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TMS320F2808PZQ

Texas Instruments

TMS320F2808PZQ by Texas Instruments

TMS320F2808PZQ by Texas Instruments is a 32-bit digital signal processor (DSP) with a max clock frequency of 100 MHz. It has 18432 RAM words and is commonly used in automotive applications due to its temperature grade and low power mode.

Median Price

$36.170

Lifecycle Status

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11

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1k+

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Texas Instruments

USA . 860 parts In-Stock

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$19.740

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Mouser Electronics

USA . 1,078 parts In-Stock

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$25.970

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DigiKey

USA . 219 parts In-Stock

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$36.170

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$25.979

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$24.913

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$24.913

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Digiode

USA . 4,073 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Vyrian

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Holdelec - ElecDif-Pro

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ACDS - Activité Composants Distribution Service

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Tectiva GmbH

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Inventory MP

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Bristol Electronics

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Ampacity Inc.

Singapore . 891 parts In-Stock

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$19.210

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Semicontronic

India . 686 parts In-Stock

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$19.210

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Corohmni

South Africa . 5,069 parts In-Stock

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$19.476

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Corphita

USA . 3,880 parts In-Stock

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Continental Prestige Electronics

USA . 2,926 parts In-Stock

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Advanced Electronics

New Zealand . 650 parts In-Stock

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$26.722

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$25.386

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Parana Technologies

USA . 2,290 parts In-Stock

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$46.875

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DigiPath Technology Company

USA . 1,537 parts In-Stock

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$51.616

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ChromeModa Solutions

Germany . 461 parts In-Stock

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$52.669

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$43.189

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IDEA Electronic Components Group

UK . 441 parts In-Stock

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Microchip USA

USA . 1,874 parts In-Stock

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$61.040

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$59.980

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$59.450

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Lixinc

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A-Z Elektronik GmbH

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Argo Parts USA

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Netroflash

USA . 1,000 parts In-Stock

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$22.030

Perfect Parts

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Kepictronics

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Overview

Experience the power and precision of the TMS320F2808PZQ by Texas Instruments, a state-of-the-art Digital Signal Processor (DSP) that delivers unparalleled performance for a range of applications. With its innovative design and cutting-edge technology, this DSP is perfect for automotive, industrial, and communication systems. Manufactured by Texas Instruments, a trusted name in the industry, you can count on the quality and reliability of the TMS320F2808PZQ. Unlock endless possibilities with its wide range of features and benefits, including low power mode, high-speed processing, and versatile connectivity options. Get ready to elevate your projects to new heights with the TMS320F2808PZQ!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's plastic/epoxy package body material ensures durability and protection in various environments, making it a reliable choice.

Surface Mount: YES

With surface mount capability, this product offers ease of installation and integration into electronic systems, making it convenient to use.

Maximum Supply Voltage: 1.89 V

The maximum supply voltage of 1.89 V allows for efficient power consumption, contributing to energy savings and extended battery life in applications.

On Chip Data RAM Width: 16

The 16-bit on-chip data RAM width enhances data processing capabilities, enabling faster and more efficient signal processing tasks.

Screening Level: AEC-Q100

With AEC-Q100 screening level, this product meets stringent automotive industry requirements, ensuring high reliability and performance in automotive applications.

Package Shape: SQUARE

The square package shape offers versatility in design and allows for easy integration into compact electronic devices, making it suitable for space-constrained applications.

Bit Size: 32

The 32-bit architecture of this product enhances computational power, enabling complex digital signal processing tasks to be executed efficiently.

Power Supplies (V): 1.8,3.3

The availability of power supplies at 1.8 V and 3.3 V allows for flexible voltage input, accommodating a wide range of power sources in different electronic systems.

No. of Terminals: 100

With 100 terminals, this product offers a sufficient number of connection points, enabling multi-functionality and connectivity with other components in a system.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, fine pitch package style provides compactness and ease of installation, making it suitable for miniaturized applications.

Minimum Supply Voltage: 1.71 V

The minimum supply voltage of 1.71 V allows for operation in low power environments, ensuring energy efficiency and compatibility with various power sources.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliability and stability in demanding environments, making it suitable for industrial applications.

