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MC56F8357MPYE

NXP Semiconductors

MC56F8357MPYE by NXP Semiconductors

MC56F8357MPYE by NXP Semiconductors is a 16-bit DSP with 262144 ROM words, operating at 120 MHz. Ideal for automotive applications, it features low power mode and barrel shifter, with a temperature range of -40 to 125 °C.

Median Price

$82.480

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 150 parts In-Stock

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$82.480

100+ parts

$53.960

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150

$82.480

$53.960

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Distributors (In-Stock)

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Nova Conductors

Japan . 64 parts In-Stock

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$49.045

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64

$49.045

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Digiode

USA . 1,825 parts In-Stock

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$56.848

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$56.848

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Vyrian

USA . 8,022 parts In-Stock

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Flip Electronics

USA . 4,800 parts In-Stock

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Anansix

USA . 2,069 parts In-Stock

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2,069

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Distributors (Availability)

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AZTECH Wire

Italy . 408 parts In-Stock

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$15.755

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$15.755

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Continental Prestige Electronics

USA . 6,497 parts In-Stock

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$46.913

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$45.975

6,497

$46.913

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$45.975

Corohmni

South Africa . 68 parts In-Stock

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$49.045

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68

$49.045

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Netroflash

USA . 1,000 parts In-Stock

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$49.045

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$46.593

10k+ parts

$45.612

1,000

$49.045

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$46.593

$45.612

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$50.026

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$50.026

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$50.026

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$50.026

$50.026

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One Stop Electronics

USA . 150 parts In-Stock

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$50.860

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$50.860

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Semicontronic

India . 150 parts In-Stock

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$50.860

100+ parts

$49.588

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$49.334

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$50.860

$49.588

$49.334

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Ampacity Inc.

Singapore . 103 parts In-Stock

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$50.860

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Corphita

USA . 4,884 parts In-Stock

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$53.856

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Aztec Data Supply Inc.

USA . 343 parts In-Stock

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$56.890

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343

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Microchip USA

USA . 1,166 parts In-Stock

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$102.995

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Lixinc

USA . 10,844 parts In-Stock

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UNI Independent Distributors

Spain . 7,128 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,480 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Argo Parts USA

USA . 1,848 parts In-Stock

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Robosynatics

Brazil . 1,009 parts In-Stock

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Lucentia Tech

USA . 1,009 parts In-Stock

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$48.064

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$47.083

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$47.083

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$47.083

$47.083

Assy Fe

Spain . 124 parts In-Stock

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Overview

Unlock the power of digital signal processing with the MC56F8357MPYE by NXP Semiconductors. This innovative DSP offers unparalleled quality and reliability, backed by NXP's renowned reputation for excellence in semiconductor technology. Ideal for automotive applications, this product provides unparalleled value with its high performance, low power mode, and advanced features like barrel shifter and boundary scan. Take your projects to the next level with the MC56F8357MPYE and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the DSP, making it a reliable choice for various applications.

Surface Mount: YES

The surface mount capability allows for easy integration into circuit boards, making installation and assembly efficient.

Maximum Supply Voltage: 2.75 V

With a maximum supply voltage of 2.75V, this DSP is suitable for low power applications while still providing enough voltage for optimal performance.

Address Bus Width: 24

The 24-bit address bus width allows for efficient memory addressing and data transfer, enhancing the overall processing speed of the DSP.

Package Shape: SQUARE

The square package shape offers versatility in placement within a circuit, optimizing space utilization and design flexibility.

Bit Size: 16

The 16-bit architecture allows for high-speed processing of data, making this DSP suitable for real-time signal processing applications.

Power Supplies (V): 2.5,3.3

The availability of multiple power supply options (2.5V and 3.3V) gives flexibility in designing power-efficient systems with this DSP.

No. of Terminals: 160

The high number of terminals enables connectivity to various peripherals and components, expanding the functionality of the DSP.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The combination of flatpack, low profile, and fine pitch package styles offers easy installation and compact placement, suitable for space-constrained designs.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage of 2.25V ensures stability and reliable operation of the DSP in low voltage conditions.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this DSP can withstand high-temperature environments, making it ideal for industrial applications.

CPU Family: 56800E

The 56800E CPU family provides advanced processing capabilities and performance, making this DSP suitable for demanding computational tasks.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C ensures reliability in cold environments, expanding the usability of this DSP.

Terminal Finish: TIN

The tin terminal finish offers corrosion resistance and reliable electrical connections, enhancing the durability of the DSP.

Terminal Position: QUAD

The quad terminal position allows for easy soldering and connection, simplifying the assembly process of the DSP.

ROM Words: 262144

With a ROM capacity of 262,144 words, this DSP can store and retrieve a large amount of data efficiently, suitable for complex algorithms and programs.

Maximum Seated Height: 1.6 mm

The low seated height of 1.6mm allows for compact designs and space-saving installation of the DSP in electronic systems.

Technical Specifications

Digital Signal Processors (DSPs) MC56F8357MPYE attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from NXP Semiconductors

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

CPU Family:

56800E

Maximum Clock Frequency:

120 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G160

JESD-609 Code:

e3

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

160

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP160,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

24 mm

Peripheral IC Type:

Trade Compliance

MC56F8357MPYE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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