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PIC24EP512GP806-E/MR

Microchip Technology

PIC24EP512GP806-E/MR by Microchip Technology

PIC24EP512GP806-E/MR by Microchip Technology is a 16-bit DSP with 60 MHz clock frequency, 53248 RAM words, and 320 mA max supply current. Ideal for automotive applications, it features 9 timers, 15 DMA channels, and operates in low power mode. With a temperature range of -40 to 125 °C, this chip offers FLASH ROM programmability and boundary scan capability.

Median Price

$11.200

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

RS (Exports)

UK . 79 parts In-Stock

1+ parts

$7.120

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$7.120

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Mouser Electronics

USA . 81 parts In-Stock

1+ parts

$11.200

100+ parts

$10.280

1k+ parts

$9.290

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81

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$9.290

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Microchip Technology

USA . 80 parts In-Stock

1+ parts

$11.200

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$9.290

1k+ parts

$8.550

10k+ parts

$8.130

80

$11.200

$9.290

$8.550

$8.130

RS Americas

USA . 479 parts In-Stock

1+ parts

$23.130

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479

$23.130

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Distributors (In-Stock)

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Nova Conductors

Japan . 39 parts In-Stock

1+ parts

$10.670

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39

$10.670

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NAC Semi

USA . 80 parts In-Stock

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$11.600

100+ parts

$10.520

1k+ parts

$9.620

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80

$11.600

$10.520

$9.620

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Vyrian

USA . 7,219 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 199 parts In-Stock

1+ parts

$10.030

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199

$10.030

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Aranea Global

USA . 100 parts In-Stock

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$10.457

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$10.038

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100

$10.457

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$10.038

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Continental Prestige Electronics

USA . 3,162 parts In-Stock

1+ parts

$10.670

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$10.457

3,162

$10.670

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$10.457

AZTECH Wire

Italy . 917 parts In-Stock

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$12.770

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917

$12.770

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Semicontronic

India . 40 parts In-Stock

1+ parts

$20.720

100+ parts

$20.202

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$20.098

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40

$20.720

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$20.098

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Allen Electronics Distributors

USA . 479 parts In-Stock

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$23.130

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479

$23.130

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Aztec Data Supply Inc.

USA . 1,727 parts In-Stock

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$74.290

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1,727

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Lixinc

USA . 7,781 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 5,478 parts In-Stock

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RGB Technical Solutions

Ukraine . 4,027 parts In-Stock

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Argo Parts USA

USA . 1,841 parts In-Stock

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Overview

Unlock the power of advanced digital signal processing with the PIC24EP512GP806-E/MR by Microchip Technology. Designed for high-performance applications, this chip offers unparalleled reliability and efficiency. From automotive to industrial automation, this DSP caters to a wide range of industries. With a maximum clock frequency of 60 MHz and low power mode, customers can enjoy optimal performance without compromising energy consumption. Trust in Microchip's expertise and elevate your projects with the PIC24EP512GP806-E/MR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package makes the product lightweight and durable, ideal for portable devices and industrial applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost in production.

Maximum Supply Voltage: 3.6 V

A high maximum supply voltage allows for versatility in powering the device and accommodating different voltage requirements.

RAM Words: 53248

Large amount of on-chip data RAM allows for efficient data processing and storage, enhancing the performance of the DSP.

ROM Programmability: FLASH

ROM programmability with flash memory enables flexibility in programming and updating the device's software, ensuring adaptability to changing requirements.

Technical Specifications

Digital Signal Processors (DSPs) PIC24EP512GP806-E/MR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

15

No. of External Interrupts:

5

No. of Serial I/Os:

0

No. of Terminals:

64

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Words:

53248

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Maximum Supply Current:

320 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Trade Compliance

PIC24EP512GP806-E/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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