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DSPIC33EP512MU810T-I/PF

Microchip Technology

DSPIC33EP512MU810T-I/PF by Microchip Technology

DSPIC33EP512MU810T-I/PF by Microchip Technology is a 16-bit digital signal processor with 60 MHz clock frequency and 53248 RAM words. Ideal for industrial applications, it features 3.3V supply voltage, -40 to 85°C operating temperature range, and 15 DMA channels for efficient data transfer.

Median Price

$11.600

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 99 parts In-Stock

1+ parts

$11.600

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99

$11.600

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Vyrian

USA . 6,713 parts In-Stock

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6,713

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Chip Stock

USA . 6,000 parts In-Stock

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6,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 664 parts In-Stock

1+ parts

$5.000

100+ parts

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664

$5.000

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Corohmni

South Africa . 14 parts In-Stock

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$10.235

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14

$10.235

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$10.542

100+ parts

$10.015

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$10.015

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100

$10.542

$10.015

$10.015

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Continental Prestige Electronics

USA . 5,390 parts In-Stock

1+ parts

$11.000

100+ parts

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$10.780

5,390

$11.000

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$10.780

Semicontronic

India . 906 parts In-Stock

1+ parts

$14.000

100+ parts

$13.650

1k+ parts

$13.580

10k+ parts

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906

$14.000

$13.650

$13.580

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AZTECH Wire

Italy . 895 parts In-Stock

1+ parts

$18.470

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895

$18.470

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Aztec Data Supply Inc.

USA . 253 parts In-Stock

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$78.100

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253

$78.100

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West Coast Incorporated

USA . 8,141 parts In-Stock

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8,141

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Lixinc

USA . 5,764 parts In-Stock

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5,764

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Eastek

USA . 4,000 parts In-Stock

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4,000

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Argo Parts USA

USA . 1,933 parts In-Stock

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1,933

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Overview

Experience the power of innovation with the DSPIC33EP512MU810T-I/PF by industry leader Microchip Technology. This cutting-edge Digital Signal Processor offers unparalleled quality and reliability, making it the ideal choice for a wide range of applications. From industrial automation to consumer electronics, this versatile product delivers exceptional performance and efficiency. Trust in Microchip Technology to provide you with the advanced technology you need to stay ahead of the curve. Elevate your projects with the DSPIC33EP512MU810T-I/PF and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and resistant to damage during handling and transportation.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, the product can operate efficiently without the risk of voltage spikes or overloading, ensuring a stable performance.

RAM Words: 53248

With a large RAM capacity of 53248 words, the product can handle complex data processing tasks efficiently, providing ample storage for data manipulation and calculations.

Maximum Clock Frequency: 60 MHz

A high maximum clock frequency of 60 MHz enables the product to execute instructions quickly, enhancing the overall processing speed and performance of the DSP.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

The product's design as a digital signal processor and controller allows it to effectively handle signal processing tasks and control functions, making it versatile and suitable for a range of applications.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP512MU810T-I/PF attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

15

No. of External Interrupts:

5

No. of Serial I/Os:

0

No. of Terminals:

100

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

53248

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

320 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Trade Compliance

DSPIC33EP512MU810T-I/PF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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