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OMAP3503ECBB

Texas Instruments

OMAP3503ECBB by Texas Instruments

OMAP3503ECBB by Texas Instruments is a DSP with integrated cache and 32-bit on-chip data RAM. It operates at a max clock frequency of 59 MHz, suitable for applications requiring low power mode and floating-point format processing. With 515 terminals in a grid array package style, it offers high performance in compact designs.

Median Price

$36.056

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 16,988 parts In-Stock

1+ parts

$31.016

100+ parts

$27.570

1k+ parts

$20.272

10k+ parts

-

16,988

$31.016

$27.570

$20.272

-

Mouser Electronics

USA . 168 parts In-Stock

1+ parts

$50.130

100+ parts

$37.360

1k+ parts

$37.070

10k+ parts

-

168

$50.130

$37.360

$37.070

-

Rochester

USA . 2,969 parts In-Stock

1+ parts

-

100+ parts

$32.050

1k+ parts

$28.680

10k+ parts

$26.990

2,969

-

$32.050

$28.680

$26.990

DigiKey

USA . 2,969 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,969

-

-

-

-

Verical

USA . 1,008 parts In-Stock

1+ parts

-

100+ parts

$40.063

1k+ parts

$35.850

10k+ parts

$33.737

1,008

-

$40.063

$35.850

$33.737

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 58 parts In-Stock

1+ parts

$6.072

100+ parts

-

1k+ parts

-

10k+ parts

-

58

$6.072

-

-

-

Bristol Electronics

USA . 168 parts In-Stock

1+ parts

$26.755

100+ parts

$23.668

1k+ parts

$21.939

10k+ parts

-

168

$26.755

$23.668

$21.939

-

Vyrian

USA . 1,156 parts In-Stock

1+ parts

$29.290

100+ parts

-

1k+ parts

-

10k+ parts

-

1,156

$29.290

-

-

-

Digiode

USA . 1,301 parts In-Stock

1+ parts

$29.422

100+ parts

-

1k+ parts

-

10k+ parts

-

1,301

$29.422

-

-

-

ACDS - Activité Composants Distribution Service

France . 168 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

168

-

-

-

-

Dan-Mar Components

USA . 168 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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168

-

-

-

-

QIE Inc.

USA . 21 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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21

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,570 parts In-Stock

1+ parts

$27.873

100+ parts

-

1k+ parts

-

10k+ parts

-

2,570

$27.873

-

-

-

Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$36.643

100+ parts

$33.345

1k+ parts

$30.047

10k+ parts

-

200

$36.643

$33.345

$30.047

-

Parana Technologies

USA . 824 parts In-Stock

1+ parts

$45.758

100+ parts

$4,249.367

1k+ parts

$41.183

10k+ parts

-

824

$45.758

$4,249.367

$41.183

-

DigiPath Technology Company

USA . 1,235 parts In-Stock

1+ parts

$50.386

100+ parts

-

1k+ parts

-

10k+ parts

-

1,235

$50.386

-

-

-

IDEA Electronic Components Group

UK . 2,172 parts In-Stock

1+ parts

$51.414

100+ parts

$48.843

1k+ parts

$46.273

10k+ parts

-

2,172

$51.414

$48.843

$46.273

-

ChromeModa Solutions

Germany . 1,395 parts In-Stock

1+ parts

$51.414

100+ parts

$42.159

1k+ parts

-

10k+ parts

-

1,395

$51.414

$42.159

-

-

Corohmni

South Africa . 1,072 parts In-Stock

1+ parts

$58.856

100+ parts

-

1k+ parts

-

10k+ parts

-

1,072

$58.856

-

-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Perfect Parts

USA . 520 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

520

-

-

-

-

Overview

Unlock the power of cutting-edge technology with the OMAP3503ECBB by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers top-quality products that exceed industry standards. This versatile DSP offers integrated cache, low power mode, and a peak clock frequency of 59 MHz, making it ideal for a wide range of applications. From consumer electronics to industrial automation, the OMAP3503ECBB provides unmatched performance, reliability, and value to customers looking to stay ahead in today's fast-paced world. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and flexibility for the product, making it suitable for a variety of applications.

Integrated Cache: YES

Having an integrated cache improves processing efficiency by reducing the need to access external memory frequently, resulting in faster execution speeds.

Maximum Supply Voltage: 1.91 V

The higher maximum supply voltage allows for reliable operation and flexibility in power supply requirements.

Package Shape: SQUARE

The square package shape makes the product easy to integrate into various designs and layouts, saving space and enhancing design flexibility.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures ensures reliable performance even in challenging environmental conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

This specific peripheral IC type indicates a versatile and multifunctional DSP, capable of handling various signal processing tasks effectively.

Technology: CMOS

The CMOS technology offers low power consumption, high integration levels, and fast switching speeds, making it an energy-efficient and high-performance choice for DSP applications.

Technical Specifications

Digital Signal Processors (DSPs) OMAP3503ECBB attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

59 MHz

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B515

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of Terminals:

515

No. of Timers:

15

On Chip Data RAM Width:

32

On Chip Program ROM Width:

32

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA515,28X28,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,1.8,3.3

Qualification:

Not Qualified

RAM Words:

32768

ROM Programmability:

MROM

Maximum Seated Height:

.9 mm

Speed:

720 rpm

Sub-Category:

Graphics Processors

Maximum Supply Voltage:

1.91 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Trade Compliance

OMAP3503ECBB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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