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DSPIC33EP128GM706-I/PT

Microchip Technology

DSPIC33EP128GM706-I/PT by Microchip Technology

DSPIC33EP128GM706-I/PT by Microchip Technology is a 16-bit DSP with 131072 ROM words and 16384 RAM words. It operates at a max frequency of 60 MHz, suitable for industrial applications requiring high-speed processing. With features like 30-Ch ADCs, 12 PWM channels, and multiple connectivity options, it's ideal for digital signal processing tasks in various control systems.

Median Price

$7.260

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 105 parts In-Stock

1+ parts

$6.841

100+ parts

-

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105

$6.841

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Verical

USA . 105 parts In-Stock

1+ parts

$6.841

100+ parts

-

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105

$6.841

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Mouser Electronics

USA . 115 parts In-Stock

1+ parts

$7.260

100+ parts

$6.340

1k+ parts

$6.330

10k+ parts

-

115

$7.260

$6.340

$6.330

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DigiKey

USA . 62 parts In-Stock

1+ parts

$7.640

100+ parts

$6.340

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-

10k+ parts

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62

$7.640

$6.340

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-

Microchip Technology

USA . 25 parts In-Stock

1+ parts

$7.640

100+ parts

$6.340

1k+ parts

$5.840

10k+ parts

$5.550

25

$7.640

$6.340

$5.840

$5.550

EBV Elektronik

Germany . 480 parts In-Stock

1+ parts

-

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480

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Distributors (In-Stock)

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Nova Conductors

Japan . 57 parts In-Stock

1+ parts

$6.850

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57

$6.850

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NAC Semi

USA . 320 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$14.550

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320

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$14.550

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Vyrian

USA . 166 parts In-Stock

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166

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Distributors (Availability)

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Ampacity Inc.

Singapore . 149 parts In-Stock

1+ parts

$5.810

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-

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149

$5.810

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Continental Prestige Electronics

USA . 3,268 parts In-Stock

1+ parts

$6.850

100+ parts

-

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10k+ parts

$6.713

3,268

$6.850

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-

$6.713

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$6.850

100+ parts

-

1k+ parts

$6.507

10k+ parts

$6.370

1,000

$6.850

-

$6.507

$6.370

Advanced Electronics

New Zealand . 870 parts In-Stock

1+ parts

$6.987

100+ parts

$6.987

1k+ parts

$6.987

10k+ parts

-

870

$6.987

$6.987

$6.987

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Semicontronic

India . 148 parts In-Stock

1+ parts

$12.660

100+ parts

$12.344

1k+ parts

$12.280

10k+ parts

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148

$12.660

$12.344

$12.280

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AZTECH Wire

Italy . 796 parts In-Stock

1+ parts

$15.304

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796

$15.304

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Corohmni

South Africa . 1,226 parts In-Stock

1+ parts

$30.021

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1,226

$30.021

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Aztec Data Supply Inc.

USA . 3,939 parts In-Stock

1+ parts

$49.110

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3,939

$49.110

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West Coast Incorporated

USA . 8,093 parts In-Stock

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8,093

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Lixinc

USA . 3,068 parts In-Stock

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3,068

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Argo Parts USA

USA . 1,856 parts In-Stock

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1,856

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Overview

Discover the DSPIC33EP128GM706-I/PT by Microchip Technology, a top-of-the-line Digital Signal Processor that delivers unparalleled quality and performance. As a trusted manufacturer in the industry, Microchip Technology ensures reliability and innovation in every product. Ideal for a wide range of applications in the digital signal processing category, this processor offers exceptional value to customers seeking efficiency and precision. Experience the benefits of advanced technology, seamless connectivity, and powerful peripherals with the DSPIC33EP128GM706-I/PT. Elevate your projects to new heights with this cutting-edge solution.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Durable and lightweight material for protection.

Surface Mount:

YES - Provides easy installation and compact design.

Maximum Supply Voltage:

3.6 V - Suitable for various power sources.

On Chip Data RAM Width:

8 - Efficient data processing capabilities.

Screening Level:

TS 16949 - Ensures high quality and reliability.

Package Shape:

SQUARE - Space-saving design for versatile applications.

Bit Size:

16 - Offers high processing power and accuracy.

Power Supplies (V):

3.3 - Compatible with common power sources.

No. of Terminals:

64 - Allows for multiple connections and functions.

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH - Easy integration with existing systems.

Minimum Supply Voltage:

3 V - Reliable operation even at lower voltages.

Maximum Operating Temperature:

85 °C - Suitable for various environments and conditions.

No. of External Interrupts:

5 - Enables quick response to external events.

Minimum Operating Temperature:

40 °C - Can withstand extreme cold temperatures.

Terminal Finish:

MATTE TIN - Corrosion-resistant finish for durability.

ADC Channels:

YES - Allows for analog to digital conversion.

DMA Channels:

YES - Efficient data transfer capabilities.

Terminal Position:

QUAD - Easy to connect with other components.

ROM Words:

131072 - Large storage capacity for program memory.

Maximum Seated Height:

1.2 mm - Low profile design for compact installations.

RAM Words:

16384 - Sufficient memory for data storage and processing.

Width:

10 mm - Compact size for space-saving applications.

Boundary Scan:

YES - Facilitates testing and debugging processes.

Peripherals:

BOR, COMPARATOR(5), DMA(4), POR, PWM(12), QEI(2), RTC, TIMER(13), WDT - Versatile features for diverse applications.

Maximum Clock Frequency:

60 MHz - High-speed operation for efficient performance.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP128GM706-I/PT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of I/O Lines:

53

No. of Serial I/Os:

6

No. of Terminals:

64

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(2), I2S, IRDA, LIN, SMBUS, SPI(3), UART(4)

Peripherals:

BOR, COMPARATOR(5), DMA(4), POR, PWM(12), QEI(2), RTC, TIMER(13), WDT

Analog To Digital Convertors:

30-Ch 12-Bit

Trade Compliance

DSPIC33EP128GM706-I/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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