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TMS320F28235ZJZQ

Texas Instruments

TMS320F28235ZJZQ by Texas Instruments

TMS320F28235ZJZQ by Texas Instruments is a 32-bit DSP with 150 MHz clock frequency, 176 terminals, and 68 RAM words. Ideal for automotive applications, it features 8 external interrupts, 21 timers, and low power mode for efficient performance in digital signal processing tasks.

Median Price

$32.780

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,593 parts In-Stock

1+ parts

$29.710

100+ parts

$26.408

1k+ parts

$19.418

10k+ parts

-

1,593

$29.710

$26.408

$19.418

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Rochester

USA . 111 parts In-Stock

1+ parts

-

100+ parts

$35.850

1k+ parts

$32.080

10k+ parts

$30.190

111

-

$35.850

$32.080

$30.190

DigiKey

USA . 111 parts In-Stock

1+ parts

-

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111

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Distributors (In-Stock)

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Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$25.300

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-

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600

$25.300

-

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Digiode

USA . 931 parts In-Stock

1+ parts

$28.224

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-

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931

$28.224

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Vyrian

USA . 4,987 parts In-Stock

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4,987

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DigiKey Marketplace

USA . 111 parts In-Stock

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111

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Distributors (Availability)

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Ampacity Inc.

Singapore . 508 parts In-Stock

1+ parts

$23.840

100+ parts

-

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-

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508

$23.840

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-

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$24.794

100+ parts

-

1k+ parts

$23.802

10k+ parts

-

2,000

$24.794

-

$23.802

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Continental Prestige Electronics

USA . 1,684 parts In-Stock

1+ parts

$25.300

100+ parts

-

1k+ parts

-

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$24.794

1,684

$25.300

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-

$24.794

Corphita

USA . 2,029 parts In-Stock

1+ parts

$26.739

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$26.739

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Corohmni

South Africa . 3,141 parts In-Stock

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$45.222

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3,141

$45.222

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Parana Technologies

USA . 1,572 parts In-Stock

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$58.468

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1,572

$58.468

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DigiPath Technology Company

USA . 899 parts In-Stock

1+ parts

$64.380

100+ parts

$59.230

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899

$64.380

$59.230

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Microchip USA

USA . 1,241 parts In-Stock

1+ parts

$64.520

100+ parts

$63.390

1k+ parts

$62.830

10k+ parts

$62.270

1,241

$64.520

$63.390

$62.830

$62.270

ChromeModa Solutions

Germany . 4,004 parts In-Stock

1+ parts

$65.694

100+ parts

$53.869

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4,004

$65.694

$53.869

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IDEA Electronic Components Group

UK . 198 parts In-Stock

1+ parts

$65.694

100+ parts

$62.409

1k+ parts

$59.125

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198

$65.694

$62.409

$59.125

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Kepictronics

USA . 1,000 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Argo Parts USA

USA . 663 parts In-Stock

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Perfect Parts

USA . 53 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the TMS320F28235ZJZQ by Texas Instruments. As a leading manufacturer in the digital signal processor category, Texas Instruments delivers top-quality products that meet the highest industry standards. Ideal for automotive applications, this DSP offers unparalleled performance, reliability, and efficiency. With features such as multiple internal bus architecture, flash ROM programmability, and low power mode, the TMS320F28235ZJZQ provides customers with a competitive edge in their projects. Experience seamless integration and superior functionality with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and protection for the DSP, making it suitable for various environments.

Maximum Supply Voltage: 1.995 V

Allows for a high supply voltage, offering flexibility in power requirements for different applications.

Bit Size: 32

32-bit processing capability ensures high performance and efficiency in handling complex digital signal processing tasks.

Maximum Operating Temperature: 125 °C

High operating temperature range of up to 125°C enables reliable operation in harsh environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Specifically designed as a digital signal processor, ensuring optimized performance for signal processing applications.

Maximum Clock Frequency: 150 MHz

High clock frequency allows for fast data processing and execution of algorithms, making it ideal for real-time signal processing tasks.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F28235ZJZQ attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

150 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B176

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

8

No. of Terminals:

176

No. of Timers:

21

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA176,14X14,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.9,3.3

Qualification:

Not Qualified

RAM Bytes:

69632

RAM Words:

68

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

2.05 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

315 mA

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.805 V

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15 mm

Peripheral IC Type:

Trade Compliance

TMS320F28235ZJZQ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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