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OMAP3503ECUS72

Texas Instruments

OMAP3503ECUS72 by Texas Instruments

OMAP3503ECUS72 by Texas Instruments is a DSP with 32-bit data RAM, 32768 RAM words, and 59 MHz clock frequency. It is used in digital signal processing applications requiring low power mode, featuring boundary scan and 423 terminals for high-speed performance.

Median Price

$37.219

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 730 parts In-Stock

1+ parts

$37.219

100+ parts

$33.083

1k+ parts

$24.326

10k+ parts

-

730

$37.219

$33.083

$24.326

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 255 parts In-Stock

1+ parts

$35.358

100+ parts

-

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255

$35.358

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Vyrian

USA . 4,535 parts In-Stock

1+ parts

-

100+ parts

-

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4,535

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 130 parts In-Stock

1+ parts

$9.100

100+ parts

-

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-

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130

$9.100

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Corphita

USA . 850 parts In-Stock

1+ parts

$33.497

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-

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850

$33.497

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Parana Technologies

USA . 684 parts In-Stock

1+ parts

$44.117

100+ parts

-

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684

$44.117

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DigiPath Technology Company

USA . 1,913 parts In-Stock

1+ parts

$48.579

100+ parts

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1,913

$48.579

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ChromeModa Solutions

Germany . 4,224 parts In-Stock

1+ parts

$49.570

100+ parts

$40.647

1k+ parts

-

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4,224

$49.570

$40.647

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IDEA Electronic Components Group

UK . 1,430 parts In-Stock

1+ parts

$49.570

100+ parts

$47.092

1k+ parts

$44.613

10k+ parts

-

1,430

$49.570

$47.092

$44.613

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Corohmni

South Africa . 3,021 parts In-Stock

1+ parts

$64.777

100+ parts

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3,021

$64.777

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Microchip USA

USA . 2,899 parts In-Stock

1+ parts

$81.940

100+ parts

$80.510

1k+ parts

$79.800

10k+ parts

$79.090

2,899

$81.940

$80.510

$79.800

$79.090

QUARKTWIN TECHNOLOGY LTD

USA . 19,675 parts In-Stock

1+ parts

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19,675

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Overview

Unlock the power of cutting-edge technology with the OMAP3503ECUS72 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers excellence in every aspect of their products. The OMAP3503ECUS72 offers integrated cache, high performance, and versatility, making it ideal for a wide range of applications. From enhancing audio quality to improving image processing, this DSP provides unmatched value and benefits for customers looking to elevate their projects to the next level. Trust Texas Instruments to deliver top-notch quality and innovation with the OMAP3503ECUS72.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the components inside, ensuring a longer lifespan for the product.

Integrated Cache: YES

Having an integrated cache improves the processing speed and efficiency of the DSP, making it suitable for complex signal processing tasks.

Maximum Supply Voltage: 1.91 V

Higher maximum supply voltage allows for better performance and stability under varying load conditions.

On Chip Data RAM Width: 32

Wide data RAM width enhances the processing capabilities of the DSP, enabling it to handle more data simultaneously.

Package Shape: SQUARE

Square package shape allows for easy mounting and space-saving design, making it ideal for compact electronic devices.

Power Supplies (V): 1.1, 1.8, 3.3

Having multiple power supply options allows flexibility in design and compatibility with different voltage requirements.

No. of Terminals: 423

A high number of terminals provide various connectivity options and interfaces, making it versatile for different applications.

Minimum Supply Voltage: 1.71 V

Lower minimum supply voltage ensures efficiency and energy savings, especially in low-power mode.

Maximum Operating Temperature: 90 °C

Wide operating temperature range allows the DSP to function reliably in various environments and conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures the DSP can perform even in extreme cold environments without reliability issues.

Technical Specifications

Digital Signal Processors (DSPs) OMAP3503ECUS72 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

59 MHz

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B423

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

32

No. of Terminals:

423

No. of Timers:

15

On Chip Data RAM Width:

32

On Chip Program ROM Width:

32

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA423,24X24,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,1.8,3.3

Qualification:

Not Qualified

RAM Words:

32768

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Speed:

720 rpm

Sub-Category:

Graphics Processors

Maximum Supply Voltage:

1.91 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16 mm

Peripheral IC Type:

Trade Compliance

OMAP3503ECUS72 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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