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OMAP5910JGVL2

Texas Instruments

OMAP5910JGVL2 by Texas Instruments

OMAP5910JGVL2 by Texas Instruments is a 16-bit DSP with integrated cache and 16-bit external data bus width. It operates at a max clock frequency of 13 MHz, suitable for industrial applications requiring low power consumption and fixed-point format processing. The package style is grid array, thin profile, fine pitch with a terminal pitch of 0.5 mm.

Median Price

$59.490

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 80 parts In-Stock

1+ parts

$37.323

100+ parts

$33.176

1k+ parts

$24.394

10k+ parts

-

80

$37.323

$33.176

$24.394

-

Mouser Electronics

USA . 1,430 parts In-Stock

1+ parts

$59.490

100+ parts

$42.900

1k+ parts

-

10k+ parts

-

1,430

$59.490

$42.900

-

-

DigiKey

USA . 160 parts In-Stock

1+ parts

$59.490

100+ parts

$46.490

1k+ parts

$42.895

10k+ parts

-

160

$59.490

$46.490

$42.895

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 606 parts In-Stock

1+ parts

$35.457

100+ parts

-

1k+ parts

-

10k+ parts

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606

$35.457

-

-

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Nova Conductors

Japan . 74 parts In-Stock

1+ parts

$42.440

100+ parts

-

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-

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74

$42.440

-

-

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Vyrian

USA . 8,396 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

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8,396

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 429 parts In-Stock

1+ parts

$6.202

100+ parts

-

1k+ parts

-

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429

$6.202

-

-

-

Corohmni

South Africa . 626 parts In-Stock

1+ parts

$18.425

100+ parts

-

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-

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626

$18.425

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-

-

Ampacity Inc.

Singapore . 55 parts In-Stock

1+ parts

$31.720

100+ parts

-

1k+ parts

-

10k+ parts

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55

$31.720

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-

-

Semicontronic

India . 3 parts In-Stock

1+ parts

$31.720

100+ parts

$30.927

1k+ parts

$30.768

10k+ parts

-

3

$31.720

$30.927

$30.768

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Corphita

USA . 544 parts In-Stock

1+ parts

$33.591

100+ parts

-

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-

10k+ parts

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544

$33.591

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-

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$41.591

100+ parts

-

1k+ parts

$39.928

10k+ parts

-

2,000

$41.591

-

$39.928

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Continental Prestige Electronics

USA . 1,739 parts In-Stock

1+ parts

$42.440

100+ parts

-

1k+ parts

-

10k+ parts

$41.591

1,739

$42.440

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-

$41.591

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$43.289

100+ parts

$43.289

1k+ parts

$43.289

10k+ parts

-

100

$43.289

$43.289

$43.289

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Parana Technologies

USA . 6 parts In-Stock

1+ parts

$55.407

100+ parts

-

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-

10k+ parts

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6

$55.407

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-

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DigiPath Technology Company

USA . 322 parts In-Stock

1+ parts

$61.010

100+ parts

$56.129

1k+ parts

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10k+ parts

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322

$61.010

$56.129

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ChromeModa Solutions

Germany . 6,236 parts In-Stock

1+ parts

$62.255

100+ parts

$51.049

1k+ parts

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6,236

$62.255

$51.049

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IDEA Electronic Components Group

UK . 1,155 parts In-Stock

1+ parts

$62.255

100+ parts

$59.142

1k+ parts

$56.030

10k+ parts

-

1,155

$62.255

$59.142

$56.030

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Argo Parts USA

USA . 1,145 parts In-Stock

1+ parts

-

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1,145

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1,000

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Overview

Experience the cutting-edge technology of the Texas Instruments OMAP5910JGVL2 Digital Signal Processor, designed to deliver superior performance and reliability in a variety of applications. Manufactured by a trusted industry leader, this product boasts integrated cache, multiple internal bus architecture, and low power mode for optimal efficiency. With a wide range of features and benefits, including a maximum clock frequency of 13 MHz and 16-bit on-chip data RAM width, the OMAP5910JGVL2 is perfect for industrial-grade projects requiring high-speed processing and advanced functionality. Upgrade your system with this top-of-the-line DSP and unlock endless possibilities for innovation and success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Integrated Cache: YES

Having an integrated cache improves the processing speed and efficiency of the DSP, making it suitable for handling complex signal processing tasks.

Maximum Supply Voltage: 1.675 V

The high maximum supply voltage allows for flexibility in power supply options, enabling the DSP to operate efficiently in different voltage environments.

Surface Mount: YES

Being surface mountable makes the installation of the DSP easier and allows for compact and space-saving designs in electronic devices.

Address Bus Width: 25

With a wide address bus width, the DSP can handle large amounts of memory efficiently, crucial for processing complex signals and data.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures that the DSP can function reliably even in demanding industrial environments with elevated temperatures.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enhances data transfer speeds and overall performance of the DSP, making it suitable for real-time signal processing applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

Being a mixed digital signal processor allows the DSP to handle both digital and analog signals efficiently, making it versatile for a wide range of signal processing tasks.

Technology: CMOS

The CMOS technology used in the DSP ensures low power consumption and high-speed operation, making it energy-efficient and suitable for battery-powered devices.

Technical Specifications

Digital Signal Processors (DSPs) OMAP5910JGVL2 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

25

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

13 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B289

JESD-609 Code:

e0

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

15

No. of Terminals:

289

No. of Timers:

7

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,21X21,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

RAM Words:

81920

ROM Programmability:

MROM

Maximum Seated Height:

1.2 mm

Speed:

192 rpm

Maximum Supply Voltage:

1.675 V

Minimum Supply Voltage:

1.525 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

12 mm

Peripheral IC Type:

Trade Compliance

OMAP5910JGVL2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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