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TMS320VC5501PGF300

Texas Instruments

TMS320VC5501PGF300 by Texas Instruments

TMS320VC5501PGF300 by Texas Instruments is a 16-bit DSP with integrated cache, 32-bit external data bus width, and 50 MHz max clock frequency. Ideal for industrial applications requiring low power consumption and high-speed signal processing capabilities.

Median Price

$9.568

Lifecycle Status

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12

In-Stock Inventory

1k+

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Arrow

USA . 9 parts In-Stock

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$6.287

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Verical

USA . 9 parts In-Stock

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$6.287

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Texas Instruments

USA . 8 parts In-Stock

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$8.366

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$6.821

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$4.547

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$8.366

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$4.547

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Chip1Stop

Japan . 19 parts In-Stock

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$10.771

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DigiKey

USA . 888 parts In-Stock

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$11.670

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$8.258

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$7.139

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$11.670

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Mouser Electronics

USA . 102 parts In-Stock

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$11.670

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$8.260

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$7.290

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$7.020

102

$11.670

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$7.020

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Nova Conductors

Japan . 25 parts In-Stock

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$7.366

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Digiode

USA . 3,875 parts In-Stock

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$7.386

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Chip Stock

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Cyclops Electronics Ltd

UK . 2,031 parts In-Stock

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Vyrian

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ComSIT Distribution GmbH

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Semicontronic

India . 194 parts In-Stock

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$4.760

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$4.641

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$4.617

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$4.760

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$4.617

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Ampacity Inc.

Singapore . 176 parts In-Stock

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$4.760

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Corphita

USA . 2,041 parts In-Stock

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$6.998

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Continental Prestige Electronics

USA . 4,138 parts In-Stock

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$7.366

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$7.219

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Netroflash

USA . 500 parts In-Stock

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$7.366

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$6.998

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$6.851

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$7.366

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$6.998

$6.851

Microchip USA

USA . 1,546 parts In-Stock

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$31.810

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$31.350

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$31.130

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$30.900

1,546

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$31.350

$31.130

$30.900

Corohmni

South Africa . 2,445 parts In-Stock

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$48.902

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$59.057

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$53.742

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$48.427

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Parana Technologies

USA . 1,593 parts In-Stock

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$74.407

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DigiPath Technology Company

USA . 1,291 parts In-Stock

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ChromeModa Solutions

Germany . 4,236 parts In-Stock

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IDEA Electronic Components Group

UK . 1,849 parts In-Stock

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$79.423

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$75.243

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iodParts Technologies Inc.

India . 36,000 parts In-Stock

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Perfect Parts

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Glotronic Ltd.

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Lixinc

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A-Z Elektronik GmbH

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Argo Parts USA

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Futuretech Components

Singapore . 460 parts In-Stock

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GreenTree Electronics

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Kepictronics

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Overview

Experience the power of Texas Instruments with the TMS320VC5501PGF300 Digital Signal Processor. This versatile chip offers unparalleled performance and reliability, making it ideal for a wide range of applications. From audio processing to telecommunications, this DSP provides exceptional value and benefits to customers. Trust in the quality and innovation of Texas Instruments, and take your projects to the next level with the TMS320VC5501PGF300.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the internal components of the DSP, ensuring a longer lifespan for the product.

Integrated Cache: YES

Integrated cache helps improve processing speed and efficiency by storing frequently accessed data and instructions, reducing the need to fetch them from external memory.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the DSP onto circuit boards, saving space and enabling automated assembly processes.

Maximum Supply Voltage: 1.32 V

Operates efficiently within a specified voltage range, ensuring stable performance without risking damage from overvoltage.

On Chip Data RAM Width: 16

Wide data RAM width allows for the processing of larger amounts of data simultaneously, enhancing the DSP's capability to handle complex signal processing tasks.

Address Bus Width: 22

With a wider address bus, the DSP can access a larger memory space, enabling it to work with more data and execute advanced algorithms efficiently.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and resistance to corrosion, ensuring reliable connections and long-term performance of the DSP.

Maximum Clock Frequency: 50 MHz

High clock frequency allows for fast processing speeds, making the DSP suitable for real-time signal processing applications that require quick responses.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable for extended operation.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5501PGF300 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e4

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

6

No. of External Interrupts:

4

No. of Terminals:

176

No. of Timers:

4

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

16384

ROM Programmability:

MROM

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

239 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.26 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5501PGF300 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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