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DSPIC33FJ256MC710-I/PT

Microchip Technology

DSPIC33FJ256MC710-I/PT by Microchip Technology

DSPIC33FJ256MC710-I/PT by Microchip is a 16-bit DSP with max clock freq of 64 MHz, operating temp range -40 to 85 °C. It's a CMOS technology-based digital signal processor/controller ideal for industrial applications requiring FLASH ROM programmability and operates at supply voltage of 3.3 V.

Median Price

$11.140

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,495 parts In-Stock

1+ parts

$11.260

100+ parts

$9.930

1k+ parts

$9.920

10k+ parts

-

1,495

$11.260

$9.930

$9.920

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Microchip Technology

USA . 29 parts In-Stock

1+ parts

$11.260

100+ parts

$9.350

1k+ parts

$8.590

10k+ parts

$8.170

29

$11.260

$9.350

$8.590

$8.170

DigiKey

USA . 6 parts In-Stock

1+ parts

$11.260

100+ parts

$9.925

1k+ parts

-

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6

$11.260

$9.925

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Verical

USA . 1,071 parts In-Stock

1+ parts

-

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$9.709

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1,071

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$9.709

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Future Electronics

Canada . 665 parts In-Stock

1+ parts

-

100+ parts

$9.930

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665

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$9.930

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Master Electronics

USA . 182 parts In-Stock

1+ parts

-

100+ parts

$11.020

1k+ parts

$10.800

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182

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$11.020

$10.800

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$10.875

100+ parts

-

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100

$10.875

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-

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NAC Semi

USA . 595 parts In-Stock

1+ parts

$11.680

100+ parts

$10.590

1k+ parts

$9.680

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-

595

$11.680

$10.590

$9.680

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IBS Electronics

USA . 847 parts In-Stock

1+ parts

-

100+ parts

$13.927

1k+ parts

$12.384

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847

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$13.927

$12.384

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Vyrian

USA . 813 parts In-Stock

1+ parts

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Chip Stock

USA . 676 parts In-Stock

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ComSIT Distribution GmbH

Germany . 6 parts In-Stock

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Prism Electronics

USA . 3 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,035 parts In-Stock

1+ parts

$3.378

100+ parts

-

1k+ parts

$3.243

10k+ parts

$3.243

3,035

$3.378

-

$3.243

$3.243

Semicontronic

India . 1,172 parts In-Stock

1+ parts

$6.500

100+ parts

$6.338

1k+ parts

$6.305

10k+ parts

-

1,172

$6.500

$6.338

$6.305

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Ampacity Inc.

Singapore . 1,056 parts In-Stock

1+ parts

$7.760

100+ parts

-

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1,056

$7.760

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Continental Prestige Electronics

USA . 2,272 parts In-Stock

1+ parts

$10.875

100+ parts

-

1k+ parts

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10k+ parts

$10.658

2,272

$10.875

-

-

$10.658

Netroflash

USA . 100 parts In-Stock

1+ parts

$10.875

100+ parts

$10.658

1k+ parts

-

10k+ parts

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100

$10.875

$10.658

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Corohmni

South Africa . 255 parts In-Stock

1+ parts

$46.225

100+ parts

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255

$46.225

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Aztec Data Supply Inc.

USA . 168 parts In-Stock

1+ parts

$51.590

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168

$51.590

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Advanced Electronics

New Zealand . 900 parts In-Stock

1+ parts

$78.773

100+ parts

$74.835

1k+ parts

$74.835

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900

$78.773

$74.835

$74.835

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A-Z Elektronik GmbH

Germany . 5,646 parts In-Stock

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5,646

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Lixinc

USA . 5,211 parts In-Stock

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iodParts Technologies Inc.

India . 3,927 parts In-Stock

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3,927

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Alle Elektronik GmbH

Germany . 3,764 parts In-Stock

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S.R.D Solutions

India . 2,000 parts In-Stock

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2,000

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RGB Technical Solutions

Ukraine . 1,748 parts In-Stock

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1,748

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Argo Parts USA

USA . 1,156 parts In-Stock

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1,156

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Kepictronics

USA . 686 parts In-Stock

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686

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Overview

Revolutionize your digital signal processing with the Microchip Technology DSPIC33FJ256MC710-I/PT. As a leading manufacturer in the industry, Microchip Technology delivers top-notch quality and reliability in their products. Designed for various applications in the digital signal processors category, this product offers unmatched value, benefits, and advantages to customers. Experience superior performance and efficiency without compromising on quality with the DSPIC33FJ256MC710-I/PT by Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and reliability for the package, ensuring the protection of the internal components of the DSP.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the DSP onto circuit boards, saving space and streamlining the manufacturing process.

