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DSPIC33CK64MC102T-E/2N

Microchip Technology

DSPIC33CK64MC102T-E/2N by Microchip Technology

DSPIC33CK64MC102T-E/2N by Microchip Technology is a 16-bit DSP with 64 MHz clock frequency, 3.6V max supply voltage, and AEC-Q100 screening level. Ideal for automotive applications, it features 8192 RAM words, FLASH ROM programmability, and low power mode for efficient processing in compact designs.

Median Price

$1.510

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$1.510

100+ parts

-

1k+ parts

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10k+ parts

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600

$1.510

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Vyrian

USA . 1,098 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,098

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$1.480

100+ parts

-

1k+ parts

$1.421

10k+ parts

-

1,000

$1.480

-

$1.421

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Argo Parts USA

USA . 4,755 parts In-Stock

1+ parts

$1.510

100+ parts

-

1k+ parts

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10k+ parts

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4,755

$1.510

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Continental Prestige Electronics

USA . 1,356 parts In-Stock

1+ parts

$1.510

100+ parts

-

1k+ parts

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10k+ parts

$1.480

1,356

$1.510

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-

$1.480

Ampacity Inc.

Singapore . 359 parts In-Stock

1+ parts

$8.000

100+ parts

-

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10k+ parts

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359

$8.000

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AZTECH Wire

Italy . 429 parts In-Stock

1+ parts

$16.534

100+ parts

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1k+ parts

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429

$16.534

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Corohmni

South Africa . 2,101 parts In-Stock

1+ parts

$47.139

100+ parts

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2,101

$47.139

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West Coast Incorporated

USA . 4,624 parts In-Stock

1+ parts

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4,624

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Overview

Unlock the power of innovative technology with the DSPIC33CK64MC102T-E/2N by Microchip Technology. As a leader in digital signal processors, Microchip delivers cutting-edge solutions for a variety of applications. Experience unparalleled performance and reliability with this product, featuring a maximum clock frequency of 64 MHz and a low power mode for energy efficiency. Ideal for automotive applications, this DSP offers 8192 RAM words and 3 timers, ensuring seamless operation. Trust Microchip Technology to bring you quality products that exceed expectations, providing value and benefits that make a difference in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a wide range of applications.

Surface Mount: YES

Allows for easy installation on printed circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Can handle a higher voltage input, providing flexibility in power supply options.

On Chip Data RAM Width: 8

Provides sufficient storage capacity for data processing operations.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and performance under harsh conditions.

Bit Size: 16

Offers high precision in signal processing and calculations.

No. of Terminals: 28

Sufficient number of terminals for connecting to external components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Various package styles for flexibility in design and thermal management.

Minimum Supply Voltage: 3 V

Can operate at a lower voltage for power efficiency.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for industrial and automotive applications.

No. of External Interrupts: 4

Allows for efficient handling of external events and real-time processing.

Minimum Operating Temperature: -40 °C

Can operate in cold environments without performance degradation.

Terminal Position: QUAD

Quad terminal position for easy and secure connection to PCBs.

RAM Words: 8192

Large RAM capacity for storing program instructions and data.

Width: 6 mm

Compact size for space-constrained applications.

Boundary Scan: YES

Boundary scan capability for testing and debugging the chip during manufacturing.

Maximum Clock Frequency: 64 MHz

High clock frequency for fast signal processing and real-time operations.

Internal Bus Architecture: MULTIPLE

Multiple internal buses for efficient data transfer and processing.

Length: 6 mm

Compact length for space-saving design.

Temperature Grade: AUTOMOTIVE

Designed to operate reliably in automotive environments with high temperature and vibration levels.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Dedicated peripheral for digital signal processing tasks and other functionalities.

No. of Timers: 3

Multiple timers for time-sensitive operations and event scheduling.

Technology: CMOS

Low power consumption and high noise immunity characteristics.

Terminal Form: NO LEAD

Lead-free terminal form for environmental friendliness.

Maximum Supply Current: 29.6 mA

Low power consumption for energy-efficient operation.

Nominal Supply Voltage: 3.3 V

Stable supply voltage for consistent performance.

No. of DMA Channels: 4

Multiple DMA channels for efficient data transfer with minimal CPU intervention.

No. of Serial I/Os: 3

Serial I/Os for communication with external devices and peripherals.

ROM Programmability: FLASH

Flash ROM for easy reprogramming and updating of firmware.

Terminal Pitch: 0.65 mm

Fine terminal pitch for compact PCB layout design.

Format: FIXED POINT

Fixed-point format for precise mathematical calculations.

Low Power Mode: YES

Low power mode for energy-efficient operation and extended battery life.

Barrel Shifter: YES

Barrel shifter for efficient bit manipulation and data processing.

On Chip Program ROM Width: 24

Wide on-chip program ROM for storing program instructions and firmware.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33CK64MC102T-E/2N attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

64 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-N28

Length:

6 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Serial I/Os:

3

No. of Terminals:

28

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.24SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Words:

8192

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

.55 mm

Maximum Supply Current:

29.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

6 mm

Peripheral IC Type:

Trade Compliance

DSPIC33CK64MC102T-E/2N Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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