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TMS320LBC57PBK57

Texas Instruments

TMS320LBC57PBK57 by Texas Instruments

TMS320LBC57PBK57 by Texas Instruments is a 16-bit DSP with max clock freq of 57.14 MHz, 512 RAM words, and 3.3V power supply. Ideal for digital signal processing applications requiring low power mode and barrel shifter functionality in commercial temperature grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,202 parts In-Stock

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Digiode

USA . 1,793 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 451 parts In-Stock

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$10.000

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451

$10.000

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Corohmni

South Africa . 500 parts In-Stock

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$15.615

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$15.615

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AZTECH Wire

Italy . 488 parts In-Stock

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$18.515

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Ampacity Inc.

Singapore . 1,394 parts In-Stock

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$21.000

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Parana Technologies

USA . 2,053 parts In-Stock

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$22.146

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$22.769

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DigiPath Technology Company

USA . 241 parts In-Stock

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$24.385

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$22.435

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ChromeModa Solutions

Germany . 3,968 parts In-Stock

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$24.883

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$20.404

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IDEA Electronic Components Group

UK . 472 parts In-Stock

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$24.883

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$23.639

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$22.395

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Continental Prestige Electronics

USA . 6,331 parts In-Stock

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Corphita

USA . 3,445 parts In-Stock

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Argo Parts USA

USA . 3,165 parts In-Stock

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Microchip USA

USA . 404 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Experience the power of cutting-edge technology with the TMS320LBC57PBK57 by Texas Instruments, a leader in the industry known for its top-quality products. This Digital Signal Processor (DSP) offers unparalleled performance and versatility, making it ideal for a wide range of applications. From audio processing to telecommunications, this product delivers exceptional value, benefits, and advantages that will take your projects to the next level. Trust in Texas Instruments to provide you with the tools you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight and cost-effective, making the product easy to handle and affordable.

Maximum Supply Voltage: 3.47 V

Higher maximum supply voltage allows for flexibility in power supply options and can handle fluctuations without damage.

Bit Size: 16

16-bit processing allows for more precise calculations and operations, making it suitable for applications requiring high accuracy.

RAM Words: 512

Ample RAM capacity allows for efficient storage and retrieval of temporary data during processing, enhancing overall performance.

Maximum Clock Frequency: 57.14 MHz

High clock frequency enables fast data processing and real-time operation, making the product suitable for time-critical applications.

Technology: CMOS

CMOS technology offers low power consumption and reliability, making the product energy-efficient and durable for long-term use.

Low Power Mode: YES

Low power mode feature helps in reducing energy consumption during idle or low-demand periods, prolonging battery life and efficiency.

Technical Specifications

Digital Signal Processors (DSPs) TMS320LBC57PBK57 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

6K WORDS DATA/PROG RAM

Address Bus Width:

16

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

57.14 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G128

Length:

14 mm

Low Power Mode:

YES

No. of Terminals:

128

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.64SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

512

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

3.47 V

Minimum Supply Voltage:

3.13 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TMS320LBC57PBK57 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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