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DSPIC33EP32MC502-E/SS

Microchip Technology

DSPIC33EP32MC502-E/SS by Microchip Technology

DSPIC33EP32MC502-E/SS by Microchip Technology is a 16-bit digital signal processor with 4096 RAM words, operating at up to 60 MHz. Ideal for automotive applications, it features a max supply voltage of 3.6V and low power mode support. With 5 timers and 4 DMA channels, this CMOS technology-based controller offers high performance in a small outline package.

Median Price

$2.660

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 1,587 parts In-Stock

1+ parts

$2.660

100+ parts

$2.190

1k+ parts

$2.000

10k+ parts

$1.920

1,587

$2.660

$2.190

$2.000

$1.920

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$2.330

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$2.330

-

-

-

NAC Semi

USA . 1,316 parts In-Stock

1+ parts

$3.050

100+ parts

$2.750

1k+ parts

$2.470

10k+ parts

-

1,316

$3.050

$2.750

$2.470

-

Vyrian

USA . 10,315 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,315

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,236 parts In-Stock

1+ parts

$2.260

100+ parts

-

1k+ parts

-

10k+ parts

-

1,236

$2.260

-

-

-

Argo Parts USA

USA . 1,976 parts In-Stock

1+ parts

$2.330

100+ parts

-

1k+ parts

-

10k+ parts

-

1,976

$2.330

-

-

-

Continental Prestige Electronics

USA . 283 parts In-Stock

1+ parts

$2.330

100+ parts

-

1k+ parts

-

10k+ parts

$2.283

283

$2.330

-

-

$2.283

Netroflash

USA . 100 parts In-Stock

1+ parts

$2.330

100+ parts

-

1k+ parts

$2.213

10k+ parts

$2.167

100

$2.330

-

$2.213

$2.167

Microchip USA

USA . 2,658 parts In-Stock

1+ parts

$15.288

100+ parts

-

1k+ parts

-

10k+ parts

-

2,658

$15.288

-

-

-

AZTECH Wire

Italy . 857 parts In-Stock

1+ parts

$18.430

100+ parts

-

1k+ parts

-

10k+ parts

-

857

$18.430

-

-

-

Lixinc

USA . 13,868 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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13,868

-

-

-

-

Fulton Briggs Corp.

USA . 6,370 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,370

-

-

-

-

GreenTree Electronics

Israel . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

50

-

-

-

-

Authorized Procurement Solutions

USA . 16 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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16

-

-

-

-

Overview

Unleash the power of cutting-edge technology with the Microchip Technology DSPIC33EP32MC502-E/SS Digital Signal Processor. Designed for high performance and reliability, this product offers unparalleled value to customers in various applications. With its top-notch quality and advanced features, this DSP sets itself apart in the market, providing benefits such as efficient processing speed, low power consumption, and a wide range of peripherals. Elevate your projects to the next level with the Microchip Technology DSPIC33EP32MC502-E/SS - the ultimate choice for digital signal processing needs.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides durability and protection for the DSP.

Surface Mount

YES - Allows for easy and convenient installation on circuit boards.

Maximum Supply Voltage

3.6 V - Ensures compatibility with a wide range of power sources.

On Chip Data RAM Width

8 - Provides ample storage for processing data efficiently.

Screening Level

TS 16949 - Indicates high quality and reliability standards.

Package Shape

RECTANGULAR - Allows for compact and efficient placement in electronic systems.

Bit Size

16 - Offers high processing power and accuracy for digital signal processing tasks.

Power Supplies (V)

3.3 - Efficiently utilizes power while maintaining performance.

No. of Terminals

28 - Provides ample connectivity options for interfacing with other components.

Package Style (Meter)

SMALL OUTLINE, SHRINK PITCH - Saves space on the circuit board and improves airflow.

Minimum Supply Voltage

3 V - Ensures stable operation even with lower power sources.

Maximum Operating Temperature

125 °C - Allows for use in a wide range of environmental conditions.

No. of External Interrupts

3 - Facilitates real-time response to external events.

Minimum Operating Temperature

40 °C - Can operate in extreme temperatures without performance issues.

Terminal Finish

MATTE TIN - Ensures reliable and durable connections with other components.

Terminal Position

DUAL - Enhances stability and reliability of the DSP during operation.

Maximum Seated Height

2 mm - Contributes to a low-profile design for space-constrained applications.

RAM Words

4096 - Sufficient memory for storing and processing data efficiently.

Width

5.3 mm - Compact size for easy integration into electronic systems.

Boundary Scan

YES - Simplifies debugging and testing of the DSP during development.

Maximum Clock Frequency

60 MHz - Offers high-speed processing capabilities for complex algorithms.

Maximum Time At Peak Reflow Temperature (s)

40 - Ensures proper soldering during assembly without damaging the DSP.

Peak Reflow Temperature °C

260 - Supports reliable solder joints to withstand harsh conditions.

Length

10.2 mm - Compact form factor for easy installation in tight spaces.

Temperature Grade

AUTOMOTIVE - Designed to withstand temperature variations commonly found in automotive applications.

Peripheral IC Type

DIGITAL SIGNAL PROCESSOR, CONTROLLER - Versatile functionality for various signal processing tasks.

No. of Timers

5 - Provides timing and scheduling capabilities for different operations.

Technology

CMOS - Offers low power consumption and high speed for efficient operation.

Terminal Form

GULL WING - Facilitates easy and secure soldering onto the circuit board.

Maximum Supply Current

55 mA - Efficient power usage for extended operation in battery-powered devices.

Nominal Supply Voltage

3.3 V - Standard voltage requirement for compatibility with common power sources.

No. of DMA Channels

4 - Enables efficient data transfer and processing between different devices.

ROM Programmability

FLASH - Allows for easy and quick updates to the ROM firmware.

Terminal Pitch

0.65 mm - Provides adequate spacing for optimal soldering during assembly.

Format

FIXED POINT - Suitable for processing fixed-point arithmetic operations efficiently.

Moisture Sensitivity Level (MSL)

2 - Indicates the level of protection against moisture for long-term reliability.

Low Power Mode

YES - Offers energy-saving features for prolonged battery life in portable devices.

On Chip Program ROM Width

8 - Sufficient space for storing program instructions for efficient processing.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP32MC502-E/SS attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

10.2 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of Terminals:

28

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

4096

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5.3 mm

Trade Compliance

DSPIC33EP32MC502-E/SS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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