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DSPIC30F6012A-20E/PF

Microchip Technology

DSPIC30F6012A-20E/PF by Microchip Technology

DSPIC30F6012A-20E/PF by Microchip is a 16-bit DSP with max clock freq of 40MHz. Operating temp range -40 to 125°C makes it ideal for automotive applications. With flash ROM programmability and low supply current of 180mA, it's suitable for digital signal processing tasks.

Median Price

$15.570

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 2,163 parts In-Stock

1+ parts

$15.570

100+ parts

$12.870

1k+ parts

$11.780

10k+ parts

$11.250

2,163

$15.570

$12.870

$11.780

$11.250

Mouser Electronics

USA . 374 parts In-Stock

1+ parts

$15.570

100+ parts

$12.870

1k+ parts

-

10k+ parts

-

374

$15.570

$12.870

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DigiKey

USA . 129 parts In-Stock

1+ parts

$15.570

100+ parts

$12.870

1k+ parts

-

10k+ parts

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129

$15.570

$12.870

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 34 parts In-Stock

1+ parts

$13.920

100+ parts

-

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34

$13.920

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NAC Semi

USA . 1,710 parts In-Stock

1+ parts

$15.600

100+ parts

$14.370

1k+ parts

$13.320

10k+ parts

-

1,710

$15.600

$14.370

$13.320

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Vyrian

USA . 8,081 parts In-Stock

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-

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8,081

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,184 parts In-Stock

1+ parts

$13.230

100+ parts

$12.899

1k+ parts

$12.833

10k+ parts

-

1,184

$13.230

$12.899

$12.833

-

Ampacity Inc.

Singapore . 61 parts In-Stock

1+ parts

$13.230

100+ parts

-

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61

$13.230

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-

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Corohmni

South Africa . 840 parts In-Stock

1+ parts

$13.254

100+ parts

-

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840

$13.254

-

-

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Continental Prestige Electronics

USA . 5,572 parts In-Stock

1+ parts

$13.920

100+ parts

-

1k+ parts

-

10k+ parts

$13.642

5,572

$13.920

-

-

$13.642

Advanced Electronics

New Zealand . 900 parts In-Stock

1+ parts

$28.525

100+ parts

$25.958

1k+ parts

$23.390

10k+ parts

-

900

$28.525

$25.958

$23.390

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Aztec Data Supply Inc.

USA . 169 parts In-Stock

1+ parts

$67.360

100+ parts

-

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169

$67.360

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QUARKTWIN TECHNOLOGY LTD

USA . 7,387 parts In-Stock

1+ parts

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7,387

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Lixinc

USA . 6,869 parts In-Stock

1+ parts

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6,869

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Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

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3,000

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Marpe Global Electronics

Taiwan . 1,331 parts In-Stock

1+ parts

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1,331

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QualityLine Systems

Poland . 1,331 parts In-Stock

1+ parts

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1,331

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XL Components Corporation

Australia . 1,331 parts In-Stock

1+ parts

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1,331

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Argo Parts USA

USA . 1,098 parts In-Stock

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1,098

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$13.642

1k+ parts

$13.224

10k+ parts

$12.946

1,000

-

$13.642

$13.224

$12.946

Perfect Parts

USA . 77 parts In-Stock

1+ parts

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100+ parts

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77

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Overview

Unleash the power of cutting-edge technology with the DSPIC30F6012A-20E/PF by Microchip Technology. As a leader in the industry, Microchip Technology delivers high-quality digital signal processors that push the boundaries of innovation. Ideal for a wide range of applications, this DSP offers unparalleled performance and efficiency. Experience seamless integration, reliable operation, and unmatched versatility with the DSPIC30F6012A-20E/PF. Elevate your projects to new heights with this top-of-the-line solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the product lightweight and durable, ideal for portable applications.

Surface Mount: YES

The surface mount design allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, the product can handle a wide range of power inputs, increasing versatility.

Package Shape: SQUARE

The square package shape helps optimize space on the circuit board, making it suitable for compact designs.

Bit Size: 16

The 16-bit processing capability enhances the product's performance, allowing for complex calculations and fast data processing.

Power Supplies (V): 3/5

The dual power supply options provide flexibility in voltage selection, adapting to different system requirements.

No. of Terminals: 64

The ample number of terminals allow for connectivity with various external components, enabling versatile applications.

Package Style (Meter): FLATPACK, THIN PROFILE

The flatpack, thin profile design saves space and reduces the overall footprint of the product, suitable for constrained environments.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures efficient power consumption, extending battery life in mobile devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions, suitable for industrial use.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extreme cold climates, expanding the product's usability.

Terminal Finish: MATTE TIN

The matte tin finish provides corrosion resistance and solderability, ensuring long-term reliability in various operating environments.

Terminal Position: QUAD

The quad terminal position facilitates easy connectivity and PCB layout, simplifying the assembly process for manufacturers.

Maximum Seated Height: 1.2 mm

The low maximum seated height minimizes the overall profile of the product, suitable for thin devices or applications with height restrictions.

Width: 14 mm

The compact width allows for efficient space utilization on the circuit board, enabling dense and compact system designs.

Maximum Clock Frequency: 40 MHz

The high maximum clock frequency enables fast data processing and real-time signal processing, enhancing overall system performance.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature specification ensures proper soldering and manufacturing process compliance, guaranteeing product quality.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures robust solder joints during PCB assembly, increasing durability and reliability.

Length: 14 mm

The short length of the product helps optimize space on the circuit board, ideal for applications where size constraints are a concern.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature rating ensures reliable operation in a wide range of temperature conditions, suitable for automotive electronics applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

The versatile peripheral IC type combination offers both signal processing and control capabilities, making the product suitable for a wide range of applications.

Technology: CMOS

The CMOS technology provides low power consumption and high noise immunity, contributing to energy efficiency and reliable operation of the product.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and assembly, enhancing manufacturing efficiency and product quality.

Maximum Supply Current: 180 mA

The high maximum supply current rating ensures stable operation and sufficient power delivery for demanding applications.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage standardizes power requirements, ensuring compatibility with a wide range of existing systems.

ROM Programmability: FLASH

The flash ROM programmability allows for easy firmware updates and customization, enabling adaptability to changing system requirements.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high-density mounting on the PCB, optimizing space usage and enabling compact system designs.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and reduces computational complexity, enhancing the product's processing efficiency.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates moderate moisture sensitivity, ensuring the product's reliability during storage and manufacturing processes.

On Chip Program ROM Width: 24

The 24-bit on-chip program ROM width accommodates larger program sizes, enabling the implementation of complex algorithms and functionalities.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC30F6012A-20E/PF attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 3V MINIMUM SUPPLY AT 15 MHZ

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

On Chip Program ROM Width:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.63SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

180 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Trade Compliance

DSPIC30F6012A-20E/PF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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