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DSG5402PGE100

Texas Instruments

DSG5402PGE100 by Texas Instruments

DSG5402PGE100 by Texas Instruments is a 16-bit digital signal processor with a max clock frequency of 50 MHz. It requires a 3.3V supply and has 16384 RAM words. This DSP is suitable for applications requiring high-speed signal processing.

Median Price

$13.254

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 870 parts In-Stock

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$13.254

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870

$13.254

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Vyrian

USA . 5,218 parts In-Stock

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Digiode

USA . 3,016 parts In-Stock

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3,016

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Distributors (Availability)

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Ampacity Inc.

Singapore . 816 parts In-Stock

1+ parts

$7.000

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816

$7.000

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AZTECH Wire

Italy . 717 parts In-Stock

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$7.437

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717

$7.437

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Continental Prestige Electronics

USA . 792 parts In-Stock

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$13.254

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$12.989

792

$13.254

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$12.989

Parana Technologies

USA . 2,242 parts In-Stock

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$15.874

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$16.231

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2,242

$15.874

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$16.231

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$16.772

100+ parts

$15.430

1k+ parts

$14.459

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2,000

$16.772

$15.430

$14.459

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DigiPath Technology Company

USA . 2,065 parts In-Stock

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$17.479

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$17.479

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ChromeModa Solutions

Germany . 5,046 parts In-Stock

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$17.836

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$14.626

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$17.836

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IDEA Electronic Components Group

UK . 703 parts In-Stock

1+ parts

$17.836

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$16.944

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$16.052

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703

$17.836

$16.944

$16.052

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One Stop Electronics

USA . 1,008 parts In-Stock

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$24.000

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$24.000

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Semicontronic

India . 871 parts In-Stock

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$28.000

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$27.300

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$27.160

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871

$28.000

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Corohmni

South Africa . 2,583 parts In-Stock

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$54.941

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Corphita

USA . 4,868 parts In-Stock

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Argo Parts USA

USA . 978 parts In-Stock

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Overview

Experience cutting-edge digital signal processing with the DSG5402PGE100 by Texas Instruments! As a leader in the industry, Texas Instruments brings you superior quality and reliability. This innovative product belongs to the category of Digital Signal Processors (DSPs) and offers countless applications for various industries. With its compact square package shape and low profile, it is perfect for space-constrained environments. The DSG5402PGE100 provides exceptional value, delivering powerful performance and efficient power supplies. Whether you're in the telecommunications, automotive, or consumer electronics industry, this product will elevate your projects to new heights. Don't miss out on the advantages and benefits this exceptional DSP offers – upgrade your technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components.

Surface Mount: YES

Allows for easy installation on circuit boards.

Maximum Supply Voltage: 1.98 V

Allows for a higher voltage input without risking damage to the DSP.

On Chip Data RAM Width: 16

Allows for efficient data processing and storage.

Address Bus Width: 20

Enables the DSP to access a wide range of memory locations.

Package Shape: SQUARE

Allows for easy stacking and placement on circuit boards.

Bit Size: 16

Provides sufficient processing power for a variety of applications.

Power Supplies (V): 1.8, 3.3

Supports a range of power supply options for flexibility in design.

No. of Terminals: 144

Allows for multiple connections to other components for enhanced functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Provides various options for packaging to suit different design requirements.

Minimum Supply Voltage: 1.71 V

Ensures stable operation even at lower voltage levels.

No. of External Interrupts: 4

Allows for timely responses to external events and interrupts.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and good electrical conductivity.

Terminal Position: QUAD

Allows for efficient routing and connection to other components.

Maximum Seated Height: 1.6 mm

Enables compact and slim designs for space-constrained applications.

RAM Words: 16384

Provides ample storage for data and program instructions.

Width: 20 mm

Compact form factor for easy integration into various electronic devices.

Boundary Scan: YES

Facilitates testing and debugging of the DSP during production.

External Data Bus Width: 16

Efficient data transfer between external devices and the DSP.

Maximum Clock Frequency: 50 MHz

Allows for fast data processing and real-time operation.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during manufacturing.

Peak Reflow Temperature °C: 260

Withstands high-temperature soldering processes.

Internal Bus Architecture: MULTIPLE

Enhances data flow and processing efficiency within the DSP.

Length: 20 mm

Compact form factor for space-saving designs.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Supports a wide range of applications and peripherals.

No. of Timers: 2

Enables timing functions and event scheduling within the DSP.

Technology: CMOS

Low power consumption and high noise immunity.

Terminal Form: GULL WING

Allows for easy soldering and installation on circuit boards.

Nominal Supply Voltage: 1.8 V

Stable supply voltage for consistent performance.

No. of DMA Channels: 6

Supports efficient data transfer and management.

ROM Programmability: MROM

Provides non-volatile memory for program storage.

Terminal Pitch: 0.5 mm

Fine pitch for high-density connections.

Format: FIXED POINT

Suitable for applications requiring fixed-point arithmetic operations.

Moisture Sensitivity Level (MSL): 2

Resistant to moisture damage during handling and storage.

Low Power Mode: YES

Enables power-saving features for extended battery life.

Barrel Shifter: YES

Enhances data manipulation efficiency within the DSP.

On Chip Program ROM Width: 16

Efficient storage for program instructions on the chip.

Technical Specifications

Digital Signal Processors (DSPs) DSG5402PGE100 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

20

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

6

No. of External Interrupts:

4

No. of Terminals:

144

No. of Timers:

2

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

16384

ROM Programmability:

MROM

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.98 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

DSG5402PGE100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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