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POMAP5912ZDY

Texas Instruments

POMAP5912ZDY by Texas Instruments

The Texas Instruments POMAP5912ZDY is a 16-bit DSP with 26-bit address bus, operating at up to 19.2 MHz clock frequency. Ideal for industrial applications, it features low power mode, boundary scan support, and a max supply voltage of 1.65V.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,075 parts In-Stock

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4,075

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Eagle Technology Solutions

USA . 1,688 parts In-Stock

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1,688

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Digiode

USA . 947 parts In-Stock

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947

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Semicontronic

India . 216 parts In-Stock

1+ parts

$2.000

100+ parts

$1.950

1k+ parts

$1.940

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216

$2.000

$1.950

$1.940

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Ampacity Inc.

Singapore . 1,099 parts In-Stock

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$4.000

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$4.000

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AZTECH Wire

Italy . 275 parts In-Stock

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$5.366

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275

$5.366

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Parana Technologies

USA . 1,237 parts In-Stock

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$15.657

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$16.027

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$15.657

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$16.027

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One Stop Electronics

USA . 1,102 parts In-Stock

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$17.000

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$17.000

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DigiPath Technology Company

USA . 1,682 parts In-Stock

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$17.240

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1,682

$17.240

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ChromeModa Solutions

Germany . 5,633 parts In-Stock

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$17.592

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$14.425

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5,633

$17.592

$14.425

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IDEA Electronic Components Group

UK . 781 parts In-Stock

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$17.592

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$16.712

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$15.833

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781

$17.592

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$15.833

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Corohmni

South Africa . 3,166 parts In-Stock

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$34.468

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3,166

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Corphita

USA . 4,266 parts In-Stock

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Continental Prestige Electronics

USA . 2,639 parts In-Stock

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Bastille Electronics

Australia . 900 parts In-Stock

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900

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Argo Parts USA

USA . 700 parts In-Stock

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700

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Microchip USA

USA . 461 parts In-Stock

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461

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Overview

Experience unparalleled performance and efficiency with the POMAP5912ZDY by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Digital Signal Processors (DSPs) that are perfect for a wide range of applications. With a focus on innovation and reliability, this product offers customers exceptional value and benefits. Whether you're looking to enhance your audio systems or streamline your digital processing tasks, the POMAP5912ZDY provides unmatched advantages that will take your projects to the next level. Trust in Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and cost-effective package for the DSP, making it suitable for a wide range of applications.

Surface Mount: YES

Allows for easy and convenient mounting on circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 1.65 V

Operates efficiently within a low voltage range, reducing power consumption and heat generation.

Address Bus Width: 26

Provides a wide address bus for efficient data processing and memory access, enhancing the overall performance of the DSP.

Bit Size: 16

Offers a 16-bit architecture for handling data and instructions, providing a good balance between performance and complexity.

Power Supplies (V): 1.6,1.8/2.75/3.3

Allows for flexibility in power supply options, making it compatible with a variety of systems and environments.

No. of Terminals: 289

Provides a large number of terminals for connecting to external devices and peripherals, enhancing the versatility of the DSP.

Package Style (Meter): GRID ARRAY

Offers a grid array package style that is durable and secure, ensuring reliable performance in demanding conditions.

Minimum Supply Voltage: 1.525 V

Maintains stable operation even at a low supply voltage, ensuring consistent performance in various power scenarios.

Maximum Operating Temperature: 85 °C

Operates efficiently even at high temperatures, making it suitable for industrial applications where heat dissipation is a concern.

Minimum Operating Temperature: -40 °C

Can withstand cold temperatures, allowing for use in harsh environments where temperature extremes are common.

Terminal Position: BOTTOM

Facilitates easy installation and maintenance of the DSP, ensuring smooth integration with other components in the system.

Maximum Seated Height: 2.32 mm

Has a low profile design that helps in space-constrained applications, enabling compact and efficient system designs.

RAM Words: 163840

Offers a large amount of RAM for storing and processing data, enabling complex calculations and operations without frequent need for external memory.

Width: 19 mm

Has a compact form factor that allows for easy placement on circuit boards, saving valuable space in electronic devices.

Boundary Scan: YES

Supports boundary scan testing, making it easier to detect and diagnose faults in the DSP during manufacturing and maintenance.

External Data Bus Width: 16

Features a 16-bit external data bus for efficient data transfer between the DSP and external memory or peripherals, improving overall system performance.

Maximum Clock Frequency: 19.2 MHz

Operates at a high clock frequency, enabling fast data processing and real-time application performance.

Internal Bus Architecture: MULTIPLE

Utilizes a multiple bus architecture for enhanced data flow and parallel processing capabilities, optimizing performance for complex algorithms.

Length: 19 mm

Compact length dimensions that contribute to a space-saving design, making it suitable for embedded applications with size constraints.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliable operation under extreme temperature and environmental conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

Combines digital signal processing capabilities with mixed-signal interfaces, offering versatile functionality for a wide range of applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation, making it energy-efficient and cost-effective.

Terminal Form: BALL

Features ball terminals for reliable and secure connections, ensuring robust performance in high-vibration environments.

Nominal Supply Voltage: 1.6 V

Operates at a nominal supply voltage of 1.6 V, providing a balance between power efficiency and performance for various applications.

Terminal Pitch: 1 mm

Has a fine terminal pitch for high-density mounting, enabling compact designs and efficient use of PCB space.

Format: FIXED POINT

Uses fixed-point arithmetic for efficient data processing and computational tasks, suitable for applications that do not require floating-point precision.

Low Power Mode: YES

Supports low power operation mode for energy-efficient performance, extending battery life in portable devices and reducing overall power consumption.

Technical Specifications

Digital Signal Processors (DSPs) POMAP5912ZDY attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

26

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

19.2 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B289

Length:

19 mm

Low Power Mode:

YES

No. of Terminals:

289

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA289,17X17,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

1.6,1.8/2.75/3.3

Qualification:

Not Qualified

RAM Words:

163840

Maximum Seated Height:

2.32 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.525 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

19 mm

Peripheral IC Type:

Trade Compliance

POMAP5912ZDY Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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