CPU Family: C28X

The C28X CPU family offers powerful processing capabilities, supporting complex algorithms and enhancing the performance of digital signal processing tasks.

No. of External Interrupts: 3

With 3 external interrupt capabilities, this product allows for efficient handling of events and interrupts, enhancing system responsiveness and versatility.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C enables reliable operation even in extreme cold climates, making it suitable for diverse environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent electrical conductivity and corrosion resistance, ensuring reliable connections and longevity.

ADC Channels: YES

This product features ADC channels, allowing for the conversion of analog signals into digital format, enabling precise and accurate signal processing.

Terminal Position: QUAD

The quad terminal position offers ease of PCB layout and soldering, facilitating efficient assembly and reducing production time and costs.

Maximum Seated Height: 1.6 mm

The maximum seated height of 1.6 mm allows for low-profile integration and minimizes space requirements, making it suitable for compact electronic devices.

RAM Words: 18432

With 18,432 RAM words, this product provides ample memory capacity for storing and manipulating data, enabling efficient data processing and storage.

Width: 14 mm

The compact width of 14 mm allows for ease of placement and integration in electronic devices with limited space, offering design flexibility.

Boundary Scan: YES

This product is equipped with boundary scan capability, enabling efficient testing and debugging during manufacturing and ensuring product quality.

Maximum Clock Frequency: 100 MHz

The high maximum clock frequency of 100 MHz allows for fast and efficient signal processing, enhancing overall system performance.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this product ensures reliable solder joints and minimizes the risk of thermal damage during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and secure connections during assembly, maximizing product reliability.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture facilitates efficient data transfer and communication within the DSP, enhancing overall system performance.

Length: 14 mm

The compact length of 14 mm allows for flexible placement and integration in electronic devices with limited space, contributing to design simplicity.

Temperature Grade: AUTOMOTIVE

With an automotive temperature grade, this product is designed and tested to withstand harsh automotive conditions, ensuring reliability and longevity.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

This digital signal processor belongs to the peripheral IC type, enabling it to efficiently handle various peripheral functions, enhancing system versatility.

No. of Timers: 10

With 10 timers, this product offers versatile timing capabilities, allowing precise control of events and enabling efficient scheduling of tasks in complex applications.

RAM Bytes: 36864

With 36,864 RAM bytes, this product provides ample memory capacity for storing and manipulating data, accommodating large-scale signal processing tasks.

Technology: CMOS

This product utilizes CMOS technology, offering low power consumption, high noise immunity, and rapid switching speeds, enhancing overall efficiency and performance.

Terminal Form: GULL WING

The gull-wing terminal form allows for secure and reliable surface mounting, ensuring proper electrical connections and facilitating automated assembly processes.

Maximum Supply Current: 230 mA

With a maximum supply current of 230 mA, this product offers efficient power consumption, prolonging battery life and reducing energy consumption.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8 V ensures compatibility with a wide range of power sources, providing versatility and ease of integration.

PWM Channels: YES

This product features PWM (Pulse Width Modulation) channels, enabling accurate and flexible control of analog signals, making it suitable for applications such as motor control and audio processing.

ROM Programmability: FLASH

The ROM (Read-Only Memory) programmability in flash format allows for easy and efficient updating of firmware, enabling future-proofing and adaptability.

Terminal Pitch: 0.5 mm

The compact terminal pitch of 0.5 mm enables high-density integration and PCB routing, facilitating miniaturization and space-saving in electronic designs.

Format: FIXED POINT

This product operates in a fixed-point format, allowing for precise and efficient numeric calculations, enhancing accuracy and reliability.

Moisture Sensitivity Level (MSL): 2

With a moisture sensitivity level of 2, this product is designed and packaged to withstand moderate moisture exposure, ensuring long-term reliability in various environments.

Low Power Mode: YES

This product features a low power mode, allowing for efficient energy utilization during idle or low processing load conditions, contributing to extended battery life and energy efficiency.

On Chip Program ROM Width: 16

The 16-bit on-chip program ROM width provides sufficient memory for firmware storage, allowing for efficient and reliable program execution.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F2808PZQ attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of External Interrupts:

3

No. of Terminals:

100

No. of Timers:

10

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

36864

RAM Words:

18432

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

230 mA

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TMS320F2808PZQ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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