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OMAPL138BGWTMEP

Texas Instruments

OMAPL138BGWTMEP by Texas Instruments

OMAPL138BGWTMEP by Texas Instruments is a DSP with integrated cache and 8-bit on-chip data RAM. It features an address bus width of 23 bits, operates at a max clock frequency of 30 MHz, and is suitable for applications requiring low power consumption and high-speed processing.

Median Price

$58.300

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 12 parts In-Stock

1+ parts

$20.930

100+ parts

$20.730

1k+ parts

-

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12

$20.930

$20.730

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Verical

USA . 12 parts In-Stock

1+ parts

$40.390

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-

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12

$40.390

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Chip1Stop

Japan . 12 parts In-Stock

1+ parts

$58.300

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12

$58.300

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Texas Instruments

USA . 6,512 parts In-Stock

1+ parts

$86.880

100+ parts

$77.226

1k+ parts

$56.784

10k+ parts

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6,512

$86.880

$77.226

$56.784

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DigiKey

USA . 70 parts In-Stock

1+ parts

$131.450

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70

$131.450

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Distributors (In-Stock)

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Digiode

USA . 4,151 parts In-Stock

1+ parts

$38.370

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4,151

$38.370

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Nova Conductors

Japan . 10 parts In-Stock

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$75.120

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10

$75.120

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Vyrian

USA . 7,677 parts In-Stock

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7,677

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Component Sense

UK . 60 parts In-Stock

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60

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Cyclops Electronics Ltd

UK . 1 parts In-Stock

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1

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Distributors (Availability)

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Corohmni

South Africa . 2,687 parts In-Stock

1+ parts

$23.568

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$23.568

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Ampacity Inc.

Singapore . 921 parts In-Stock

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$34.330

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921

$34.330

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Corphita

USA . 4,203 parts In-Stock

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$36.351

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$36.351

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Parana Technologies

USA . 509 parts In-Stock

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$53.863

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509

$53.863

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DigiPath Technology Company

USA . 290 parts In-Stock

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$59.310

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290

$59.310

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IDEA Electronic Components Group

UK . 1,514 parts In-Stock

1+ parts

$60.520

100+ parts

$57.494

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$54.468

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1,514

$60.520

$57.494

$54.468

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ChromeModa Solutions

Germany . 1,151 parts In-Stock

1+ parts

$60.520

100+ parts

$49.626

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1,151

$60.520

$49.626

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Continental Prestige Electronics

USA . 1,513 parts In-Stock

1+ parts

$75.120

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$73.618

1,513

$75.120

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$73.618

Netroflash

USA . 50 parts In-Stock

1+ parts

$75.120

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$73.618

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50

$75.120

$73.618

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Argo Parts USA

USA . 3,784 parts In-Stock

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3,784

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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iodParts Technologies Inc.

India . 1,800 parts In-Stock

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Perfect Parts

USA . 656 parts In-Stock

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656

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Overview

Unleash the power of cutting-edge technology with the OMAPL138BGWTMEP by Texas Instruments. As a leader in digital signal processors, Texas Instruments guarantees top-quality performance and reliability in every product. The OMAPL138BGWTMEP is perfect for a wide range of applications, offering unparalleled speed and efficiency. Experience seamless operation and superior functionality with this advanced DSP. Invest in the OMAPL138BGWTMEP today and elevate your projects to new heights of success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for portable and rugged applications.

Integrated Cache: YES

Having an integrated cache helps in improving the processing speed and efficiency of the DSP, making it suitable for applications that require real-time signal processing.

Maximum Supply Voltage: 1.32 V

The maximum supply voltage of 1.32 V allows for efficient power utilization and can help in reducing power consumption in the system.

On Chip Data RAM Width: 8

Having a data RAM width of 8 allows for faster data processing and storage capabilities, making the DSP suitable for handling complex algorithms and large datasets.

Address Bus Width: 23

The wide address bus width of 23 enables the DSP to access a larger memory space, increasing its capabilities for handling advanced signal processing tasks.

Package Shape: SQUARE

The square package shape allows for easy integration into system designs and ensures efficient use of space, making it ideal for compact applications.

Power Supplies (V): 1.2,1.8/3.3

The availability of multiple power supply options provides flexibility in system design and operation, catering to various voltage requirements of different components.

No. of Terminals: 361

With a high number of terminals, the DSP offers a wide range of connectivity options, allowing for seamless integration into complex systems.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability in harsh environmental conditions, making the DSP suitable for military and industrial applications.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows the DSP to function in extreme cold environments without compromising performance, making it versatile for various applications.

Technical Specifications

Digital Signal Processors (DSPs) OMAPL138BGWTMEP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

23

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e0

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

80

No. of Terminals:

361

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.2,1.8/3.3

RAM Words:

8192

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Speed:

345 rpm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

16 mm

Peripheral IC Type:

Trade Compliance

OMAPL138BGWTMEP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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