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DSPIC33EP512GM710-E/PF

Microchip Technology

DSPIC33EP512GM710-E/PF by Microchip Technology

DSPIC33EP512GM710-E/PF by Microchip Technology is a 16-bit digital signal processor with 60 MHz clock frequency, 49152 RAM words, and 3.3V supply voltage. Ideal for automotive applications, it features 15 timers, 4 DMA channels, and FLASH ROM programmability for efficient processing in a compact thin profile package.

Median Price

$10.550

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 20 parts In-Stock

1+ parts

$9.346

100+ parts

-

1k+ parts

-

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20

$9.346

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-

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DigiKey

USA . 474 parts In-Stock

1+ parts

$10.550

100+ parts

$8.750

1k+ parts

-

10k+ parts

-

474

$10.550

$8.750

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-

Microchip Technology

USA . 350 parts In-Stock

1+ parts

$10.550

100+ parts

$8.750

1k+ parts

$8.060

10k+ parts

$7.650

350

$10.550

$8.750

$8.060

$7.650

Verical

USA . 660 parts In-Stock

1+ parts

-

100+ parts

$13.286

1k+ parts

-

10k+ parts

-

660

-

$13.286

-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$9.637

100+ parts

-

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10

$9.637

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-

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Vyrian

USA . 5,787 parts In-Stock

1+ parts

-

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5,787

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 420 parts In-Stock

1+ parts

$7.390

100+ parts

$7.205

1k+ parts

$7.168

10k+ parts

-

420

$7.390

$7.205

$7.168

-

Continental Prestige Electronics

USA . 4,206 parts In-Stock

1+ parts

$9.637

100+ parts

-

1k+ parts

-

10k+ parts

$9.445

4,206

$9.637

-

-

$9.445

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$9.637

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

$9.637

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-

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Corohmni

South Africa . 427 parts In-Stock

1+ parts

$38.791

100+ parts

-

1k+ parts

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10k+ parts

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427

$38.791

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Aztec Data Supply Inc.

USA . 132 parts In-Stock

1+ parts

$66.510

100+ parts

-

1k+ parts

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10k+ parts

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132

$66.510

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Lixinc

USA . 16,866 parts In-Stock

1+ parts

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16,866

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West Coast Incorporated

USA . 1,653 parts In-Stock

1+ parts

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100+ parts

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1,653

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Argo Parts USA

USA . 1,253 parts In-Stock

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100+ parts

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1,253

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Overview

Discover the cutting-edge DSPIC33EP512GM710-E/PF by Microchip Technology, a leading manufacturer in digital signal processors. Ideal for a wide range of applications, this high-quality product offers unmatched value and benefits to customers. With its advanced features and reliable performance, this DSP sets itself apart in the industry. Experience the advantages of superior processing power, efficiency, and versatility with the DSPIC33EP512GM710-E/PF, a game-changer in digital signal processing technology.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

This material is commonly used for electronic components due to its durability and cost-effectiveness.

Surface Mount - YES

Surface mount technology allows for compact and efficient placement of the component on a circuit board.

Maximum Supply Voltage - 3.6 V

A higher maximum supply voltage allows for compatibility with a wider range of power sources.

On Chip Data RAM Width - 8

A wider data RAM width allows for faster data processing and storage capabilities.

Package Shape - SQUARE

A square package shape helps in efficient placement and utilization of board space.

Bit Size - 16

A larger bit size allows for more precise calculations and data processing.

Power Supplies (V) - 3.3

This voltage is commonly used in many electronic systems, providing compatibility with existing circuitry.

No. of Terminals - 100

A higher number of terminals provide more connectivity options and flexibility in circuit design.

Minimum Supply Voltage - 3 V

A lower minimum supply voltage allows for operation in a wider range of power conditions.

Maximum Operating Temperature - 125 °C

The high maximum operating temperature ensures reliability even in demanding environments.

No. of External Interrupts - 5

Multiple external interrupt options allow for efficient handling of external events and inputs.

Internal Bus Architecture - MULTIPLE

Multiple internal bus architecture enhances data processing speed and efficiency within the component.

Temperature Grade - AUTOMOTIVE

This grade ensures that the component can withstand the temperature variations experienced in automotive applications.

Technology - CMOS

CMOS technology offers low power consumption and high noise immunity, making it suitable for digital signal processing.

ROM Programmability - FLASH

Flash programmability allows for easy updating and reprogramming of the read-only memory, enhancing flexibility in application development.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP512GM710-E/PF attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of Serial I/Os:

6

No. of Terminals:

100

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

49152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Trade Compliance

DSPIC33EP512GM710-E/PF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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