections and interfaces, enabling the product to support a variety of input/output options and communication protocols.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The grid array and low profile package style offers better thermal performance and easier PCB mounting, enhancing the overall reliability and lifespan of the product.

Minimum Supply Voltage: 1.7 V

Lower minimum supply voltage helps in reducing power consumption and extending battery life in portable devices where power efficiency is critical.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Tin/Silver/Copper terminal finish provides good conductivity and corrosion resistance, ensuring reliable electrical connections and long-term performance of the product.

Terminal Position: BOTTOM

Bottom terminal position allows for easier PCB routing and assembly, simplifying the manufacturing process and reducing the risk of damage during installation.

Maximum Seated Height: 1.6 mm

Low maximum seated height minimizes the overall profile of the product, making it suitable for compact devices and applications with limited space.

Width: 15 mm

Compact width dimension enables the product to be integrated into small form factor designs, providing flexibility in system layout and space-constrained environments.

Boundary Scan: YES

Boundary scan feature facilitates in-system debugging and testing, improving product quality, reliability, and reducing maintenance costs.

External Data Bus Width: 24

Wider external data bus width allows for faster data transfer rates and improved performance in processing large data sets, enhancing the overall efficiency of the product.

Maximum Clock Frequency: 150 MHz

High maximum clock frequency provides fast processing speed and real-time operation, making the product suitable for demanding applications requiring quick response times.

Maximum Time At Peak Reflow Temperature (s): 40

The specified reflow temperature profile ensures reliable soldering and component integrity during manufacturing, leading to high-quality and durable end products.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance allows for robust solder joint formation and reliable assembly of the product, ensuring long-term performance and durability.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data processing efficiency and throughput, enabling the product to handle complex algorithms and computations with high accuracy and speed.

Length: 15 mm

Compact length dimension contributes to the overall small form factor of the product, making it suitable for space-constrained applications and compact electronic devices.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The digital signal processor with additional peripheral functionalities offers versatile processing capabilities and support for a wide range of signal processing applications in various industries.

Technology: CMOS

CMOS technology provides low power consumption and high integration density, resulting in energy-efficient operation and compact design of the product.

Terminal Form: BALL

Ball terminal form enables easy soldering and reliable interconnection with the PCB, ensuring secure electrical connections and robust mechanical strength of the product.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage ensures consistent and reliable operation of the product under varying load conditions, enhancing its overall performance and longevity.

Terminal Pitch: 1 mm

Fine terminal pitch allows for high-density mounting and compact layout on the PCB, improving the overall efficiency of the product design and assembly process.

Format: FIXED POINT

Fixed-point format offers efficient arithmetic operations and precise calculations for digital signal processing tasks, ensuring high accuracy and quality of signal processing outputs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, requiring proper handling and storage to prevent moisture-related damage, ensuring the reliability and performance of the product.

Low Power Mode: YES

Low power mode feature allows for energy-efficient operation and extended battery life, making the product suitable for portable and power-sensitive applications.

Barrel Shifter: YES

Barrel shifter functionality enhances data manipulation and processing capabilities, enabling efficient and flexible data handling operations in the product.

Technical Specifications

Digital Signal Processors (DSPs) DSP56311VL150R2 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from NXP Semiconductors

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

18

Barrel Shifter:

YES

Boundary Scan:

YES

Maximum Clock Frequency:

150 MHz

External Data Bus Width:

24

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

196

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

15 mm

Peripheral IC Type:

Trade Compliance

DSP56311VL150R2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20