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DSPIC33EP128GS808T-E/PT

Microchip Technology

DSPIC33EP128GS808T-E/PT by Microchip Technology

DSPIC33EP128GS808T-E/PT by Microchip Technology is a 16-bit DSP with 131072 ROM words and 8192 RAM words. It features 22-Ch 12-Bit ADC, 2-Ch 12-Bit DAC, and peripherals like PWM(16) for automotive applications. Operating at up to 60 MHz with low power mode, it offers CAN(2), I2C(2), SPI(3), UART(2) connectivity in a compact package style of FLATPACK.

Median Price

$6.000

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$6.000

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$6.000

-

-

-

Vyrian

USA . 491 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

491

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,195 parts In-Stock

1+ parts

$6.000

100+ parts

-

1k+ parts

-

10k+ parts

$5.880

5,195

$6.000

-

-

$5.880

Corohmni

South Africa . 58 parts In-Stock

1+ parts

$6.000

100+ parts

-

1k+ parts

-

10k+ parts

-

58

$6.000

-

-

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Ampacity Inc.

Singapore . 127 parts In-Stock

1+ parts

$7.000

100+ parts

-

1k+ parts

-

10k+ parts

-

127

$7.000

-

-

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AZTECH Wire

Italy . 770 parts In-Stock

1+ parts

$11.359

100+ parts

-

1k+ parts

-

10k+ parts

-

770

$11.359

-

-

-

Aztec Data Supply Inc.

USA . 20,992 parts In-Stock

1+ parts

$19.190

100+ parts

-

1k+ parts

-

10k+ parts

-

20,992

$19.190

-

-

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Semicontronic

India . 648 parts In-Stock

1+ parts

$25.000

100+ parts

$24.375

1k+ parts

$24.250

10k+ parts

-

648

$25.000

$24.375

$24.250

-

Marpe Global Electronics

Taiwan . 7,766 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,766

-

-

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XL Components Corporation

Australia . 6,726 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,726

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-

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QualityLine Systems

Poland . 1,516 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,516

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-

-

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Argo Parts USA

USA . 1,370 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,370

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-

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$5.880

1k+ parts

$5.700

10k+ parts

$5.580

500

-

$5.880

$5.700

$5.580

Overview

Unleash the power of cutting-edge technology with the DSPIC33EP128GS808T-E/PT by Microchip Technology. As a trusted leader in digital signal processors, Microchip delivers top-notch quality and reliability. This versatile product is perfect for a wide range of applications, offering customers unparalleled value and benefits. With advanced features and high performance capabilities, the DSPIC33EP128GS808T-E/PT is the ideal choice for all your digital signal processing needs. Upgrade to Microchip Technology and experience innovation like never before.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Durable and cost-effective material for housing the DSP.

Surface Mount:

YES - Allows for easy installation on circuit boards.

Maximum Supply Voltage:

3.6 V - Provides flexibility in power input options.

On Chip Data RAM Width:

8 - Efficient data processing capability.

Screening Level:

AEC-Q100; TS 16949 - Ensures high quality and reliability for automotive applications.

Package Shape:

SQUARE - Space-saving design for compact electronic devices.

Bit Size:

16 - High resolution for data processing accuracy.

DAC Channels:

YES - Enables analog signal output.

No. of Terminals:

80 - Sufficient connectivity options for various components.

Package Style (Meter):

FLATPACK, THIN PROFILE - Streamlined design for slim devices.

Minimum Supply Voltage:

3 V - Ensures stable operation at lower voltage levels.

Maximum Operating Temperature:

125 °C - Reliable performance in high-temperature environments.

No. of External Interrupts:

4 - Allows for handling multiple external events.

Minimum Operating Temperature:

40 °C - Functionality in cold conditions.

ADC Channels:

YES - Allows for analog signal input.

DMA Channels:

YES - Enhanced data transfer capabilities.

Terminal Position:

QUAD - Easy integration into circuit board layouts.

ROM Words:

131072 - Large storage capacity for program data.

Maximum Seated Height:

1.2 mm - Low profile for space-constrained applications.

Digital To Analog Convertors:

2-Ch 12-Bit - Precise conversion for high-quality analog signals.

RAM Words:

8192 - Sufficient memory for data storage and processing.

Width:

12 mm - Compact form factor for various device sizes.

Boundary Scan:

YES - Simplifies board testing and debugging.

Peripherals:

COMPARATOR(4), DMA(4), PWM(16), TIMER(5), WDT - Comprehensive set of peripherals for diverse applications.

Maximum Clock Frequency:

60 MHz - Fast processing speed for real-time data handling.

Internal Bus Architecture:

MULTIPLE - Efficient data transfer within the processor.

Length:

12 mm - Balanced dimensions for different installation requirements.

Temperature Grade:

AUTOMOTIVE - Suitable for automotive environments.

Peripheral IC Type:

DIGITAL SIGNAL PROCESSOR, OTHER - Versatile IC for various digital signal processing tasks.

No. of Timers:

7 - Enables precise time-based operations.

RAM Bytes:

8192 - Adequate memory capacity for data storage and retrieval.

Technology:

CMOS - Energy-efficient and reliable semiconductor technology.

Terminal Form:

GULL WING - Easy soldering on PCBs.

Analog To Digital Convertors:

22-Ch 12-Bit - High input channel capacity for analog signals.

Maximum Supply Current:

75 mA - Efficient power consumption for extended operation.

Nominal Supply Voltage:

3.3 V - Standard voltage level for compatibility with various power sources.

No. of DMA Channels:

4 - Multiple channels for efficient data transfer.

No. of Serial I/Os:

4 - Connectivity options for serial communication.

PWM Channels:

YES - Precise control of pulse width modulation signals.

Connectivity:

CAN(2), I2C(2), SPI(3), UART(2) - Versatile communication options for interfacing with other devices.

ROM Programmability:

FLASH - Convenient programming and reprogramming capability.

Terminal Pitch:

0.5 mm - Fine pitch for compact PCB designs.

Format:

FIXED POINT - Accurate computation for signal processing tasks.

Low Power Mode:

YES - Energy-efficient mode for power-saving applications.

Barrel Shifter:

YES - Enhanced arithmetic operations for efficient data processing.

On Chip Program ROM Width:

24 - Adequate storage for program instructions.

No. of I/O Lines:

67 - Sufficient input/output options for interfacing with external components.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP128GS808T-E/PT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of I/O Lines:

67

No. of Serial I/Os:

4

No. of Terminals:

80

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

8192

RAM Words:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(2), SPI(3), UART(2)

Peripherals:

COMPARATOR(4), DMA(4), PWM(16), TIMER(5), WDT

Analog To Digital Convertors:

22-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

DSPIC33EP128GS808T-E/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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