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TMS320DM8168CCYGA2

Texas Instruments

TMS320DM8168CCYGA2 by Texas Instruments

TMS320DM8168CCYGA2 by Texas Instruments is a 32-bit DSP with integrated cache, operating at up to 27 MHz. It features an address bus width of 15 bits and external data bus width of 32 bits. Ideal for industrial applications requiring low power consumption and high processing speeds.

Median Price

$158.890

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,340 parts In-Stock

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$129.188

100+ parts

$116.937

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$111.369

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1,340

$129.188

$116.937

$111.369

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Arrow

USA . 6 parts In-Stock

1+ parts

$158.890

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$146.310

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6

$158.890

$146.310

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Verical

USA . 6 parts In-Stock

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$158.890

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$146.310

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6

$158.890

$146.310

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DigiKey

USA . 974 parts In-Stock

1+ parts

$224.290

100+ parts

$179.740

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974

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$179.740

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Distributors (In-Stock)

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Digiode

USA . 3,532 parts In-Stock

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$122.729

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Nova Conductors

Japan . 50 parts In-Stock

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$177.745

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50

$177.745

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Vyrian

USA . 5,961 parts In-Stock

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Chip Stock

USA . 2,544 parts In-Stock

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Cyclops Electronics Ltd

UK . 2,048 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 557 parts In-Stock

1+ parts

$24.592

100+ parts

$24.592

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$24.592

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557

$24.592

$24.592

$24.592

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Corohmni

South Africa . 982 parts In-Stock

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$36.427

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982

$36.427

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Parana Technologies

USA . 974 parts In-Stock

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$44.667

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974

$44.667

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DigiPath Technology Company

USA . 422 parts In-Stock

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$49.184

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422

$49.184

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IDEA Electronic Components Group

UK . 2,210 parts In-Stock

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$50.188

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$47.679

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$45.169

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2,210

$50.188

$47.679

$45.169

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ChromeModa Solutions

Germany . 428 parts In-Stock

1+ parts

$50.188

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$41.154

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428

$50.188

$41.154

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$64.187

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$60.977

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$60.977

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100

$64.187

$60.977

$60.977

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Ampacity Inc.

Singapore . 224 parts In-Stock

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$109.810

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224

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Corphita

USA . 963 parts In-Stock

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$116.269

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Continental Prestige Electronics

USA . 2,822 parts In-Stock

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$170.561

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$167.150

2,822

$170.561

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Netroflash

USA . 1,000 parts In-Stock

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$177.745

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$177.745

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Semicontronic

India . 273 parts In-Stock

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$239.000

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$233.025

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$231.830

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273

$239.000

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$231.830

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Microchip USA

USA . 2,800 parts In-Stock

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$249.075

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S.R.D Solutions

India . 30,000 parts In-Stock

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Lixinc

USA . 18,670 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Argo Parts USA

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GreenTree Electronics

Israel . 528 parts In-Stock

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Formix International (Excess)

India . 317 parts In-Stock

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Perfect Parts

USA . 200 parts In-Stock

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Overview

Experience unparalleled performance and efficiency with the Texas Instruments TMS320DM8168CCYGA2 Digital Signal Processor. Boasting top-notch quality and cutting-edge technology, this DSP is perfect for a wide range of applications in various industries. With integrated cache, boundary scan capabilities, and low power mode, this product offers unmatched value and benefits to customers looking for reliable and high-performance solutions. Trust Texas Instruments for excellence in digital signal processing and experience the advantages of the TMS320DM8168CCYGA2 firsthand.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable and long-lasting applications.

Integrated Cache:

YES - The integrated cache enhances the processing speed and efficiency of the DSP, making it suitable for tasks requiring quick data access.

Surface Mount:

YES - The surface mount feature allows for easy and flexible installation, making this DSP suitable for compact and space-constrained designs.

Maximum Supply Voltage:

1.05 V - The high maximum supply voltage ensures stable performance and reliability, making this DSP suitable for demanding industrial applications.

Address Bus Width:

15 - The wide address bus width allows for efficient memory access and management, making this DSP suitable for complex signal processing tasks.

Package Shape:

SQUARE - The square package shape offers easy integration into circuit boards and efficient use of space, making this DSP suitable for compact designs.

Bit Size:

32 - The 32-bit size allows for high precision and accuracy in signal processing, making this DSP suitable for applications requiring complex calculations.

No. of Terminals:

1031 - The high number of terminals enables versatile connectivity options, making this DSP suitable for diverse input/output requirements.

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG - The grid array and heat sink/slug package style ensures efficient heat dissipation and thermal management, making this DSP suitable for high-performance applications.

Minimum Supply Voltage:

0.95 V - The low minimum supply voltage allows for energy-efficient operation, making this DSP suitable for battery-powered devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM8168CCYGA2 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

15

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

27 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B1031

JESD-609 Code:

e1

Length:

25 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

72

No. of Terminals:

No. of Timers:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA1031,37X37,25

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

245

Power Supplies (V):

1

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.31 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

25 mm

Peripheral IC Type:

Trade Compliance

TMS320DM8168CCYGA2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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