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TMS320VC33PGE120

Texas Instruments

TMS320VC33PGE120 by Texas Instruments

TMS320VC33PGE120 by Texas Instruments is a 32-bit DSP with integrated cache, 32-bit external data bus width, and max clock frequency of 100 MHz. Ideal for digital signal processing applications requiring low power mode and barrel shifter functionality.

Median Price

$26.820

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 713 parts In-Stock

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$26.820

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$19.331

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$17.732

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$26.820

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$17.732

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Mouser Electronics

USA . 218 parts In-Stock

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$26.820

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$19.340

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$17.780

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$26.820

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$17.780

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Nova Conductors

Japan . 300 parts In-Stock

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$13.649

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Digiode

USA . 243 parts In-Stock

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$20.938

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Chip Stock

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ComSIT Distribution GmbH

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Vyrian

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Component Sense

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Holdelec - ElecDif-Pro

France . 8 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 8 parts In-Stock

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Euro-Tech

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Continental Prestige Electronics

USA . 6,800 parts In-Stock

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$13.649

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$13.376

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$13.649

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Netroflash

USA . 100 parts In-Stock

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$13.649

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$13.376

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$13.649

$13.376

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Ampacity Inc.

Singapore . 560 parts In-Stock

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$19.410

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Corphita

USA . 2,243 parts In-Stock

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$19.836

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Semicontronic

India . 380 parts In-Stock

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$19.860

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$19.364

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$19.264

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$19.860

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$19.264

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Microchip USA

USA . 462 parts In-Stock

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$40.220

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$39.640

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$39.360

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$39.070

462

$40.220

$39.640

$39.360

$39.070

Parana Technologies

USA . 883 parts In-Stock

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$59.072

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ChromeModa Solutions

Germany . 3,361 parts In-Stock

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$66.373

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$54.426

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IDEA Electronic Components Group

UK . 381 parts In-Stock

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$66.373

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$63.054

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$59.736

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$66.373

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$59.736

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Corohmni

South Africa . 1,005 parts In-Stock

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$85.777

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QUARKTWIN TECHNOLOGY LTD

USA . 16,648 parts In-Stock

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Perfect Parts

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Lixinc

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A-Z Elektronik GmbH

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Authorized Procurement Solutions

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S.R.D Solutions

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Argo Parts USA

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DigiPath Technology Company

USA . 1,793 parts In-Stock

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$59.842

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Metaverse IC Inc.

Canada . 436 parts In-Stock

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GreenTree Electronics

Israel . 240 parts In-Stock

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Resion (Excess)

USA . 180 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the TMS320VC33PGE120 by Texas Instruments. As a leader in digital signal processors (DSPs), Texas Instruments delivers top-notch quality and innovation in every product. The TMS320VC33PGE120 offers customers unmatched value and benefits, providing superior performance and reliability for a wide range of applications. Experience the advantage of advanced features and seamless integration in a compact and efficient package. Upgrade your projects with the TMS320VC33PGE120 and take your work to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material that is cost-effective for mass production.

Integrated Cache: YES

Enhances the processing speed and efficiency by storing frequently accessed data.

Maximum Supply Voltage: 1.89 V

Provides flexibility in power supply options while ensuring safe operation.

On Chip Data RAM Width: 32

Allows for fast data access and manipulation within the processor.

Address Bus Width: 24

Enables efficient communication with external components and memory devices.

Bit Size: 32

Suitable for handling complex mathematical operations and algorithms efficiently.

No. of Terminals: 144

Offers ample connectivity options for interfacing with various peripherals and devices.

Minimum Supply Voltage: 1.71 V

Ensures stable operation even at lower power supply levels for energy efficiency.

Maximum Operating Temperature: 90 °C

Allows for reliable operation in harsh environmental conditions without overheating.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Specifically designed for processing digital signals efficiently with additional functionalities.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC33PGE120 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

1

No. of External Interrupts:

4

No. of Terminals:

144

No. of Timers:

2

On Chip Data RAM Width:

32

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

34816

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMS320VC33PGE120 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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