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TMS320C6713BZDP225

Texas Instruments

TMS320C6713BZDP225 by Texas Instruments

TMS320C6713BZDP225 by Texas Instruments is a 32-bit DSP with 225 MHz clock frequency, 65536 RAM words, and integrated cache. Ideal for digital signal processing applications, it features a CMOS technology, low power mode, and 1.2V nominal voltage.

Median Price

$43.592

Lifecycle Status

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Chip1Stop

Japan . 17 parts In-Stock

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Arrow

USA . 5 parts In-Stock

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$29.530

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Verical

USA . 5 parts In-Stock

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Rochester

USA . 4 parts In-Stock

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$33.830

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$31.800

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$28.760

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$33.830

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Texas Instruments

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$37.263

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$33.123

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$24.355

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Newark

USA . 35 parts In-Stock

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$49.920

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$46.160

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Mouser Electronics

USA . 43 parts In-Stock

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$52.830

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$40.540

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$39.430

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$52.830

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DigiKey

USA . 2,338 parts In-Stock

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$54.390

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$41.343

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$39.438

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$54.390

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$39.438

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Element14

Singapore . 35 parts In-Stock

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$75.200

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$75.200

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Farnell

UK . 35 parts In-Stock

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$77.939

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$50.664

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Digiode

USA . 2,995 parts In-Stock

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$22.610

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Nova Conductors

Japan . 700 parts In-Stock

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$37.197

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Chip Stock

USA . 4,700 parts In-Stock

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Vyrian

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Cyclops Electronics Ltd

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SPM Sales

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Component Sense

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Prism Electronics

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Semicontronic

India . 3,400 parts In-Stock

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$20.230

100+ parts

$19.724

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$19.623

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$20.230

$19.724

$19.623

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Ampacity Inc.

Singapore . 3,302 parts In-Stock

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$20.230

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Corphita

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Continental Prestige Electronics

USA . 35 parts In-Stock

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$35.480

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Bastille Electronics

Australia . 10 parts In-Stock

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$35.340

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$33.108

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Corohmni

South Africa . 46 parts In-Stock

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$51.168

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Parana Technologies

USA . 881 parts In-Stock

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$57.060

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DigiPath Technology Company

USA . 377 parts In-Stock

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$62.830

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$57.803

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ChromeModa Solutions

Germany . 6,386 parts In-Stock

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IDEA Electronic Components Group

UK . 1,732 parts In-Stock

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Lixinc

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A-Z Elektronik GmbH

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Perfect Parts

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Alle Elektronik GmbH

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Argo Parts USA

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GreenTree Electronics

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Kepictronics

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Lucentia Tech

USA . 100 parts In-Stock

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$0.169

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$0.169

Overview

Unlock the power of cutting-edge technology with the TMS320C6713BZDP225 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality digital signal processors that are versatile and reliable. The TMS320C6713BZDP225 is perfect for a wide range of applications, offering high performance and efficiency. Experience seamless integration and superior functionality with this product, providing unmatched value and benefits to customers looking to elevate their projects to the next level. Trust Texas Instruments to deliver exceptional solutions that exceed expectations and drive innovation forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the DSP, making it suitable for various applications.

Integrated Cache: YES

Having an integrated cache helps improve processing speed and efficiency, enhancing overall performance.

Surface Mount: YES

Surface mount capability enables easy installation and integration into electronic devices.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for reliable operation without risking damage to the DSP.

Address Bus Width: 22

A wider address bus width allows for handling larger amounts of data, enhancing the DSP's processing capabilities.

Package Shape: SQUARE

The square package shape helps in optimal space utilization and efficient PCB layout.

Bit Size: 32

A 32-bit architecture provides improved computational power and precision for signal processing tasks.

Power Supplies (V): 1.2, 3.3

Supports multiple power supply voltages for flexibility in different system configurations.

No. of Terminals: 272

Having a high number of terminals allows for connectivity to various external components and peripherals.

Package Style (Meter): GRID ARRAY

The grid array package style offers efficient heat dissipation and mechanical stability for the DSP.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage helps in reducing power consumption and heat generation during operation.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature range ensures the DSP can function reliably in demanding environments.

No. of External Interrupts: 4

Having multiple external interrupts allows for efficient handling of asynchronous events in real-time processing.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature range ensures the DSP can operate in a wide range of environmental conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides corrosion resistance and reliable electrical connections for long-term use.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy mounting and soldering on the PCB.

Maximum Seated Height: 2.57 mm

The low maximum seated height allows for slim and compact device designs.

RAM Words: 65536

With a large RAM capacity, the DSP can efficiently store and process a significant amount of data.

Width: 27 mm

The compact width size enables the DSP to fit into space-constrained electronic systems.

Boundary Scan: YES

Support for boundary scan testing enhances manufacturing testability and fault detection capabilities.

External Data Bus Width: 32

A wide external data bus width enables fast data transfer rates and efficient communication with external devices.

Maximum Clock Frequency: 225 MHz

High clock frequency allows for rapid signal processing and real-time computations.

Maximum Time At Peak Reflow Temperature (s): 30

The specified time at peak reflow temperature ensures proper soldering and component reliability during manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the DSP can withstand the soldering process without damage.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data flow and processing efficiency within the DSP.

Length: 27 mm

The compact length size complements the width dimension for a space-efficient overall package.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Support for various peripheral IC types enables versatile connectivity and integration options for diverse applications.

No. of Timers: 2

Timers enable precise timekeeping and scheduling functions for time-critical operations.

Technology: CMOS

CMOS technology offers low power consumption and high integration density for energy-efficient processing.

Terminal Form: BALL

Ball terminal form provides reliable solder joints and electrical connections for robust device performance.

Nominal Supply Voltage: 1.2 V

The specified nominal supply voltage ensures stable and efficient operation of the DSP.

No. of DMA Channels: 16

Multiple DMA channels enable efficient data transfer and processing tasks without CPU intervention.

Terminal Pitch: 1.27 mm

The terminal pitch provides proper spacing for easy soldering and mounting on the PCB.

Format: FLOATING POINT

Support for floating-point format allows for precise mathematical calculations and signal processing operations.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring proper handling and storage to maintain component reliability.

Low Power Mode: YES

Having a low power mode option helps in reducing power consumption and heat dissipation when the DSP is not operating at full capacity.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6713BZDP225 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

225 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B272

JESD-609 Code:

e1

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

4

No. of Terminals:

272

No. of Timers:

2

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA272,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

2.57 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS320C6713BZDP225 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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