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DSPIC30F6012AT-30I/PT

Microchip Technology

DSPIC30F6012AT-30I/PT by Microchip Technology

DSPIC30F6012AT-30I/PT by Microchip is a 16-bit DSP with max clock freq of 40MHz, operating temp range -40 to 85°C. Ideal for industrial applications, it features flash ROM programmability, CMOS technology, and GULL WING terminal form.

Median Price

$13.090

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 6,391 parts In-Stock

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$13.090

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$10.810

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$10.810

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$10.810

Microchip Technology

USA . 6,000 parts In-Stock

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$13.090

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$10.810

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$9.920

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$9.460

6,000

$13.090

$10.810

$9.920

$9.460

Mouser Electronics

USA . 433 parts In-Stock

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$13.090

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$10.810

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433

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$10.810

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Distributors (In-Stock)

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NAC Semi

USA . 4,800 parts In-Stock

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$13.500

100+ parts

$12.240

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$11.200

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4,800

$13.500

$12.240

$11.200

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Chip Stock

USA . 10,100 parts In-Stock

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Vyrian

USA . 1,423 parts In-Stock

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Nova Conductors

Japan . 86 parts In-Stock

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Infinite Electronics LLP

India . 19 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,292 parts In-Stock

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$11.130

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$11.130

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Semicontronic

India . 1,034 parts In-Stock

1+ parts

$11.130

100+ parts

$10.852

1k+ parts

$10.796

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1,034

$11.130

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$10.796

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Corohmni

South Africa . 393 parts In-Stock

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$11.145

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Advanced Electronics

New Zealand . 20 parts In-Stock

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$11.479

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$10.905

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$10.905

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20

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$10.905

$10.905

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Aztec Data Supply Inc.

USA . 130 parts In-Stock

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$16.330

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Fulton Briggs Corp.

USA . 7,563 parts In-Stock

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iodParts Technologies Inc.

India . 2,400 parts In-Stock

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Lixinc

USA . 1,950 parts In-Stock

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S.R.D Solutions

India . 1,600 parts In-Stock

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Argo Parts USA

USA . 1,550 parts In-Stock

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Continental Prestige Electronics

USA . 1,028 parts In-Stock

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Formix International (Excess)

India . 98 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Unlock the power of digital signal processing with Microchip Technology's DSPIC30F6012AT-30I/PT. This cutting-edge DSP offers unparalleled performance and reliability, making it the perfect choice for a wide range of applications. Whether you're working on audio processing, motor control, or communications systems, this DSP delivers exceptional results every time. With its advanced features and high-quality design, the DSPIC30F6012AT-30I/PT provides unbeatable value and benefits to customers seeking top-notch performance in a compact package. Elevate your projects to the next level with Microchip Technology's superior DSP technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and protection for the internals of the DSP, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing production costs.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, making it versatile and adaptable to different power requirements.

Package Shape: SQUARE

Square shape facilitates easier placement and soldering on the PCB, optimizing board space utilization.

Bit Size: 16

16-bit architecture enables high precision processing and efficient data manipulation, suitable for a variety of applications.

Power Supplies (V): 3/5

Supports both 3V and 5V power supplies, making it compatible with a wide range of existing systems and components.

No. of Terminals: 64

Ample number of terminals for connecting various external components and peripherals, increasing the versatility of the DSP.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

Compact and thin package style with fine pitch terminals for efficient board layout and space-saving design.

Minimum Supply Voltage: 4.5 V

With a low minimum supply voltage requirement, the DSP can operate efficiently even in low-power scenarios.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows the DSP to function reliably in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Wide temperature range support enables operation in extreme cold conditions, suitable for diverse applications.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides good solderability and electrical conductivity, ensuring secure and reliable connections.

Terminal Position: QUAD

Quad terminal position enhances mechanical stability and facilitates efficient heat dissipation during operation.

Maximum Seated Height: 1.2 mm

Low seated height allows for a compact and slim profile, ideal for space-constrained applications.

Width: 10 mm

Compact width dimension for easy integration into compact electronic devices or systems.

Maximum Clock Frequency: 40 MHz

High clock frequency enables fast data processing and real-time signal manipulation, suitable for time-sensitive applications.

Maximum Time At Peak Reflow Temperature (s): 40

Short reflow time at peak temperature ensures quick and reliable soldering during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for effective solder joint formation and component reliability.

Length: 10 mm

Compact length dimension for space-efficient design and integration in small form factor devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range support for rugged environments and extended operational reliability.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Combination of DSP and controller functionalities for versatile signal processing and control applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliability, making the DSP energy-efficient and performance-driven.

Terminal Form: GULL WING

Gull wing terminal form enhances mechanical strength and solder joint reliability, ensuring long-term performance.

Maximum Supply Current: 250 mA

Supports sufficient supply current for stable operation, ensuring the DSP performs optimally under varying load conditions.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage of 5V for compatibility with common power sources and systems.

ROM Programmability: FLASH

Flash ROM programmability enables firmware updates and customization, allowing for adaptable functionality and feature enhancements.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm for high-density PCB layouts and precise component placement.

Format: FIXED POINT

Fixed-point format for efficient arithmetic operations and precise calculations in digital signal processing tasks.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, suitable for standard PCB assembly processes with controlled humidity levels.

On Chip Program ROM Width: 24

24-bit ROM width provides ample storage capacity for program code and data, enhancing the versatility and functionality of the DSP.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC30F6012AT-30I/PT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 2.5V MINIMUM SUPPLY AT 10 MHZ

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

250 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Trade Compliance

DSPIC30F6012AT-30I/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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