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DSPB56725CAF

NXP Semiconductors

DSPB56725CAF by NXP Semiconductors

NXP Semiconductors' DSPB56725CAF is a 80-terminal DSP with max clock freq of 200 MHz. It operates b/w -40 to 85 °C, ideal for industrial applications requiring fixed point format and CMOS technology. The package style is flatpack, low profile with quad terminal position and tin finish.

Median Price

$17.310

Lifecycle Status

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9

In-Stock Inventory

1k+

DSPB56725CAF by NXP Semiconductors
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Chip1Stop

Japan . 235 parts In-Stock

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$15.720

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Arrow

USA . 5 parts In-Stock

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$17.310

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$17.130

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$17.310

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Verical

USA . 5 parts In-Stock

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$17.310

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$17.130

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$17.310

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Flip Electronics (Authorized)

USA . 2,219 parts In-Stock

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Digiode

USA . 4,201 parts In-Stock

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$14.934

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Nova Conductors

Japan . 96 parts In-Stock

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$19.134

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Flip Electronics

USA . 2,219 parts In-Stock

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Anansix

USA . 965 parts In-Stock

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Vyrian

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Ampacity Inc.

Singapore . 366 parts In-Stock

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$13.360

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Corphita

USA . 1,044 parts In-Stock

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$14.148

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Continental Prestige Electronics

USA . 2,753 parts In-Stock

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$19.134

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$18.751

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Corohmni

South Africa . 32 parts In-Stock

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$19.250

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Component Stockers USA

USA . 137 parts In-Stock

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$22.100

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Advanced Electronics

New Zealand . 650 parts In-Stock

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$26.996

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$24.566

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$22.137

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650

$26.996

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One Stop Electronics

USA . 346 parts In-Stock

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$29.080

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Aztec Data Supply Inc.

USA . 262 parts In-Stock

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$32.996

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Microchip USA

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$63.894

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UNI Independent Distributors

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Argo Parts USA

USA . 650 parts In-Stock

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Bastille Electronics

Australia . 89 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the NXP Semiconductors DSPB56725CAF Digital Signal Processor. Manufactured by a trusted industry leader, this product boasts unparalleled quality and reliability. Ideal for a wide range of applications, this DSP offers exceptional value to customers seeking high performance and precision. Experience seamless operation and optimal efficiency with the DSPB56725CAF - the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the DSP, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the DSP onto a circuit board.

Maximum Supply Voltage: 1.05 V

The low maximum supply voltage helps in reducing power consumption and heat dissipation.

Package Shape: SQUARE

The square shape allows for easier integration into compact electronic devices.

No. of Terminals: 80

Having a higher number of terminals provides flexibility in connecting the DSP to other components.

Package Style (Meter): FLATPACK, LOW PROFILE

The low profile package style saves space and enables the DSP to be used in slim electronic designs.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage allows for operation in power-constrained environments.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the DSP can perform reliably in various environmental conditions.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures the DSP can function in both extreme cold and hot conditions.

Terminal Finish: TIN

Tin terminal finish provides excellent conductivity, ensuring reliable signal transmission.

Terminal Position: QUAD

The quad terminal position simplifies the connection process and enhances stability.

Maximum Seated Height: 1.6 mm

The low seated height facilitates compact device designs and efficient heat dissipation.

Width: 14 mm

The moderate width allows for easy placement and mounting of the DSP on a circuit board.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the DSP during production.

Maximum Clock Frequency: 200 MHz

The high maximum clock frequency allows for fast processing and high-performance signal processing.

Maximum Time At Peak Reflow Temperature (s): 40

The short time at peak reflow temperature protects the DSP from heat damage during assembly.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the DSP can withstand the soldering process without damage.

Internal Bus Architecture: MULTIPLE

Multiple internal buses enhance data transfer efficiency and overall processing speed of the DSP.

Length: 14 mm

The moderate length of the DSP allows for flexibility in placement within electronic systems.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the DSP can operate reliably in harsh industrial environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The DSP's peripheral IC type indicates its specialized function in digital signal processing tasks.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliability in digital signal processing applications.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering during assembly.

Nominal Supply Voltage: 1 V

The nominal supply voltage ensures consistent and stable power delivery to the DSP for optimal performance.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for high-density mounting of the DSP on a circuit board, saving space.

Format: FIXED POINT

Fixed point format simplifies mathematical operations and calculations in digital signal processing applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates the DSP can withstand moderate exposure to moisture during handling and storage.

Technical Specifications

Digital Signal Processors (DSPs) DSPB56725CAF attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from NXP Semiconductors

Specs

Additional Features:

ALSO REQUIRES 3.3V I/O SUPPLY

Address Bus Width:

0

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

200 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

DSPB56725CAF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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