Maximum Supply Voltage: 3.6 V

Operating within a maximum supply voltage of 3.6V ensures the DSP is compatible with a wide range of power sources and applications.

Package Shape: SQUARE

The square package shape makes it easier to handle and mount the DSP onto circuit boards, providing stability and structural support.

Bit Size: 16

With a bit size of 16, the DSP is capable of handling complex digital signal processing tasks with precision and efficiency.

Power Supplies (V): 3.3

Operating at a power supply of 3.3V ensures energy efficiency and compatibility with common power sources in electronic devices.

No. of Terminals: 100

Having 100 terminals allows for versatile connectivity options and compatibility with various circuit configurations for enhanced performance.

Package Style (Meter): FLATPACK, THIN PROFILE

The flatpack, thin profile package style helps reduce the overall footprint of the DSP, making it suitable for applications where space is limited.

Minimum Supply Voltage: 3 V

Operating within a minimum supply voltage of 3V ensures the DSP remains operational even under low power conditions, increasing reliability.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the DSP can reliably function in a wide range of environmental conditions without overheating.

Minimum Operating Temperature: -40 °C

The DSP can operate at temperatures as low as -40°C, making it suitable for use in extreme cold environments without compromising performance.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides corrosion resistance and solderability, ensuring a reliable connection between the DSP and circuit board.

Terminal Position: QUAD

With a quad terminal position, the DSP can be easily integrated into multi-terminal configurations, improving connectivity and signal transmission.

Maximum Seated Height: 1.2 mm

The low maximum seated height of 1.2mm allows for a compact design without compromising on performance, making it ideal for space-constrained applications.

Width: 12 mm

The 12mm width of the DSP provides a balance between compactness and stability, allowing for easy integration into various electronic devices and systems.

Maximum Clock Frequency: 64 MHz

With a maximum clock frequency of 64MHz, the DSP can process signals at high speeds, enabling efficient and real-time data processing.

Maximum Time At Peak Reflow Temperature (s): 40

The DSP can withstand peak reflow temperatures for up to 40 seconds, ensuring reliable soldering and assembly during manufacturing processes.

Peak Reflow Temperature °C: 260

Having a peak reflow temperature of 260°C allows for efficient soldering and assembly of the DSP onto circuit boards without damaging the internal components.

Length: 12 mm

With a length of 12mm, the DSP has a compact form factor that can easily fit into various electronic devices and systems without taking up too much space.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades allows the DSP to operate reliably in harsh environmental conditions typically found in industrial settings.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

The DSP's peripheral IC type as a digital signal processor and controller allows it to handle signal processing tasks efficiently while also managing and controlling external devices.

Technology: CMOS

Using CMOS technology ensures low power consumption and high-speed operation, making the DSP energy-efficient and ideal for battery-powered devices.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and assembly onto circuit boards, ensuring a reliable connection and efficient operation of the DSP.

Nominal Supply Voltage: 3.3 V

Having a nominal supply voltage of 3.3V ensures stable and consistent power delivery to the DSP, reducing the risk of voltage fluctuations impacting its performance.

ROM Programmability: FLASH

ROM programmability using FLASH technology allows for easy reprogramming and updating of the DSP's memory, enabling flexibility and adaptability to changing signal processing requirements.

Terminal Pitch: 0.4 mm

With a terminal pitch of 0.4mm, the DSP enables high-density mounting onto circuit boards, maximizing space efficiency and allowing for compact device designs.

Format: FIXED POINT

Operating in a fixed-point format simplifies calculations and improves processing speed, making the DSP suitable for real-time signal processing applications where precision is essential.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, the DSP can withstand moderate exposure to moisture during storage and assembly processes, ensuring its reliability and longevity in various environments.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33FJ256MC710-I/PT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

64 MHz

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.55SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

12 mm

Trade Compliance

DSPIC33FJ256MC710-I/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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